• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.305-305
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• 2011

표면 플라즈몬 공진(SPR) 현상을 이용한 광섬유 센서는 SPR 센서의 우수한 표면 민감도, 비표지 검출능 등의 특징은 유지하면서 측정시스템이 단순해지고 저렴하게 제작이 가능하며 원거리 검출에 유리하다는 장점으로 많은 연구가 진행되고 있다. 최근 스택 제어가 용이하고 민감도 또한 우수하다는 이유로 측면 연마형 센서 구조를 적용한 연구가 많이 이루어지고 있다. 본 연구에서는 기존 Kretchman형태의 SPR 센서의 분해능 향상을 위해 사용된 광도파로 구조를 측면 연마형 광파이버에 적용시켰다. 금속 층 / 유전체 층 / 금속 층으로 구성되어 있는 광도파로 구조와 Au 단일 층을 사용한 기존 구조에 대한 이론 전사모사를 진행하고 실물 소자를 제작하여 특성을 평가하였다. WCSPR 센서에서는 두 개의 반사율 dips이 나타난다. 하나는 단파장영역에서 나타나는 폭이 작은 형태이며 또 다른 하나는 장파장영역에서 나타나는 폭이 넓은 형태이다. 단파장에서의 dip은 입사각에 크게 영향을 받지 않기 때문에 Wavelength interrogation mode을 이용하는 광섬유 SPR센서에 적용할 경우 분해능이 향상될 것 이다. WCSPR 센서는 도파로의 유전체층에서 진행되는 모드를 이용하면 Self-referencing을 할 수 있다, 또한 유전체 층의 두께를 변화 시켜 중심파장의 위치를 조절할 수 있는 특징을 갖고 있다. 결과적으로 광도파로 구조를 광파이버에 적용시켜 기존 Au 단일 층 구조의 SPR 센서에 비해 좀 더 정확하고 광범위한 감지를 할 수 있다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.6
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• pp.1401-1406
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• 2014

Knowledge of the manufacturing process of semiconductor devices in order to obtain a copper pattern using chemical mechanical polishing (CMP) planarization using a Wafer polishing process is applied with a thickness of the copper measured in real time, which need to be precisely controlled by, where the acquisition the actual thickness of the sensor value with the calculated value in terms of error can occur in the process. Approximated the actual measurement values so as to obtain a method using a simple average, moving average, compared to the results using filters onggo Strom real-time measurements of the thickness of the units of the control system to reduce the variation in the implementation of the method described for the.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• Journal of Dental Rehabilitation and Applied Science
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• v.30 no.2
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• pp.131-137
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• 2014

Purpose: This study examined the efficiency and wear of periodontal instrument sharpening using aluminum oxide stones with different levels of roughness. Materials and Methods: Thirty new No. 9-10 Gracey curets were used in this study. All curets had become dull after scaling and root planing. After similar blunting, the instruments were divided randomly into three groups (240, 600, 800 grit) containing 10 curets each. The stones were applied correctly to the lateral surface of each curet to maintain the $70-80^{\circ}$ angle. After resharpening, sharpness of the curets was examined by an optical microscope. After 20, 40, 60, and 80 strokes, the wear was measured at 1 mm and 2 mm from the tip of the cutting edge using a digital caliper. The data was analyzed statistically using analysis of variance (ANOVA) with repeated measures, 2-way ANOVA, and a Fisher's exact test. Results: The degree of sharpness increased significantly (P < 0.001) as the number of sharpening strokes grew for all stones. A comparison of the degree of sharpness on the same number of strokes showed that the 240 grit group significantly excelled the other groups on 5 and 10 strokes, respectively (P < 0.001). The mean wear showed no statistically significant difference among the groups (P > 0.05). Conclusion: The efficiency of Gracey curet resharpening was enhanced with more coarse stones, though we should consider the wear of the instrument during resharpening.

• Journal of Korean Tunnelling and Underground Space Association
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• v.24 no.2
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• pp.153-170
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• 2022

Waterjet has been comprehensively used in urban areas owing to a suitable technique for cutting concrete and rock, and low noise and vibration. Recently, the abrasive waterjet technique has been adopted and applied by the Korea Atomic Energy Research Institute to demolish concrete plugging without disturbing and damaging In-situ Demonstration of Engineered Barrier System in the disposal research tunnel. In this study, the use of abrasive waterjet in the tunnel was evaluated for practical applicability and the existing cutting model was compared with the experimental results. As a variable for waterjet cutting, multi-cutting, water flow rate, abrasive flow rate, and standoff distance were selected for the diversity of analysis. As regarding the practical application, the waterjet facilitated path selection for cutting the concrete plugging and prevented additional disturbances in the periphery. The pump's noise at idling was 64.9 dB which is satisfied with the noise regulatory standard, but it exceeded the standard at ejection to air and target concrete because the experiment was performed in the tunnel space. The experimental result showed that the error between the predicted and measured cutting volume was 12~13% for the first cut and 16% for second cut. The standoff distance had a significant influence on the cutting depth and width, and the error tended to decrease with decrement of standoff distance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.1620-1625
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• 2015

In this study, a variety of industrial gears, shafts, chains, rollers, mold, etc. are widely used inautomotive steel carbon steel for machine structural SM45C typical material used for the experiments. In order to cure the surface of the test piece after the rough grinding and fine grinding was performed in order polishing. Perform the surface hardening of SM45C lacal area by using a diode laser. The output of the laser diode and the feed rate to the process variable. Micro-hardness testing, microstructure testing, scanning electron microscope testing(SEM), the heat input to the analysis. After analyzing the experiment to compare the mechanical properties of the material. When using a diode laser to assess the soundness of the surface hardening. Accordingly, the process for deriving the optimum demonstrate the feasibility.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.569-573
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• 2012

We investigated the speed change of the diamond spherical abrasive during the substrate surface polishing under the pad compression by using classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. As the compressive pressure increased, the indented depth of the diamond abrasive increased and then, the speed of the diamond abrasive along the direction of the pad moving was decreased. Molecular simulation result such as the abrasive speed decreasing due to the pad pressure increasing gave important information for the chemical mechanical polishing including the mechanical removal rate with both the pad speed and the pad compressive pressure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.15 no.4
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• pp.278-285
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• 1990

It is well know that optical oupler that is composed of the polished single-mode optical fiber can separate two arbitrary wave lengths. Wavelength division ranges of the WDM optical coupler that is made of the bending fiber with radius R vary with the center wavelength of the signal and spacing between two cores. In this paper, when optical fiber is fixed with the radius R, We proposed the spacing between two cores that can provide minimum division range. Also, We proposed the minimum radius R necessary to separate two arbitary wavelengths of the signal.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.