• The Transactions of the Korean Institute of Electrical Engineers
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• v.38 no.7
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• pp.511-523
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• 1989

This paper investigates physical properties, the electrical and mechanical characteristics of the epoxy resin with different curing methods and postcuring conditions at room temperature or cryogenic temperature (LN2). According to the results in this paper, first, it is found that the physical properties, electrical and mechanical characteristics of the epoxy resin are largely affected by the interior reaction temperature on the curing. Thus, in the fabrication of the sample, several excellent characteristics of the sample are obtained by controlling the interior reaction temperature of the epoxy resin. Second, the sample having optimal electrical and mechanical characteristics is obtained for the repetitive post-curing method at 100c in view point of the post-curing conditions of the epoxy resin. Third, it appears that tan and characteristics at LN2 temperature are about half of those at room temperature. Fourth, it appears that the dielectric strength of the epoxy resin at LN2 temperature is higher by about 0.6-1.0 MV/cm than that at room temperature. The heat-aging of the epoxy resin due to the micro-defect and excess fever-movement have been noticed to affect dielectric strength at LN2 temperature more significantly than at room temperature.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.5 no.2
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• pp.77-83
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• 1991

In this study the investigation were carried out on short-term breakdown characteristics of the compound material dependent on change of filler quantity, ambient temperature(room temperature~[$190[^{\circ}C$]) and kinds of voltage sources for the compound materials of Bisphenol- A epoxy resins filled with $SiO_2$ particles. As the results, obtained the dielectric breakdown strength generally decrease as increasing the quantity of filler and the distance, spacing of each's particles, decrease as increasing the quantity of filler, when the distance is less than [$7.5\mu\textrm{m}$], dielectric breakdown strength is nearly constant. In the case on AC voltage dielectric strength of filled epoxy resins is stronger than nonfilled epoxy resins on temperature region more than $130[^{\circ}C$].

• The Korean Journal of Rheology
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• v.7 no.2
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• pp.139-149
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• 1995

실제 복합재료 제조공정에 널리 이용되는 등방성 탄소섬유직조와 에폭시수지에 대 해서 수지의 유동을 일방향으로 근사하여 비정상상태 투과계수와 모세관압을 측정하는 실험 을 수행하였고 적층된 섬유직조의 기공율, 금형 주입압력 그리고 섬유직조의 적층수에 따른 수지유동특성을 분석하였다. 또한 금형 충전과정에 대한 유동가시화 실험을 수행하여 유동 선단과 충전시간을 측정하였다. 전체 조업압력에 미치는 모세관압의 영향을 규명하기 위해 일정 유입압력에 따른 금형충전과정에 대하여 유한요소/관할부피 방법을 이용한 수치모사를 수행하였다. 함침공정의 수지유동에서 비정상상태 투과계수는 섬유직조의 기공율에 따라 급 격히 증가하였고 에폭시수의 표면장력에 기인한 모세관압은 기공율 감소에 따라 급격히 증 가하였다. 동일한 기공율에서 섬유직조의 적층수가 증가함에 따라 투과계수와 모세관압은 모두 증가하는 경향을 보였다. 또한실험에서 측정한 모세관압을 고려하여 유동선단과 금형 충전시간을 수치모사방법으로 예측ㄷ한 결과는 유동가시화 실험에의한 결과와 잘 일치함을 보였다. 이결과로부터 낮은 압력에서 조업하는 RTM공정에서 모세관압효과는 유동선단과 금형 충전시간을 예측하는데 기여함을 알수 있다.

