• Title/Summary/Keyword: 스트립라인

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Microstrip line tunable phase shifter (마이크로스트립 라인 전압제어 가변 대역통과필터)

  • ;Mai linh
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2002.05a
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    • pp.227-229
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    • 2002
  • In this paper, we report on a microstrip line voltage controlled tunable bandpass filter. We used the characteristic the relative dielectric constant of thin film ferroelectrics depends on the applied dr voltage. we designed using Au/BSTO/MgO/Au structure. We cascaded many resonators for large furling range sustaining 1 GHz renter frequency, narrow band, low IL ($\leq$4 dB). We could design the BPF of which center frequency is 16 GHz, 1.9 GHz tuning range, the narrow bandwidth within 800 MHz, low insertion loss less than 3 dB by adjusting the gap of 3 cascaded resonators.

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SSDA를 이용한 임의의 마이크로스트립 공진기 해석

  • 정병태
    • Proceedings of the Korea Society for Industrial Systems Conference
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    • 1998.10a
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    • pp.849-853
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    • 1998
  • 라인 해석법(Method of Line), MOL과 파수 영역 해석법(Space Domain Approach), SDA를 결합한 공간-파수 영역 해석법(SSDA)를 이용하여 MIC/MMIC 회로에서 임의 입체 구조를 갖는 공진기를 해석한다. SSDA는 상대 수렴(relative convergence)특성을 갖지 않으며, 반 해석적 (semianalytical )특성으로 수치적 효율이 높다. 경계치 문제로부터 씨스팀 행렬방정식 형태로 유도된그린 함수에 갤러킨법을 적용한다. 삼각, 사각 및 불연속 구조를 갖는 스트립 패치의 폭, 위치와 기판의 두께 변화에 따른 공진 주파수를 계산하였다.

Design of Millimeterwave Branch-Line Coupler Using Flip-Chip Technology (플립 칩 기술을 이용한 밀리미터파 대역 브랜치라인 커플러의 설계)

  • Yoon, Ho-Sung;Lee, Hai-Young
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.9
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    • pp.1-5
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    • 1999
  • In this paper, we proposed a novel branch-line coupler using filp-chip technology. The proposed coupler consists of CPW and inverted microstrip. The CPW is on the GaAs flip-chip substrate, and the inverted microstrip is on the alumina main substrate. The ground plane of the CPW is used as a ground plane of the inverted microstrip. And both the transmission lines are connected by solder bump with each other. The characteristics of thisstructure was calculated by FDTD method. The S21, S31 are -3dB and the phase difference is $90^{\circ}$. The calculated characteristics are the same as those of the regular branch-line coupler. This structure can be applied for various kinds of devices using flipchip technology.

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High Efficiency V-band Power Combining Modules Using Slotline-to-Microstrip Transition (슬롯라인-마이크로스트립 변환을 이용한 고효율 V-band 전력 결합 모듈)

  • Kim Dong-Ki;Jeong Jin-Ho;Kwon Young-Woo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.6 s.97
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    • pp.580-585
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    • 2005
  • Two high-efficiency and high power power-combing modules were developed using slotline-to-microstrip transition at V-band. Power-combining modules incorporating two MMIC power amplifiers demonstrated combining efficiencies higher than $80\%$(maximum $86\%$) with saturated output power of 22.96 dBm and 22.81 dBm, respectively. The measurement of back-to-back connected combiners demonstrated insertion loss less than 1.2 dB with return loss better than 15 dB around 60 GHz, respectively.

Optimized Design of T-Shaped Microstrip Antenna with Various Dimensions (T형 마이크로스트립 안테나의 면적 비에 따른 최적 설계)

  • Kim, Jin-Bok;Lee, Joong-Geun
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.47 no.5
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    • pp.53-59
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    • 2010
  • There are various types of antenna fed method; coaxial probe, coupling, parasitic elements, and impedance matching. In this paper, the fed method of the proposed antenna is microstrip line type. The high frequency structure simulator (HFSS) is used to analyze the characteristics of the T-shaped microstrip antenna with various patch dimensions. In comparison with the basic microstrip antenna, this proposed T-shaped microstrip antenna with 40.38 % of patch dimensions has the optimum characteristics of resonant frequency, return loss, and radiation pattern at 2.0 GHz band.

