• Elastomers and Composites
• /
• v.48 no.1
• /
• pp.76-84
• /
• 2013

The term 'Piezoresistive effect' describes a change in the electrical resistance of the material from deformed to its original shape by the external pressure, e.g., elongation, compression, etc. This phenomenon has various applications of sensors for monitoring pressure, vibration, and acceleration. Although there are many materials which have the piezoresistive effect, rubber (nano)composites with conductive fillers have attracted a great deal of attention because the piezoresistive effect appears at the various range of pressure by controlling the type of filler, particle size, particle shape, aspect ratio of particles, and filler content. Especially one can obtain the composites with elasticity and flexibility by using the rubber as a matrix. This paper aims to review the piezoresistive effect itself, their basic principles, and the various conductive rubber-composites with piezoresistive effect.

• Electrical & Electronic Materials
• /
• v.8 no.1
• /
• pp.102-113
• /
• 1995

일반적으로 단결정 실리콘은 거의 모든 전자소자의 재료로서 널리 사용되고 있으며 제조공정기술 또한 상당한 수준에 도달하고 있다. 최근에는 실리콘 자체의 우수한 압저항효과, 기계적 특성 그리고 반도체 제조공정을 이용한 미세가공기술인 마이크로머시닝을 이용하는 반도체 압력센서에 대한 연구가 활발히 진행되고 있다. 기계식 압력센서에 비해서 전기적 변화를 이용하는 반도체 압력센서에서는 소형, 저가격, 고신뢰성, 고감도, 다기능, 고분해, 고성능 및 집적화 등의 우수한 특성을 지니고 있다. 본고에서는 이러한 특성을 가지는 반도체 압력센서중 특히, 압저항형과 용량형 압력센서의 구조와 원리, 그리고 연구.개발동향 및 향후 전망에 관해서 기술하였다.

• Proceedings of the KOSOMBE Conference
• /
• v.1990 no.11
• /
• pp.75-79
• /
• 1990

반도체 및 전자공업의 급속한 발달에 힘입어 압력센서가 소형, 경량, 대량 생산화됨으로써 의료용으로의 사용이 최근 급속히 늘고 있다. 따라서 본 논문은 현재 가장 활발히 개발되고 있는 압저항형 압력 센서의 원리인 압저항 효과에 대해 이론적인 분석을 상세히 소개하였다. 그리고 기존에 많이 소개된 바 있는 정사각형 모양의 박막모서리 중앙 부분에 위치한 압저항체의 설계 보다 직사각형 박막 중심에 위치한 압저항체의 설계가 우수한 특성을 보일 수 있는 이론적 근거를 설명한다.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.42 no.1
• /
• pp.19-24
• /
• 2005

In this paper, the fabrication process of Si pressure sensors utilizing piezoresistive effect was optimized. The efficiency(yield) of the fabrication process for Si piezoresistive pressure sensors was improved by conducting Si anisotrophic etching process after processes of piezoresistors and AI circuit patterns. The position and process parameters for piezoresistors were determined by ANSYS and SUPREM simulators, respectively. The measured thickness of p-type Si piezoresistors from the boron depth-profile measurement was in good agreement with the simulated one from SUPREM simulation. The Si anisotrohic etching process for diaphragm was optimized by adding ammonium persulfate(AP) to tetramethyl ammonium hydroxide (TMAH) solution.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.31 no.4
• /
• pp.417-424
• /
• 2007

This paper reports fabrication and characterization of a pressure sensor using a pitch-based carbon fiber. Pitch-based carbon fibers have been shown to exhibit the piezoresistive effect, in which the electric resistance of the carbon fiber changes under mechanical deformation. The main structure of pressure sensors was built by performing backside etching on a SOI wafer and creating a suspended square membrane on the front side. An AC electric field which causes dielectrophoresis was used for the alignment and deposition of a carbon fiber across the microscale gap between two electrodes on the membrane. The fabricated pressure sensors were tested by applying static pressure to the membrane and measuring the resistance change of the carbon fiber. The resistance change of carbon fibers clearly shows linear response to the applied pressure and the calculated sensitivities of pressure sensors are $0.25{\sim}0.35 and 61.8 ${\Omega}/k{\Omega}{\cdot}bar$ for thicker and thinner membrane, respectively. All these observations demonstrated the possibilities of carbon fiber-based pressure sensors.

