• The Journal of the Acoustical Society of Korea
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• v.16 no.4
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• pp.76-84
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• 1997

In this paper, one of the core components of a mobile communication system, VCO(Voltage Controlled Oscillator) IC is designed. The VCO IC was designed, have realized as LC turned oscillator using varicap. LC sinusoidal tuned oscillator generally requires external inductors and thus remainding circuit is implemneted in monolithic IC. The circuit is fabricated using an 15 mask IC process and has a die size of 1150um${\times}$780um. The tests showed that VCO was operated at frequencies in the regions between 880MHz-915MHz in the control voltage range of 1V to 3V at 5V supply voltage and as the power supply was varied from 4.5V to 5.5V, the frequency varied 425KHz/V. The VCO IC has frequency shift of 1.97MHz/T, carrier level of -7dBm and power consumption of 16.7mA. Also it has phase noise of -80dBc/Hz, offset at 50KHz and harmonic response of center frequency is -41dBm. For the future development of the transceiver 1 chip, the previously mentioned external devices need to be incorporated into Si MMIC.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2021.11a
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• pp.6-7
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• 2021

Although the development of free-form architectural technology continues, it consumes a lot of money and time due to the one-time formwork and the difficulty of maintaining quality due to manual work. To this end, in this study, a shape connection technique was proposed and verified to improve the limitations of implementing the curved surface of the existing lower multi-point press. In order to improve the accuracy of the shape, a curved surface was implemented using a silicon cap and a silicon plate. As a result of the error analysis of the shape, a small value of less than 3 mm was found. This study can implement more accurate curved surfaces than conventional technologies and produce high-quality free-form panels.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.1
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• pp.107-114
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• 2014

A friction hinge system which moves without power was designed and developed using the principle of friction force, which is caused by interference between the inner diameter of a silicon cap and the outer diameter of a cylindrical roller bearing with one-way rotation in a counterclockwise direction. The system was applied to the lid of buffet ware, which moved up by external force and moved down by gravitational force. However, design conditions which included a rotation angle of the hinge of more than 80 degrees and a closing time of more than 20 seconds were required when the lid of the buffet ware closed due to gravitational force. The design safety of the friction hinge body connected to the lid of the buffet ware from the hinge system was checked on the basis of structural, fatigue and thermal analyses. The material of the shaft, cap and flange among the hinge elements was changed to polyethylene from steel to reduce the weight of the friction hinge system. An injection molding simulation was performed and injection molds of the shaft, cap and flange were created. The weight of the hinge system was decreased from 805g to 219g.

• Journal of IKEEE
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• v.13 no.4
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• pp.23-27
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• 2009

Ohmic contact formation and etching processes for the fabrication of MBE (molecular beam epitaxy) grown GaSb-based p-channel HEMT devices on Si substrate have been studied. Firstly, mesa etching process was established for device isolation, based on both HF-based wet etching and ICP-based dry etching. Ohmic contact process for the source and drain formation was also studied based on Ge/Au/Ni/Au metal stack, which resulted in a contact resistance as low as $0.683\;{\Omega}mm$ with RTA at $320^{\circ}C$ for 60s. Finally, for gate formation of HEMT device, gate recess process was studied based on AZ300 developer and citric acid-based wet etching, in which the latter turned out to have high etching selectivity between GaSb and AlGaSb layers that were used as the cap and the barrier of the device, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.4
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• pp.32-38
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• 2011

This paper describes implementation of the 5.0GHz RF frequency synthesizer with 0.18${\mu}m$ silicon CMOS technology being used as an application of the IEEE802.15.4 USN sensor node transceiver modules. To get good performance of speed and noise, design of the each module like VCO, prescaler, 1/N divider, fractional divider with ${\Sigma}-{\Delta}$ modulator, and common circuits of the PLL has been optimized. Especially to get excellent performance of high speed and wide tuning range, N-P MOS core structure and 12 step cap banks have been used in design of the VCO. The chip area including pads for testing is $1.1{\times}0.7mm^2$, and the chip area only core for IP in SoC is $1.0{\times}0.4mm^2$. Through analysing of the fabricated frequency synthesizer, we can see that it has wide operation range and excellent frequency characteristics.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.12
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• pp.57-63
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• 2016

This paper describes implementation of the RF frequency synthesizer with $0.18{\mu}m$ silicon CMOS technology being used as an application of the IEEE802.15.4g SUN sensor node transceiver modules. Design of the each module like VCO, prescaler, 1/N divider, ${\Delta}-{\Sigma}$ modulator, and common circuits of the PLL has been optimized to obtain high speed and low noise performance. Especially, the VCO has been designed with NP core structure and 13 steps cap-bank to get high speed, low noise, and wide band tuning range. The output frequencies of the implemented synthesizer is 1483MHz~2017MHz, the phase noise of the synthesizer is -98.63dBc/Hz at 100KHz offset and -122.05dBc/Hz at 1MHz offset.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.5
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• pp.49-54
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• 2009

This paper describes implementation of the 1.9GHz RF frequency synthesizer with $0.18{\mu}m$ silicon CMOS technology being used as an application of the USN sensor node transceiver modules. To get good performance of speed and noise, design of the each module like VCO, prescaler, 1/N divider, fractional divider with ${\Sigma }-{\Delta}$ modulator, and common circuits of the PLL has been optimized. Especially to get good performance of speed, power consumption, and wide tuning range, N-P MOS core structure has been used in design of the VCO. The chip area including pads for testing is $1.2{\times}0.7mm^2$, and the chip area only core for IP in SoC is $1.1{\times}0.4mm^2$. The test results show that there is no special spurs except -63.06dB of the 6MHz reference spurs in the PLL circuitry. There is good phase noise performance like -116.17dBc/Hz in 1MHz offset frequency.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.45 no.6
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• pp.87-93
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• 2008

This paper describes implementation of the 5.0GHz RF frequency synthesizer with $0.18{\mu}m$ silicon CMOS technology being used as an application of the IEEE802.15.4 USN sensor node transceiver modules. To get good performance of speed and noise, design of the each module like VCO, prescaler, 1/N divider, fractional divider with ${\Sigma}-{\Delta}$ modulator, and common circuits of the PLL has been optimized. Especially to get good performance of speed, power consumption, and wide tuning range, N-P MOS core structure has been used in design of the VCO. The chip area including pads for testing is $1.1*0.7mm^2$, and the chip area only core for IP in SoC is $1.0*0.4mm^2$. Through comparing and analysing of the designed two kind of the frequency synthesizer, we can conclude that if we improve a litter characteristics there is no problem to use their as IPs.