• Proceedings of the KWS Conference
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• 2005.06a
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• pp.31-33
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• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.15-21
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• 2013

In this paper, a high-speed imaging and an image processing technique have been applied to detect the position of a meniscus as a function of time in the micro capillary flows. Two fluids with low and high viscosities, ethylene glycol and glycerin, were dropped into the entrance well of a circular capillary tube. The filling times of the meniscus in both cases of ethylene glycol and glycerin were compared with the theoretical models - Washburn model and its modified model based on Newman's dynamic contact angle equation. To evaluate the model coefficients of Newman's dynamic contact angle, time-varying contact angles under the capillary flows were measured using an image processing technique. By considering the dynamic contact angle, the estimated filling time from the modified Washburn model agrees well with the experimental data. Especially, for the lower-viscosity fluid, the consideration of dynamic contact angle is more significant than for the higher-viscosity fluid.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.11-17
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• 2010

The electromigration phenomenon in lead-free flip-chip solder joint has been one of the serious problems. To understand the mechanism of this phenomenon, the crystallographic orientation of Sn grain in the Sn-Ag-Cu solder bump has been analyzed. Different time to failure and different microstructural changes were observed in the all test vehicle and bumps, respectively. Fast failure and serious dissolution of Cu electrode was observed when the c-axis of Sn grain parallel to electron flow. On the contrary of this, slight microstructural changes were observed when the c-axis of Sn perpendicular to electron flow. In addition, underfill could enhance the electromigration reliability to prevent the deformation of solder bump during EM test.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.74-74
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• 2010

모바일 정보통신기기를 중심으로 전자패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있는 추세이다. 플립칩 패키징 접합소재로는 솔더, ICA(Isotropic Conductive Adhesive), ACA(Anisotropic Conductive Adhesive), NCA(Non Conductive Adhesive) 등과 같은 다양한 접합소재가 사용되고 있다. 최근에는 언더필을 사용하는 플립칩 공법보다 미세피치 대응성을 위해 NCP를 이용한 플립칩 공법에 대한 요구가 증가되고 있는데, NCP의 상용화를 위해서는 공정성과 함께 신뢰성 확보가 필요하다. 본 연구에서는 LDI(LCD drive IC) 모듈을 위한 COF(Chip-on-Film) 플립칩 패키징용 NCP 포뮬레이션을 개발하고 이를 적용한 COF 패키지의 신뢰성을 조사하였다. 테스트베드는 면적 $1.2{\times}0.9mm$, 두께 $470{\mu}m$, 접속피치 $25{\mu}m$의 Au범프가 형성된 플리칩 실리콘다이와 접속패드가 Sn으로 finish된 폴리이미드 재질의 flexible 기판을 사용하였다. NCP는 에폭시 레진과 산무수물계 경화제, 이미다졸계 촉매제를 사용하여 다양하게 포뮬레이션을 하였다. DSC(Differential Scanning Calorimeter), TGA(Thermogravimetric Analysis), DEA(Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화거동을 확인하였으며, 본딩 후에는 보이드를 평가하고 Peel 강도를 측정하였다. 최적의 공정으로 제작된 COF 패키지에 대한 HTS (High Temperature Stress), TC (Thermal Cycling), PCT (Pressure Cooker Test)등의 신뢰성 시험을 수행한 결과 양산 적용 가능 수준의 신뢰성을 갖는 것을 확인할 수 있었다.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.78-78
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• 2010

모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.