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http://dx.doi.org/10.4313/JKEM.2012.25.7.569

Molecular Dynamics Simulations Study on Abrasive's Speed Change Under Pad Compression  

Lee, Gyoo-Yeong (School of Electronic, Information & Communication Engineering, Kangwon National University)
Lee, Jun-Ha (Department of Computer System Engineering, Sangmyung University)
Kim, Tae-Eun (Department of Multimedia, Namseoul University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.25, no.7, 2012 , pp. 569-573 More about this Journal
Abstract
We investigated the speed change of the diamond spherical abrasive during the substrate surface polishing under the pad compression by using classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. As the compressive pressure increased, the indented depth of the diamond abrasive increased and then, the speed of the diamond abrasive along the direction of the pad moving was decreased. Molecular simulation result such as the abrasive speed decreasing due to the pad pressure increasing gave important information for the chemical mechanical polishing including the mechanical removal rate with both the pad speed and the pad compressive pressure.
Keywords
Chemical mechanical polishing; Molecular dynamics; Semiconductor processes;
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  • Reference
1 K. Singh and R. Bajaj, MRS Bulletin, 27, 743 (2002).   DOI
2 K. Singh, S. M. Lee, K. S. Choi, G. B. Basim, W. Choi, Z. Chen, and B. M. Moudgil, MRS Bulletin, 27, 752 (2002).   DOI
3 Bajaj, A. Zutshi, R. Surana, M. Naik, and T. Pan, MRS Bulletin, 27, 776 (2002).   DOI
4 Evans, MRS Bulletin, 27, 779 (2002).   DOI
5 K. J. Lee, S. Y. Kim, and Y. J. Seo, J. KIEEME, 15, 939 (2002).
6 C. B. Kim, S. Y. Kim, and Y. J. Seo, J. KIEEME, 15, 832 (2002).
7 C. J. Park, S. Y. Kim, and Y. J. Seo, J. KIEEME, 15, 39 (2002).
8 F. Preston, J. Soc. Glass Technol., 11, 214 (1927).
9 W. T. Tseng and Y. L. Wang, J. Electrochem. Soc., 144, L15 (1997).   DOI
10 F. G. Shi and B. Zhao, Appl. Phys. A67, 249 (1998).
11 M. P. Allen and D. J. Tildesley, Computer Simulation of Liquids (Oxford University Press, 1987) p. 71.
12 J. W. Kang and Y. G. Choi, J. Semicond. Display Tech., 10, 49 (2011).
13 B. H. Park and J. W. Kang, J. Semicond. Display Tech., 10, 47 (2011).