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A Design of the New Three-Line Balun  

이병화 (삼성전기 중앙연구소 CAE팀)
박동석 (삼성전기 중앙연구소 CAE팀)
박상수 (삼성전기 중앙연구소 CAE팀)
Publication Information
The Journal of Korean Institute of Electromagnetic Engineering and Science / v.14, no.7, 2003 , pp. 750-755 More about this Journal
Abstract
This paper proposes a new three-line balun. The equivalent circuit of the proposed three-line balun is presented, and impedance matrix［Z］of the equivalent circuit is derived from the relationship between the current and voltage at each port. The design equation for a given set of balun impedance at input and output ports is presented using［S］parameters, which is transferred fom impedance matrix,［Z］. To demonstrate the feasibility and validity of design equation, multi-layer ceramic(MLC) chip balun operated in the 2.4 GHz ISM band frequency is designed and fabricated by the use of the low temperature co-fired ceramic(LTCC) technology. By employing both the proposed new three-line balun equivalent circuit and multi-layer configuration provided by LTCC technology, the 2012 size MLC balun is realized. Measured results of the multi-layer LTCC three-line balun match well with the full-wave electromagnetic simulation results, and measured in band-phase and amplitude balances over a wide bandwidth are excellent. This proposed balun is very easily applicable to multi-layer structure using LTCC as shown in the paper, and also can be realized with microstrip lines on PCB. This distinctive performance is very favorable for wireless communication systems such as wireless LAN(Local Area Network) and Bluetooth applications.
Keywords
LTCC; Multi-Layer; Three-Line Balun; Wireless LAN; Bluetooth;
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