• Journal of the Korean Society for Precision Engineering
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• v.11 no.6
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• pp.42-49
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• 1994

One of the parameters that influence the productivity of every industry, involved in metal cutting, is the chip from ; continuous or broken chip. Chip form varies according to machining conditions, material used, tool geometry and chip breaker geometry. Therefore, in this study we carried out the experiment on the chip control in machining STS304 using an attached obstruction type chip breaker. Namely, with the change of a chip breaker distance, chip breaker angle, cutting characteristics in machining STS304 which is well-known as a machining difficult material and produces a saw-toothed chip. The results of the experiment are as follows : 1. The chip breaker distance and angle under which the preferred chip is produced, show 1.5mm and 60 .deg. , while chip breaker angle in machining an ordinary steel was well-known 45 .deg. . 2. During the cutting process, the change of feed than the change of velocity was applied as cutting conditions, effects more clearly on the chip breaking. 3. Considering a whole surface roughness, it is not advisable to apply chip breaker mentioned above for precision cutting.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.91-96
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• 2014

Through silicon via (TSV) technology is to form a via hole in a silicon chip, and to stack the chips vertically for three-dimensional (3D) electronics packaging technology. This can reduce current path, power consumption and response time. In this study, Cu-filling substrate size was changed from Si-chip to a 4" wafer to investigate the behavior of Cu filling in wafer level. The electrolyte for Cu filling consisted of $CuSO_4$ $5H_2O$, $H_2SO_4$ and small amount of additives. The anode was Pt, and cathode was changed from $0.5{\times}0.5cm^2$ to 4" wafer. As experimental results, in the case of $5{\times}5cm^2$ Si chip, suitable distance of electrodes was 4cm having 100% filling ratio. The distance of 0~0.5 cm from current supplying location showed 100% filling ratio, and distance of 4.5~5 cm showed 95%. It was confirmed good TSV filling was achieved by plating for 2.5 hrs.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.2
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• pp.50-54
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• 2015

In this paper, we report on a high performance 94 GHz MMIC mixer module using 0.1-um metamorphic high electron mobility transistors (MHEMTs). A modified resistive mixer with a RF amplifier was proposed in this work for low conversion loss and high LO-RF isolation. The MMIC mixer module was fabricated using a MMIC chip and CPW-waveguide transitions. The fabricated mixer chip and module showed a low conversion loss of 6.3 dB and 9.5 dB, and LO-RF isolations of 24.8 and 30.4 dB at 94 GHz, respectively. This results are superior to those of previously W-band (75-110 GHz) MMIC mixers.

• Korean Journal of Environmental Agriculture
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• v.20 no.4
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• pp.203-210
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• 2001

In order to environmentally use wood chips manufactured from low valued forest resources by forest tendering, wood chips were used for the evaluation on chips characteristics, decomposition capability of organic wastes, and field experiment and determination of conditions for decomposer. Bioclusters manufactured by Cryptomeria japonica, commercially available wood chips in Japan, showed higher pore ratio, water reservation and water resistance, and higher cellulose content with lower hot water solubles than domestic wood chips. The useful size of wood chips for swine manure decomposition was 10 (length) ${\times}$ 5 (width) ${\times}$ 2 (thickness) mm, and cellulose contents and alkali solubles of Pinus densiflora and Populus tomentiglandulosa were similar to those of bioclusters. According to the decomposition ratio depending on wood species, it was ordered as Pinus densiflora > Pinus koraiensis > Cryptomeria japonica. The swine manure decomposition ratio depending on treatment hours by Pinus koraiensis was constant with the ratio of 15 to 16 g per hour by 1 kg of chip, indicating of daily swine decomposition amount of 390 kg by 1 ton of chips which was equal to the amount of daily swine manure production by 70 swines. Analyzing by long term used wood chips during 40 days treatment, the treated wood chips characteristically showed stable total nitrogen content, suitable pH, high accumulation of inorganic contents such as calcium, phosphorus, potassium and sodium, and no odor. During winter, the inner temperature of decomposer was kept at $43^{\circ}C$, but air bubble was occurred due to high pH and viscosity of swine manure. The most appropriate mixing ratio between wood chips and swine manure was 1 versus 2 or 3, and at more than ratio 1 versus 3, ammonia gas was caused because of anaerobic fermentation status by high moisture content of wood chips. The mixing interval of decomposer was 3 mins. per hour for the best swine decomposition.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.65-69
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• 2008

