• Journal of Platform Technology
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• v.9 no.1
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• pp.32-39
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• 2021

Existing environmental measuring devices mainly focus on electromagnetic wave and eco-friendly product certification and durability test, and sensor reliability verification and verification of measurement data are conducted mainly through sensor performance evaluation through type approval and registration, acceptance test, initial calibration, and periodic test. This platform has established an ICT-based environmental monitoring sensor reliability verification system that supports not only performance evaluation for each target sensor, but also a verification system for sensor data reliability. A sensor board to collect sensor data for environmental information was produced, and a sensor and data reliability evaluation and verification service system was standardized. In addition, to evaluate and verify the reliability of sensor data based on ICT, a sensor data platform monitoring prototype using LoRa communication was produced, and the test was conducted in smart cities. To analyze the data received through the system, an optimization algorithm was developed using machine learning. Through this, a sensor big data analysis system is established for reliability verification, and the foundation for an integrated evaluation and verification system is provide.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.43-49
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• 2016

Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.642-649
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• 2001

Precision parts and instruments are tested to evaluate performance in development-process and product-step to prement a potential defect due to a failure design. In this paper, Environmental test technology, which is the basis of reliability analysis, is introduced with examples of test criterion, test method for products, encoder and traffic signal controller, and measuring instruments. Recently, as the importance of the environmental test technology is recognised. It is proposed that tranining of test technician and technology of jig design and failure analysis are very essential.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.11
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• pp.1221-1229
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• 2014

This paper proposes an approach for predicting the fatigue life of a propeller shaft of a forklift truck by an accelerated life test method. The accelerated life test method adopted in this study is the calibrated accelerated life test, which is highly effective in the prediction of the lifetime and enables significant reduction of the test time as well as a quantification of reliability in the case of small sample sizes. First, the fatigue test was performed under two high stress levels, and then, it was performed by setting low stress levels in consideration of the available test time and extrapolation. Major reliability parameters such as the lifetime, accelerated power index, and shape parameter were obtained experimentally, and the experimentally predicted lifetime of the propeller shaft was verified through comparison with results of an analysis of load spectrum data under actual operating conditions.

• Aerospace Engineering and Technology
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• v.7 no.1
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• pp.183-193
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• 2008

This paper shows the results of failure mode analysis and the system-level reliability model for the flight test of KSLV-I upper stage. First, the critical 14 functions of KSLV-I upper stage are identified and the mission profile of the flight test is analyzed. Then, based on the functional analysis and the mission profile analysis, we construct a hierarchical structure of failure modes and a system-level reliability model for the flight test of KSLV-I upper stage.

• Journal of Korea Society of Industrial Information Systems
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• v.28 no.6
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• pp.21-27
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• 2023

Modern naval ships install an Infra-Red Signature Suppression system (IRSS) in their exhaust pipe to reduce infrared signature emitted to the outside. In addition, naval ships are strategic assets with a very long life cycle, so high reliability of the performance of the equipment on board must be guaranteed. Therefore, equipment such as IRSS is evaluated for performance through model testing at the design stage. A variety of measuring instruments are used in IRSS model testing, and the reliability of these instruments must also be guaranteed. In this paper, a study was conducted to evaluate the reliability of measurement equipment used in IRSS model testing. The test equipment and instruments used were a hot gas wind tunnel, pitot tube, digital differential pressure gauge, thermocouple sensor, and digital recorder. As the fan speed of the hot gas wind tunnel increased, the measurement deviation of the flow decreased, and the temperature output of the thermocouple sensor showed differences in response time and stability depending on the method used.

• Aerospace Engineering and Technology
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• v.10 no.2
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• pp.1-10
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• 2011

This is a comparative study of three inertia navigation units and focuses on the verification of reliability about GPS/INS for the SmartUAV(DGNS). Those GPS/INS have been tested using a manned aircraft and an automobile. The comparative aspect of units include details about the GPS positions and the inertia sensor performance. With the flight scenario, the DGNS guarantees the reliability of the navigation operation and performs the flight test for the development of the SmartUAV.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.598-606
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• 2001

Recently, semiconductor packages trend to be thinner, which makes difficult to detect defects therein. A preconditioning test is generally performed to evaluate the reliability of semiconductor packages. The test procedure includes two scanning acoustic microscope (SAM) tests at the beginning and end of the entire test, in order to help detect physical defects such as delaminations and package cracks. In particular, of primary concern are package cracks and delaminations caused by moisture absorbed under ambient conditions. This paper discusses the failure mechanism associated with the moisture absorbed and encapsulated in semiconductors, and the use SAM to detect failures such as tracks and delaminations grown during the preconditioning test.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.227-229
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• 2001

The components of dependability are reliability, availability, maintainability, safety. The dependability thus often designated in terms of RAMS. A guide to the appropriate selection applicable standards on test conditions and statistical analysis is suggested. It includes a general guide to planning, performing and analysing data from reliability tests. The environmental and operational conditions available as IEC standards are referred.