• Journal of Sensor Science and Technology
• /
• v.1 no.2
• /
• pp.131-145
• /
• 1992

This paper has been described a process technology for the fabrication of Si-on-insulator(SOI) transducers and circuits. The technology utilizes Si-wafer direct bonding(SDB) and mechanical-chemical(M-C) local polishing to create a SOI structure with a high-qualify, uniformly thin layer of single-crystal Si. The electrical and piezoresistive properties of the resultant thin SOI films have been investigated by SOI MOSFET's and cantilever beams, and confirmed comparable to those of bulk Si. Two kinds of pressure transducers using a SOI structure have been proposed. The shifts in sensitivity and offset voltage of the implemented pressure transducers using interfacial $SiO_{2}$ films as the dielectrical isolation layer of piezoresistors were less than -0.2% and +0.15%, respectively, in the temperature range from $-20^{\circ}C$ to $+350^{\circ}C$. In the case of pressure transducers using interfacial $SiO_{2}$ films as an etch-stop layer during the fabrication of thin Si membranes, the pressure sensitivity variation can be controlled to within a standard deviation of ${\pm}2.3%$ from wafer to wafer. From these results, the developed SDB process and the resultant SOI films will offer significant advantages in the fabrication of integrated microtransducers and circuits.

• Journal of Sensor Science and Technology
• /
• v.5 no.5
• /
• pp.31-37
• /
• 1996

This paper presents characteristics of pressure sensor using shear-type piezoresistor of LPCVD(low pressure chemical vapour deposition) grown polycrystalline silicon films. The sensor has 3.1mV/V of pressure sensitivity in the pressure range of $1kgf/cm^{2}$, ${\pm}0.012%FS/^{\circ}C$ of TCO, and ${\pm}0.08%FS/^{\circ}C$ of TCS in the temperature range of $-20{\sim}+125^{\circ}C$. It showed ${\pm}0.2%FS$ of hysteresis and ${\pm}1.5%FS$ of non-linearity. Shear-type polycrystalline silicon pressure sensor can eliminate temperature dependence of offset caused by resistors mismatch and be used in relatively wide temperature range, compared to the conventional full-bridge silicon pressure sensors.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.25 no.3
• /
• pp.307-314
• /
• 1988

The thin, square-diaphragm silicon pressure sensor utilizing shear piezoresistance effect was designed and fabricated and its characteristics were examined. The sensor has only one diffused resistor, whereas conventional full-bridge sensor has four. Sensitivity is somewhat lower but temperature compensation is easier than the latter. The proposed sensor was fabricated with only one p-type diffused resistor of the dimension of 113x85\ulcorner\ulcornerlocated near the center of the edge of the diaphragm. The resistor was at 45\ulcornerwith the edge of the diaphragm. The sensitivity of the sensor was 36\ulcorner/V\ulcornermHg and was linear in the pressure range from 0 to 300 mmHg. The temperature coefficient without temperature compensation was 55 ppm/\ulcorner and it was decreased to about 0.17 mmHg/\ulcorner with compensation in the range from 10 to 60\ulcorner.

• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1360-1362
• /
• 2001

본 논문에서는 다이어프램을 세라믹을 사용하여 2차 변환 소자로 금속 스트레인 게이지 대신에 thick film piezoresistor를 이용한 후막 압력센서에 관한 연구이다. 다이어프램의 미소 변형을 후막의 비저항 변화로 검출하는 압저항 효과를 이용하는 방식이다. 종래의 압력센서와 비교하여 크리프 현상이 적고, 안정성이 우수한 특징을 갖고 있다. 또한 저항선이나 박 게이지의 게이지율이 3$\sim$5 인 것이 비하면 후막저항을 사용한 경우, 약 15$\sim$20정도의 높은 게이지율을 얻을 수 있어서 측정범위를 넓게 할 수 있으며, 후막공정의 스크린 프린팅을 통한 자동화는 수율의 향상과 저 가격화를 실현할 수 있다. 또, 후막 저항형 압력센서는 두 개의 저항이 다이어프램의 중앙 부근에 위치하며, 나머지 두 개의 저항은 가장자리에 위치시킴으로써 미소 변형에서도 저항값의 변화를 읽을 수 있도록 하였고, 휘스톤 브리지의 연결 도체부는 Pt를 주성분으로 하는 conductive paste(DHC7085)를 사용하였다. 이렇게 설계.제작된 압력 센서를 지지대에 고정시킨 후 캡슐에 넣고 감도, 선형성, 히스테리시스 그리고 온도특성 등을 고찰하였다.

• Journal of Sensor Science and Technology
• /
• v.32 no.6
• /
• pp.470-474
• /
• 2023

In this study, a diaphragm-type pressure sensor was developed using multi-layer(four-layer) graphene produced at 1 nm thickness by thermally transferring single-layer graphene produced by chemical vapor deposition (CVD) to a 6" silicon wafer. By measuring the gauge factor, we investigated whether it was possible to produce a pressure sensor of consistent quality. As a result of the measurement, the pressure sensor using multilayer graphene showed linearity and had a gauge factor of about 17.5. The gauge factor of the multilayer graphene-based pressure sensor produced through this study is lower than that of doped silicon, but is more sensitive than a general metal sensor, showing that it can be sufficiently used as a commercialized sensor.