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http://dx.doi.org/10.12656/jksht.2019.32.2.79

Growth of Intermetallic Compounds by Heat Treatment at Interface of Friction Welded Al-Cu System  

Kim, Ki-Young (Asan Friction Welding Co., Ltd)
Choi, In-Chul (School of Materials Science and Engineering, Kumoh National Institute of Technology)
ITO, Kazuhiro (Joining & Welding Research Institute)
Oh, Myung-Hoon (School of Materials Science and Engineering, Kumoh National Institute of Technology)
Publication Information
Journal of the Korean Society for Heat Treatment / v.32, no.2, 2019 , pp. 79-85 More about this Journal
Abstract
To investigate the influence of heat treatment on the growth intermetallic compounds (IMCs) at the joint interface of friction-welded Cu-Al, several heat treatments are performed at three different temperature with different times. The experiments reveal three different IMCs layers which are significantly influenced by atomic diffusion of Cu and Al with heat treatment conditions. Since the formation of these IMCs layers can affect mechanical properties of friction-welded Cu-Al interfaces, the relationship between the microstructure of IMCs layers and the tensile strength is analyzed according to heat treatment temperature and times.
Keywords
Cu-Al; Intermetallic compounds; Friction welding; Heat treatment;
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