Application of Expanding-cell FDTD Method to Microstrip-to-Waveguide Transition (Expanding-cell 유한차분법의 마이크로스트립-도파관 변환기에의 적용)

  • 강희진;최재훈
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.11 no.3
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    • pp.345-351
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    • 2000
  • In this paper, we design and analyze a Ka-band microstrip line to rectangular waveguide transition using the expanding-cell FDTD method. The transition under investigation consists of a ridged waveguide, microstrip line, and $\lambda$/4 Chebyshev impedance transformer. To improve the accuracyand efficiency, the expanding-cell FDTD method is applied to analyze the characteristics of a ridged waveguide impedance transformer. To verify the accuracy of the expanding-cell FDTD method, S parameters of the analyzed transition are compared with those of experimental data. The efficiency of the present approach is verified by comparing the computational time for expanding-cell and that for fine cell. The relation between the number of step and operation bandwidth is analyzed by comparing the characteristics of four and three step Chebyshev waveguide impedance transformer.

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Unequal Dual-band Wilkinson Power Divider (비대칭 이중대역 전력분배기)

  • Kim, Byung-Chul;Lee, Soo-Jung;Kim, Young
    • Journal of Digital Convergence
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    • v.12 no.4
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    • pp.343-348
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    • 2014
  • This paper suggested a theoretical approach and an implementation for the design of an unequal Wilkinson power divider with a high dividing ratio operating at two-frequencies. The T-section transmission lines and the two-section of Monzon's theory are proposed to operate a dual-band application. To achieve the high dividing ratio divider, the high impedance line using a T-shaped structure and low impedance lines with periodic shunt open stubs are implemented. For the validation of this divider, a dual-band power divider with a high dividing ratio of 5 is simulated and measured at 1 GHz and 2 GHz. The measured performances of the divider are in good agreements with simulation results.

Optimum Design of a Dual-Band Microstrip Patch Antenna using the Square CSRR Construction (CSRR 구조 이중대역 마이크로스트립 패치안테나의 최적 설계)

  • Kim, Gue-Chol
    • The Journal of the Korea institute of electronic communication sciences
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    • v.12 no.1
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    • pp.25-30
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    • 2017
  • In this paper, dual band patch antenna was designed using a CSRR structure with negative values permeability which inserted into the ground plane. We propose an antenna that can be used in dual band f1(1.53GHz) and f2(1.63GHz) for satellite communications by using the CSRR placed on the backside of feeding line, which is a negative shape of SRR. The proposed antenna can be arrayed using microstrip line and can be made smaller than conventional patch antenna. The fabricated antenna has the input reflection coefficient of -12.5dB and -14.5dB at f1 and f2, and the gain of 2dB and -0.8dB, respectively. and it was confirmed that the performance was sufficient in the dual-band.

A Design of the New Three-Line Balun (새로운 3-라인 발룬 설계)

  • 이병화;박동석;박상수
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.7
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    • pp.750-755
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    • 2003
  • This paper proposes a new three-line balun. The equivalent circuit of the proposed three-line balun is presented, and impedance matrix[Z]of the equivalent circuit is derived from the relationship between the current and voltage at each port. The design equation for a given set of balun impedance at input and output ports is presented using[S]parameters, which is transferred fom impedance matrix,[Z]. To demonstrate the feasibility and validity of design equation, multi-layer ceramic(MLC) chip balun operated in the 2.4 GHz ISM band frequency is designed and fabricated by the use of the low temperature co-fired ceramic(LTCC) technology. By employing both the proposed new three-line balun equivalent circuit and multi-layer configuration provided by LTCC technology, the 2012 size MLC balun is realized. Measured results of the multi-layer LTCC three-line balun match well with the full-wave electromagnetic simulation results, and measured in band-phase and amplitude balances over a wide bandwidth are excellent. This proposed balun is very easily applicable to multi-layer structure using LTCC as shown in the paper, and also can be realized with microstrip lines on PCB. This distinctive performance is very favorable for wireless communication systems such as wireless LAN(Local Area Network) and Bluetooth applications.