• Composites Research
• /
• v.30 no.6
• /
• pp.371-378
• /
• 2017

In this study, hygroelastic behavior of thermosetting epoxy is predicted by molecular dynamics simulations. Since consistent exposures to humid environments lead to macroscopic degradation of polymer composite, computational simulation study of the hygroscopically aged epoxy cell is essential for long-time durability. Therefore, we modeled amorphous epoxy molecular unit cell structures at a crosslinking ratio of 30, 90% and with the moisture weight fraction of 0, 4 wt% respectively. Diglycidyl ether of bisphenol F (EPON862) and triethylenetetramine (TETA) are chosen as resin and curing agent respectively. Incorporating equilibrium and non-equilibrium ensemble simulation with a classical interatomic potential, various hygroelastic properties including diffusion coefficient of water, coefficient of moisture expansion (CME), stress-strain curve and elastic modulus are predicted. To establish the structural property relationship of pure epoxy, free volume and internal non-bond potential energy of epoxy are examined.

• Journal of Conservation Science
• /
• v.27 no.4
• /
• pp.431-440
• /
• 2011

The thermal expansion coefficient of epoxy/inorganic additives composites was controlled by changing the amount of the inorganic additives such as talc and fused silica. The epoxy resin comprises hydrogenated bisphenol A (HBA)-based epoxide, difunctional polyglycidyl epoxide (DPE) as a diluent and isophorone-diamine (IPDA) as a crosslinking agent, which was subsequently mixed with inorganic additives (talc and fused silica). The thermal expansion coefficient was decreased by increasing amount of inorganic additives, nearly to fresh granite. Fused silica was more effective than talc in lowering the thermal expansion coefficient. Additionally, lexural and tensile strengths of the composites were getting lower and higher with the amount of the inorganic fillers, respectively. It was thus concluded that an epoxy composite containing inorganic fillers was developed to show much lower thermal expansion coefficient, similar to fresh granite, than the neat epoxy resin, and also proper mechanical strengths for applications.

• 도로교통
• /
• s.92
• /
• pp.46-65
• /
• 2003

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1996.05a
• /
• pp.127-127
• /
• 1996

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1994.05a
• /
• pp.150-150
• /
• 1994

• Journal of Conservation Science
• /
• v.27 no.1
• /
• pp.115-121
• /
• 2011

A Urethane resin restoration material was made to be used in the restoration of stone cultural assets. The Urethane resin restoration material showed strong adhesive strength and tensile strength similar to epoxy recovery material, which had been mainly used for the recovery of stone cultural assets. The sealing property, anti-shrinking property and paint-ability of Urethane resin restoration material are also similar to existing epoxy system restoration materials. Especially, this Urethane resin restration material is expected to give permanence and continuous stability in the restoration of cultural assets made in stone by resolving the two big issues of existing epoxy recovery material, which are 'yellowing' and 'ir-reversibility'. This Urethane resin restration material had been directly applied as a filling material and adhesive and it was dissolved again. The Urethane resin, which had been used for the recovery, was able to be perfectly removed, which means that this Urethane resin recovery material has perfect reversibility. This Urethane resin restoration material also has enhanced convenience since user can adjust the working-life dependent on work environment. It is believed that this Urethane resin restoration material can also be used as a filling material or adhesive for other cultural assets made of ceramic or metal heritage, in addition to stone, since it has strong adhesive strength and tensile strength.

• Applied Chemistry for Engineering
• /
• v.23 no.6
• /
• pp.614-617
• /
• 2012

Ti-containing zeolite was synthesised and used in the epoxidation of di-cyclopentadiene (DCPD). Among various Ti-zeolite catalysts, Y contained Ti-zeolite showed the highest yield in the epoxidation of DCPD. The study was also investigated in terms of the Ti content in the catalysts, $H_2O_2$/substrate ratio, reaction temperature and applied time. The reaction conditions significantly influenced on both the catalytic activity and selectivity. In addition, Ti structure in the zeolite was analyzed using IR and UV-vis spectroscopy.

• Polymer(Korea)
• /
• v.33 no.4
• /
• pp.284-289
• /
• 2009

The morphology and mechanical properties of epoxy/polyamide/MPD reactive blends with various amount of polyamide were investigated. The cure behaviors, mechanical strengths, and morphological changes of the epoxy blend systems were analyzed by using DSC, UTM, and SEM, respectively. The amount of high soluble polyamide in epoxy ranged from 0 to 30 phr, and the cure reaction occurred at $170^{\circ}$ for 30 min. The start and maximum exothermic temperature in heat flows during cure reactions appeared at almost same temperature, indicating that soluble polyamide could rarely hinder the cure reactions. From the SEM images, it was found that the size of separated-phase was very fine about 100-300 nm, and at 20 phr of polyamide the boundary of separated-phase was unclear and the phase revealed co-continuous. By AP plasma treatment of specimen surface, the adhesion strength was increased by 20% due to enhanced surface free energy. By blending 20 phr of polyamide with epoxy, the adhesion strength was increased by 50% due to co-continuous phase in morphology. By considering the surface treatment of specimen and morphological tuning of the blends, it can be expected that the improvement in toughness and excellent adhesion strength can be achieved in structural adhesive systems.

• Korean Journal of Materials Research
• /
• v.9 no.4
• /
• pp.398-403
• /
• 1999

Studies on the electrical treeing deterioration and dielectric breakdown phenomena in the polymeric insulator of polyethylene and epoxy resin were carried out. Block type samples with needle-plane electrode geometry were electrically stressed and the tree pattern from the needle tip was observed. In LDPE the density of electrical tree was very high and its pattern was bush type. For the case of XLPE, branched tree was observed. As temperature and SN content increased, the dielectric breakdown voltage decreased and the treeing phenomena became more complicated. Fan type cracks were observed around the conducting tree path in the brittle DGEBA/MDA system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.340-341
• /
• 2008

본 논문에서는 미세 패턴을 구현하기 위해 폴리머 소재의 조성에 따른 공정의 영향에 대해서 연구를 하였다. 제작된 본딩 필름은 난연계 에폭시수지와 고내열 특성을 위해서 경화제 조화 성분 폴리머를 이용하였다. 또한, CTE 값을 향상하기 위해서 필러로서 SiO2 분말을 이용하였다. 조성물은 혼합하여 슬러리를 만들고, 테입 캐스터를 이용하여 필름을 제작하였다. 제작된 필름은 150 및 160도의 온도에서 가열 가압하여 경화하였다. 제작된 수지는 유전율 3.2의 유전율과 loss tan 6값이 0.015값을 나타내었다. 또한 제작된 본딩 필름의 조화특성 연구를 위해서 경화조건, 스웰링 조건, 디스미어 시간에 따른공정 변화의 영향에 대해 고찰하였으며 제작된 시편의 조도는 SEM으로 관찰하여 조화성분 함량에 따른 최적 조건을 선정하였다.