• Title/Summary/Keyword: 쉬프트

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Architecture design for speeding up Multi-Access Memory System(MAMS) (Multi-Access Memory System(MAMS)의 속도 향상을 위한 아키텍처 설계)

  • Ko, Kyung-sik;Kim, Jae Hee;Lee, S-Ra-El;Park, Jong Won
    • Journal of the Institute of Electronics and Information Engineers
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    • v.54 no.6
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    • pp.55-64
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    • 2017
  • High-capacity, high-definition image applications need to process considerable amounts of data at high speed. Accordingly, users of these applications demand a high-speed parallel execution system. To increase the speed of a parallel execution system, Park (2004) proposed a technique, called MAMS (Multi-Access Memory System), to access data in several execution units without the conflict of parallel processing memories. Since then, many studies on MAMS have been conducted, furthering the technique to MAMS-PP16 and MAMS-PP64, among others. As a memory architecture for parallel processing, MAMS must be constructed in one chip; therefore, a method to achieve the identical functionality as the existing MAMS while minimizing the architecture needs to be studied. This study proposes a method of miniaturizing the MAMS architecture in which the architectures of the ACR (Address Calculation and Routing) circuit and MMS (Memory Module Selection) circuit, which deliver data in memories to parallel execution units (PEs), do not use the MMS circuit, but are constructed as one shift and conditional statements whose number is the same as that of memory modules inside the ACR circuit. To verify the performance of the realized architecture, the study conducted the processing time of the proposed MAMS-PP64 through an image correlation test, the results of which demonstrated that the ratio of the image correlation from the proposed architecture was improved by 1.05 on average.

Properties of CaO added MgO Sintering at High Pressure and Low Temperatures (CaO 첨가된 MgO의 고압 저온 소결 조건에 따른 물성연구)

  • Song, Jeongho;Song, Ohsung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.9
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    • pp.4185-4190
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    • 2013
  • We executed the property changes of the sintered MgO (99.9% purity, 300nm size) specimens with addition to CaO content of 0.00wt%, 0.25wt%, and 0.50wt%, processed at 7GPa, for 5min, 600~$800^{\circ}C$. To investigate the micro-structure and physical property changes of the sintered MgO(-CaO), we employed a scanning electron microscopy(SEM), X-ray diffractomerty(XRD), Vickers hardness, and density. The SEM result showed that MgO powder of 300nm size was changed into sintered structure of 520nm by high pressure and low temperature sintering, regardless of the CaO contents. According to the XRD analysis, no CaO phase observed, while MgO peaks shift indicated the existence of CaO in the MgO matrix. The Vickers hardness result showed that hardness of sintered MgO-CaO increased by 12% compared pure MgO under the same temperature conditions. It implied that we can obtain the same hardness with $100^{\circ}C$ lowered sintering temperatures by addition of CaO. The density results showed that it was possible to obtain density of 98%, which is 5% greater than that of pure MgO at low temperature of $600^{\circ}C$.

Hardware Design of High-Performance SAO in HEVC Encoder for Ultra HD Video Processing in Real Time (UHD 영상의 실시간 처리를 위한 고성능 HEVC SAO 부호화기 하드웨어 설계)

  • Cho, Hyun-pyo;Park, Seung-yong;Ryoo, Kwang-ki
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2014.10a
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    • pp.271-274
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    • 2014
  • This paper proposes high-performance SAO(Sample Adaptive Offset) in HEVC(High Efficiency Video Coding) encoder for Ultra HD video processing in real time. SAO is a newly adopted technique belonging to the in-loop filter in HEVC. The proposed SAO encoder hardware architecture uses three-layered buffers to minimize memory access time and to simplify pixel processing and also uses only adder, subtractor, shift register and feed-back comparator to reduce area. Furthermore, the proposed architecture consists of pipelined pixel classification and applying SAO parameters, and also classifies four consecutive pixels into EO and BO concurrently. These result in the reduction of processing time and computation. The proposed SAO encoder architecture is designed by Verilog HDL, and implemented by 180k logic gates in TSMC $0.18{\mu}m$ process. At 110MHz, the proposed SAO encoder can support 4K Ultra HD video encoding at 30fps in real time.

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A 10b 50MS/s Low-Power Skinny-Type 0.13um CMOS ADC for CIS Applications (CIS 응용을 위해 제한된 폭을 가지는 10비트 50MS/s 저 전력 0.13um CMOS ADC)

  • Song, Jung-Eun;Hwang, Dong-Hyun;Hwang, Won-Seok;Kim, Kwang-Soo;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.5
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    • pp.25-33
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    • 2011
  • This work proposes a skinny-type 10b 50MS/s 0.13um CMOS three-step pipeline ADC for CIS applications. Analog circuits for CIS applications commonly employ a high supply voltage to acquire a sufficiently acceptable dynamic range, while digital circuits use a low supply voltage to minimize power consumption. The proposed ADC converts analog signals in a wide-swing range to low voltage-based digital data using both of the two supply voltages. An op-amp sharing technique employed in residue amplifiers properly controls currents depending on the amplification mode of each pipeline stage, optimizes the performance of op-amps, and improves the power efficiency. In three FLASH ADCs, the number of input stages are reduced in half by the interpolation technique while each comparator consists of only a latch with low kick-back noise based on pull-down switches to separate the input nodes and output nodes. Reference circuits achieve a required settling time only with on-chip low-power drivers and digital correction logic has two kinds of level shifter depending on signal-voltage levels to be processed. The prototype ADC in a 0.13um CMOS to support 0.35um thick-gate-oxide transistors demonstrates the measured DNL and INL within 0.42LSB and 1.19LSB, respectively. The ADC shows a maximum SNDR of 55.4dB and a maximum SFDR of 68.7dB at 50MS/s, respectively. The ADC with an active die area of 0.53$mm^2$ consumes 15.6mW at 50MS/s with an analog voltage of 2.0V and two digital voltages of 2.8V ($=D_H$) and 1.2V ($=D_L$).