• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.1585-1593
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• 2015

3D-structured (embossed) aluminum sheets have been used in the heat insulation purpose for automative exhaust parts because of increasing their surface areas and stiffness reinforcement imposed in making the embossing pattern. However, there are many restrictions in press forming of the embossed sheet compared with the flat sheet (non-embossed one) because of its difference in the mechanical properties and the geometrical 3-dimensional shape. In this paper we investigated the deformation characteristic of embossed aluminum sheet in the incremental sheet forming process which has frequently used in the design verification and the trial manufacturing of sheet products. The single point incremental forming (SPIF) experiments for the rectangular cone forming using the CNC machine with a chemical wood-machined die and a circular tool shape showed that the formability of the embossed sheet are better than that of the flat sheet in view of the maximum angle of cone forming. This comes from the fact that the embossed sheet between the tool and the elastic die wall is plastically compressed and the flatted area contributes to increase the plastic deformation. Also the tool path along the outward movement from the center showed a better formability than that of the inward movement from the edge. However the surface quality for the tool path along the outward movement evaluated from the surface deflection is inferior than that of the tool path along the inward movement.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.238-238
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• 2005

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1045-1050
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• 2011

This study proposed the new pressing method under heat for the plastic automotive interior part in order to make embossing on the skin of the raw material of the part. The raw material is laid on the lower mold and it is pressed by the upper one with embossing shape. The air is suctioned from the inside of both molds for producing tension and making embossing shapes on the skin of the part without its breakage. The corresponding molds and test machines are made and the proposed manufacturing process is validated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.117-118
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• 2008

• Proceedings of the Optical Society of Korea Conference
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• 2006.07a
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• pp.491-492
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1025-1029
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• 2003

We studied the cross-sectional profiles of deformed thermoplastics in hot embossing process and compared with melt flow index for various embossing conditions such as embossing temperature, embossing pressure and initial thickness of the thermoplastics. The fastest embossing times for complete penetration of the cavities were obtained at temperature greater than $60^{\circ}C$ above glass transition temperature (Tg). When the melt flow index of polymer is low, the penetration ratio does not become large even if the embossing pressure increases. The complete occupation of the cavities was easier obtained with high melt flow index polymer than low melt flow index polymer at the same process condition. We believe these results can be very useful for optimizing nanostructured hot embossing also known nanoimprinting process conditions.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.168-174
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• 2007

A ceramic glass mold was developed for micro hot-embossing and replicated polymer parts are fabricated. The glass-ceramic micro mold could be fabricated with a laser process and a wet etching process and the fabrication time could be saved a lot. Various polymer micro structures can be obtained by hot-embossing. The process parameters such as ho-embossing temperatures or pressures were investigated and optimized. This process can be applied for fabrication of micro structures for flip-chips or micro fluidic channels for bio-engineering. The advantages and disadvantages of this process are discussed, too.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.7 s.250
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• pp.773-778
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• 2006

High-aspect-ratio nano-hair or nano-pillar arrays have great potential in a variety of applications. In this study, we present a simple and cost-effective replication method of high-aspect-ratio polymer nano-hair arrays. Highly ordered nano-porous AAO (anodic aluminum oxide) template was utilized as a reusable nano-mold insert. The AAO nano-mold insert fabricated by the two-step anodization process in this study had close- packed straight nano-pores, which enabled us to replicate densely arranged nano-hairs. The diameter, depth and pore spacing of the nano-pores in the fabricated AAO nano-mold insert were about 200nm, $1{\mu}m$ and 450nm, respectively. For the replication of polymer nano-hair arrays, a UV nano embossing process was applied as a mass production method. The UV nano embossing machine was developed by our group for the purpose of replicating nano-structures by means of non-transparent nano-mold inserts. Densely arranged high-aspect-ratio nano-hair arrays have been successfully manufactured by means of the UV nano embossing process with the AAO nano-mold insert under the optimum processing condition.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.1-7
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• 2015

In the present study, copper micromolds with a microhole array were precisely manufactured by a synchrotron LIGA process. Like in the traditional LIGA process, a deep X-ray lithography based on a synchrotron radiation was employed as the first manufacturing step. Due to the excellent optical performance of the synchrotron X-ray used, cylindrical micropillar arrays with high aspect ratio could be efficiently obtained. The fabricated microfeatures were then used as a master of the subsequent copper electroforming process, thereby resulting in copper micromolds with a microhole array. Thermoplastic hot embossing experiments with the copper micromolds were carried out for imprinting cylindrical microfeatures onto a polystyrene sheet. Through the hot embossing, the effect of embossing temperature and usefulness of the present manufacturing method could be verified.