• Title/Summary/Keyword: 에폭시 접합

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LED Die Bonder Inspection System Using Integrated Machine Visions (Integrated Machine Vision을 이용한 LED Die Bonder 검사시스템)

  • Cho, Yong-Kyu;Ha, Seok-Jae;Kim, Jong-Su;Cho, Myeong-Woo;Choi, Won-Ho
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.6
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    • pp.2624-2630
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    • 2013
  • In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

A Study on the Thermo-mechanical Characteristics and Adhesion Reliability of Anisotropic Conductive Films Depend on the Curing Methods of Epoxy Resins (에폭시 레진의 경화방법에 따른 이방성 전도필름의 접합신뢰성 및 열적기계적 특성 변화)

  • Gil, Man-Seok;Seo, Kyoung-Won;Kim, Jae-Han;Lee, Jong-Won;Jang, Eun-Hee;Jeong, Do-Yeon;Kim, Su-Ja;Kim, Jeong-Soo
    • Polymer(Korea)
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    • v.34 no.3
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    • pp.191-197
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    • 2010
  • To improve the curing method of anisotropic conductive film (ACF) at low temperature, it was studied to replace the thermal latent curing agent of imidazole compounds by the curing agent of cationically initiating type. Thermo-mechanical properties such as glass transition temperature, storage modulus, and coefficient of thermal expansion were investigated for the analysis of curing behavior. The reliability of ACF were observed in thermal cycle and high temperature-high humidity test. ACF using cationic initiator showed faster curing, lower CTE, and higher $T_g$ than the case of using imidazole curing agent, which is important for the high temperature stability. Furthermore, ACF using cationic initiator maintained a stable contact resistance in reliability test, although it was cured at low temperature and fast rate. With these results, it was confirmed that the curing method of epoxy had great effect on thermo-mechanical properties and reliability of ACF.

Interfacial and Mechanical properties of Different Heat Treated Wood and Evaluation of Bonding Property between Stone and Wood for Rock Bed (열처리 조건에 따른 목재의 계면과 기계적 물성 및 돌침대용 석재/목재간 접착제에 따른 접착력 평가)

  • Kwon, Dong-Jun;Shin, Pyeong-Su;Choi, Jin-Yeong;Moon, Sun-Ok;Park, Joung-Man
    • Journal of Adhesion and Interface
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    • v.16 no.2
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    • pp.69-75
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    • 2015
  • Stone board for the rock bed was needed to reduce weight using thin thickness and reinforced materials. In this work, stone/wood board for rock bed was studied. Stone and wood were attached to reduce total weight of stone for rock bed. For reinforcing wood heat treatment method was used to change surface and mechanical properties. Mechanical strength of heat treated wood increased more than neat condition. The optimum heat treatment condition was set on $100^{\circ}C$ under tensile, flexural loads whereas surface energy was also obtained by contact angle measurement. Optimum adhesive condition was to get the maximum adhesion between stone and wood. Lap shear test was performed for stone/wood board with different adhesives such as amine type epoxy, polyurethane, chloro-rubber and vinyl chloride acetate type. Fracture surface of lap shear test was shown at wood fracture part on stone using amine type epoxy adhesive. It was found that for high adhesion between stone and wood the optimum adhesive was epoxy type for the rock bed.

Study on the Development and Property of Epoxy Putty with Excellent Low Shrinkage and Cutting Force Using Mercaptan Type and Diamine Type (Mercaptan계와 Diamine계를 이용한 저수축·절삭력이 우수한 Epoxy Putty의 개발 및 물성에 관한 연구)