This work shows that the grinding-induced scratches formed on the back surface of silicon chips can highly influence the flexural strength of the chips. Meanwhile, in a case that excellent adhesion between the back surface and the plastic package body maintains, the flexural strength of plastic-encapsulated packages is not so sensitive to the geometry of the scratch marks. This article explains why such different flexural fracture behavior between bare chips and plastic-encapsulated chips appears.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.1-7
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• 1999

A single RF transceiver evaluation board have been developed for the purpose of application to the 900MHz band transceiver contained RF-IC chip And environment test was evaluated. The RF-IC chipset includes LNA(Low Noise Amplifier), down-conversion mixer, AGC(Automatic Gain Controller), switched capacitor filter and down sampling mixer. The RF evaluation board for the testing of chipset contained various external matching circuits, filters such as RF/IF SAW(Surface Acoustic Wave) filter and duplexer and power supply circuits. With the range of 2.7~3.3V the operated chip revealed moderate power consumption of 42mA. The chip was well operated at the receiving frequency of 925~960MHz. Measurement result is similar to general RF receiving specification of the 900MHz digital mobile phone.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.79.2-84
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• 1995

소경드릴 가공은 최근 가공 제품의 소형화, 경량화 등의 추세로 인하여 수요가 급증됨ㅇ 따라 레이져 가공, 전자빔 가공, 전해가공과 같은 전기 물리적 가공법 등이 많이 사용되고 있으나, 생산성 및 정밀도의 면에서 만족스러운 결과를 얻을 수 없는 실정이다. 이에 반해 기계 가공법인 소경드릴 가공은 공구의 강성 저하로 인하여 쉽게 파손이 되고 칩 배출의 어려운 점이 있지만, 가공정밀도가 양호하고 종횡비가 높은 가공이 가능하여 실용화가 좋은 분야라고할 수 있다, 이로 인해 이에 대한 연구가 많이 진행되고 있다. 따라서 본 연구에서는 서로 종류가 다른 고속도강 드릴인 소경드릴을 이용하여 ADI 재료를 절삭가공 할때 비관통 및 단계절삭 가공시에 발생하는 절삭력의 변화에 따른 공구의 마모,가공정도 및 가공조건등을 실험적으로 고찰하여 소경드릴 가공시 발생하는 제반문제점을 해결하고 공구의 마모 및 가공정도가 양호한 최적의 절삭조건을 얻고져 한다.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.9
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• pp.19-27
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• 1998

The Transmitter part of single RF transceiver chip for an extended GSM handset application was circuit-designed, fabricated adn evaluated. The RF-IC Chip was processed by 0.8${\mu}m$ Si BiCMOS, 80 pin TQFP of $10 {\times} 10mm$ size, 3.3V operated RF-IC reveals, in general, quite reasonable integrity and RF performances. This paper describes development resuts of RF transmitter section, which includes IF/RF up-conversion mixer, IF/RF polyphase and pre-amplifier. The test results show that RF transmitter section is well operated within frequency range of 880~915MHz, which is defined on the extended GSM(E-GSM) specification. The transmitter section also reveals moderate power consumption of 71mA and total output power of 8.2dBm.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• KSBB Journal
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• v.24 no.1
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• pp.1-8
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• 2009

In the past decade, we have observed rapid advances in the development of biochips in many fields including medical and environmental monitoring. Biochip experiments involve immobilizing a ligand on a solid substrate surface, and monitoring its interaction with an analyte in a sample solution. Metal nanoparticles can display extinction bands on their surfaces. These charge density oscillations are simply known as the localized surface plasmon resonance (LSPR). The high sensitivity of LSPR has been utilized to design biochips for the label-free detection of biomolecular interactions with various ligands. LSPR-based optical biochips and biosensors are easy to fabricate, and the apparatus cost for the evaluation of optical characteristics is lower than that for the conventional surface plasmon resonance apparatus. Furthermore, the operation procedure has become more convenient as it does not require labeling procedure. In this paper, we review the recent advances in LSPR research and also describe the LSPR-based optical biosensor constructed with a core-shell dielectric nanoparticle biochip for its application to label-free biomolecular detections such as antigen-antibody interaction.