• Applied Chemistry for Engineering
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• v.1 no.2
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• pp.124-132
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• 1990

In order to improve the mechanical properties and fracture toughness of HPT 1071/DDS system, poly(aryl etherimide) (PEI) was incorporated in the resin system. In HPT 1071/DDS system, mechanical properties of cured epoxy resins were not strongly dependent on the concentration of DDS curing agent strongly. In the case of HPT 1071/DDS/PEI system, the fracture toughness and flexural properties of epoxy resins increased with increasing the concentration of PEI. SEM micrographs of cured epoxy resin indicated that the phase separation occured at the low concentration of PEI in this system. In addition, investigation of the relationship between mechanical properties and the morphology of modified epoxy resin was undertaken in HPT 1071/DDS/PEI system.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.2
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• pp.154-160
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• 2009

This paper shows a basic data of the surface discharge characteristics for epoxy resin in Dry-Air as being focused on environmentally friendly insulating Gas. Used electrodes are needle to plane, sphere to plane and KS M3015 electrodes. With the changing electrodes in same condition, we can obtain different creeping lengths, surface discharge voltages and surface dielectric strengths, respectively. Surface dielectric strengths of Needle to plane electrodes are more higher than the others. Moreover, it is considered that the surface discharge characteristics with variation of epoxy resin thickness and diameter. Surface discharge voltage increases as the thickness and the diameter of epoxy resin.

• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.5
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• pp.89-98
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• 2007

This study investigates the deformation behavior, related to debonding failure, of adhesion and repairing-strengthening materials of RC construction. A strain-stress curve shows that when the stress of specimens reached the highest and then fails, the strain value of cement mortar is $2.0{\times}10^{-3}$, while concrete was indicated at around $1.3{\times}10^{-3}$, epoxy resins are $0.8{\times}10^{-3}$, polymer mortar is $2.5{\times}10^{-3}$, steel plate is $2.5{\times}10^{-3}$, and carbon bar was $9.1{\times}10^{-3}$, respectively. For a thermal expansion coefficient with temperature variation, those basis materials, cement mortar and concrete, exhibited around $10{\mu}{\varepsilon}/{^{\circ}C}$, but adhesive materials, such as epoxy resins and polymer mortar, were $41{\sim}54{\mu}{\varepsilon}/{^{\circ}C}$ and $-0.5{\sim}0.7{\mu}{\varepsilon}/{^{\circ}C}$, respectively. In the case of steel plate is similar to basic materials but carbon fiber is indicates at $-1.7{\mu}{\varepsilon}/{^{\circ}C}$, which is the lowest value. Especially, between basic and adhesive materials, the thermal expansion coefficient was highly different. Although the coefficient depends on the type of epoxy resins, it is clear that the epoxy resins are susceptible to be debonded in nature, when the difference of environmental temperature varies more than $20{\sim}35{^{\circ}C}$.

• Elastomers and Composites
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• v.31 no.2
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• pp.130-147
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• 1996

• Elastomers and Composites
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• v.18 no.2
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• pp.70-81
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• 1983

• Electrical & Electronic Materials
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• v.1 no.2
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• pp.136-148
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• 1988

본 논문은 Epoxy수지에 무기물을 첨가하여 tracking 특성에 미치는 자외선 조사의 영향을 연구하였다. 시료는 Bisphenol A형 Epoxy수지에 충진제 MgO와 Al(OH)$_{3}$를 각각 첨가한 시료와 무기물을 첨가하지 않은 무층진 시료에 대하여 자외선을 조사하여 산화 및 열화현상과 tracking현상을 비교 연구 검토하였다. 그 결과 자외선조사로 인하여 carbonyl기의 생성과 craze의 발생이 있었고 이는 tracking 파괴와 침식을 용이하게 한다. 그리고 Epoxy수지에 충진제를 첨가하므로서 자외선에 의한 열화를 감소시키고 내 tracking성을 향상시킨다.

• Polymer(Korea)
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• v.38 no.2
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• pp.171-179
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• 2014

Low temperature cure prepregs are being developed for use in the preparation of large-structured fiber-reinforced polymer (FRP) composites with good performance. Cure behavior and chemorheology of low temperature cure epoxy resin system, based on epoxy resin, curing agent, and accelerators, were investigated to provide a matrix resin suitable for the prepreg preparation. Characteristics of cure reaction were studied in both dynamic and isothermal conditions by means of differential scanning calorimetry and rheometry. The low temperature cure epoxy resin system suggested in this study as a matrix resin was curable at $80^{\circ}C$ for 3 h, and showed the gel times of 120 and 20 min at 80 and $90^{\circ}C$, respectively. Thermal and mechanical properties of the cured sample were almost the same as high temperature cure counterparts.