  • Oh, Seung-Jun;Wi, Koang-Chul
    • Journal of Adhesion and Interface
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    • v.16 no.4
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    • pp.137-145
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    • 2015
  • This study aimed to develop epoxy putty as a multi-purpose connection and restoration material that can be used for material-specific restoration work such as metal, wood, ceramics, earthenware and stone artifacts by replacing synthetic resins currently being used for preservation treatment of cultural assets. Existing synthetic resins have the issue of cutting force resulting from high strength, deflection resulting from long hardening time, contaminating the surface of artifacts through staining on tools or gloves and need for re-treatment resulting from material discoloration. Accordingly, paste type restoration material most widely being used in the field of cultural assets preservation treatment was selected and examined the property to select it as an object of comparison. Based on such process, epoxy putty was developed according to the kind of agent, hardener and filler. For the purpose of solving the issues of existing material and allowing the epoxy putty developed to have similar property, property experiments were conducted by selecting agents and hardeners with different characteristics and conditions. The study findings showed that both kinds are paste type that improved work convenience and deflection issue as a result of their work time of within 5~10 minutes that are about 3~10 times shorter than that of existing material. In regards to wear rate for increasing cutting force, it improved by about 3 times, thereby allowing easy molding. For the purpose of improving the issue of surface contamination that occurs during work process, talc and micro-ballon were added as filler to reduce the issue of stickiness and staining on hand. Furthermore, a multi-purpose restoration material with low shrinkage, low discoloration and high cutting force was developed with excellent coloring, lightweight and cutting force features.

The Effect of Nano Functionalized Block Copolymer Addition on the Joint Strength of Structural Epoxy Adhesive for Car Body Assembly (차체 구조용 에폭시 접착제의 접합강도에 미치는 나노 기능성 블록공중합체 첨가의 영향)

  • Lee, Hye-rim;Lee, So-jeong;Lim, Chang-young;Seo, Jong-dock;Kim, Mok-soon;Kim, Jun-ki
    • Journal of Welding and Joining
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    • v.33 no.4
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    • pp.44-49
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    • 2015
  • The structural epoxy adhesive used in car body assembly needs the highest level of joint mechanical strength under lap shear, T-peel and impact peel conditions. In this study, the effect of nano functionalized block copolymer addition on the impact peel strength of epoxy adhesive was investigated. DSC analysis showed that the addition of nano functionalized block copolymer did not affect the curing reaction of epoxy adhesive. From single lap shear test, it was found out that the addition of nano functionalized block copolymer slightly decreased the cohesive strength of cured adhesive layer. The addition of nano functionalized block copolymer showed beneficial effect on T-peel strength by changing the adhesive failure mode to the mixed mode. However, the addition of nano functionalized block copolymer just decreased the room temperature impact peel strength. It was considered that the addition of nano functionalized block copolymer could have effect on disturbing the crack propagation only for the case of slow strain rate.

A study on chemical bonding characteristics of the interface between curved FRP panels for consecutive structural assembly (곡면 FRP 패널 부재 연속시공을 위한 연결부 화학적 접합 특성에 관한 연구)

  • Lee, Gyu-Phil;Shin, Hyu-Soung;Jung, Woo-Tai
    • Journal of Korean Tunnelling and Underground Space Association
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    • v.14 no.1
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    • pp.79-91
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    • 2012
  • A curved fiber reinforced polymer (FRP) panel is produced with a certain width depending on allowances of manufacturing processes and facilities. An targeted arch-shaped structure could be built by sequential connection of series of the FRP panels. The connection manner between the FRP panels could be given by chemical treatment, mechanical treatment and hybrid method. Among those, the connection between the panels by chemical treatment is commonly adopted. Therefore, For an optimized design of the connected part between FRP pannels, a number of direct shear tests have been undertaken in terms of a number of parameters: surface treatment conditions, bonding materials, etc.. As results, surface grinding condition by sand paper or surface treatment by sand blasting appear properly acceptable methods, and epoxy and acryl resins are shown to be effective bonding materials for the purpose in this study.

Binding of Zeolites to Inorganic Fiber using Covalent Linkers (공유결합을 이용한 무기질 섬유와 제올라이트의 결합)

  • Song, Kyeong-Keun;Yoo, Yoon-Jong;Kim, Hong-Soo;Ha, Kwang
    • Korean Chemical Engineering Research
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    • v.44 no.3
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    • pp.254-258
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    • 2006
  • Zeolites with excellent adsorption capacity of volatile organic compounds were attached onto inorganic fibers which were the raw materials of honeycomb-type adsorbers. The amounts of zeolite particles attached onto the fibers considerably increased by treating them with hydrochloric acid, sulfuric acid, or hydrofluoric acid. Various functional groups such as chloropropyl, aminopropyl and epoxy groups of silane compounds, and amine groups of polyethylenimine were employed as covalent linkage materials between the fibers and zeolite particles. The state of the fibers coated with zeolite particles was examined by scanning electron microscopy, and the amounts of zeolite particles bound to the fibers were estimated from their BET surface areas. The largest amount was obtained when polyethylenimine was employed as a linkage material. Polyethylenimine was the most effective for attaching zeolite particles onto the inorganic fibers among various linkers employed.

Study on the Scap-cure Behavior of Adhesive for Flip-chip Bonding (플립칩 본딩용 접착제의 속경화 거동 연구)

  • Lee, Jun-Sik;Min, Kyung-Eun;Kim, Mok-Sun;Lee, Chang-Woo;Kim, Jun-Ki
    • Proceedings of the KWS Conference
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    • 2010.05a
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    • pp.78-78
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    • 2010
  • 모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

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The Effect of Zirconate Addition on the Joint Properties of Epoxy Adhesive for Car Body Assembly (차체 구조용 에폭시 접착제의 접합부 특성에 미치는 Zirconate 첨가효과)

  • Jeung, Eun-Taek;Lee, Hye-Rim;Lee, So-Jeong;Lim, Chang-Young;Seo, Jong-Dock;Kim, Mok-Soon;Kim, Jun-Ki
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.71-76
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    • 2013
  • The effect of zirconate having - NH functional group on the T-peel and lap shear strength of $CaCO_3$ containing structural epoxy adhesive for car body assembly was investigated. Curing behavior of epoxy adhesive samples were investigated by differential scanning calorimeter (DSC) techniques. The addition of zirconate up to 7.5 phr did not affect the curing mechanism of epoxy adhesive. While the small amount of zirconate addition less than 1.1 phr increased the cross-linking density, the excess addition of zirconate resulted in the increase of uncross-linked impurity. From the increase of T-peel and lap shear strength and the change of fracture mode from the adhesive failure to the mixed one, it was considered that the small addition of zirconate was effective in improving the adhesion strength of epoxy adhesive to the adherend and inorganic filler surfaces. The formation of uncross-linked impurity with the excess addition of zirconate was considered to decrease the joint strength by decreasing the cohesive strength of the cured epoxy.

Conservation Process of Large-earthen ware in Geumgangsa Temple Site - A Study on the Cyanoacrylate Adhesive Used for Large-earthen Ware Joining - (금강사지 출토 대형 토기의 보존 - 대형 토기접합에 사용된 순간 접착제에 대한 연구 -)

  • Lee, Dahae;Hwang, Hyunsung;Shin, Minkyeong
    • Conservation Science in Museum
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    • v.13
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    • pp.1-11
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    • 2012
  • While the project for registering the unregistered relics that had been stored in the relic storage warehouse was in progress, restoration operations were started for the large size pottery pieces that had been excavated from the Geumgangsa Temple Site and it is attempted to explain the pottery pieces and to introduce the process of the overall conservation treatment. About 600 pieces of large size pottery had been separately stored in more than 40 relic boxes in their original damaged condition without making it possible to figure out their shape, size, usage and quantity at all. Due to the enormous number and weight of the pottery pieces, they were, first of all, pre-classified largely into 6 groups of pottery pieces in consideration of the visible features such as pottery thickness, color sense and glaze brilliance, etc. for each kind of pottery raw material. However, as a result of making them adhere together on a temporary basis, they turned out to be only one piece of pottery in reality. In this restoring process, in order to see if the generally used cyanoacrylate adhesive was in fact safe when a very large, heavy and deformed pottery piece was to be put together, its safeness was checked by examining the adhesion velocity, adhesion strength and dissolution velocity for both from low to high viscosities through preliminary experiments. In order to restore the lost parts after putting the existing pieces together, diversified epoxy resins were used to fit their shapes. Considering that the bottom of the restored relic was shaped to be not flat but round without allowing it to stand alone, an exhibition mount was manufactured so that the relic could be stored stably and used readily for exhibition.