• Title/Summary/Keyword: 본딩 공정

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A Study on the Process Conditions of ACA( Anisotropic Conductance Adhesives) for COG ( Chip On Glass) (COG(Chip On Glass)를 위한 ACA (Anisotropic Conductive Adhesives) 공정 조건에 관한 연구)

  • Han, Jeong-In
    • Korean Journal of Materials Research
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    • v.5 no.8
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    • pp.929-935
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    • 1995

  • In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

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Effect of Surface Roughness on Weld-bonding Process using Heterogeneous Materials (델타스폿용접을 이용한 이종소재 웰드본딩공정 시 표면 거칠기 부여 가공방법의 영향)

  • Kim, Young-Hyun;Kim, Jaewoong;Kim, Jisun;Kim, Young-Gon;Pyo, Changmin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.11
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    • pp.102-108
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    • 2020

  • The demand for lightweight materials and high-strength steel has rapidly increased to help reduce the weight of a vehicle body; it improves the fuel efficiency of automobiles and provides passenger safety. Additionally, as the material becomes thinner, the demand for its resistance against corrosion becomes higher. Hence, the application of the surface-treated steel sheet has surged rapidly. In this study, a weld bonding experiment using a delta spot welding machine is performed on a thin sheet of a different material (Al6061-T6/GA440). The thickness of the material was kept at 1 mm to reduce the weight of the automobile body parts. Additionally, the purpose of this study is to control the heat input by applying the welding conditions of a multi-stage pressure pattern to improve corrosion resistance shear strength. The analysis of nugget diameter measurement, shear tensile test, and salt spray test was performed to achieve the aim.

  • https://doi.org/10.14775/ksmpe.2020.19.11.102 인용 PDF KSCI

A Study on the Bonding Performance of COG Bonding Process (COG 본딩의 접합 특성에 관한 연구)

  • Choi, Young-Jae;Nam, Sung-Ho;Kim, Kyeong-Tae;Yang, Keun-Hyuk;Lee, Seok-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.7
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    • pp.28-35
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    • 2010

  • In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

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Flip Chip Process on the Local Stiffness-variant Stretchable Substrate for Stretchable Electronic Packages (신축성 전자패키지용 강성도 국부변환 신축기판에서의 플립칩 공정)

  • Park, Donghyeun;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.155-161
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    • 2018

  • A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

  • https://doi.org/10.6117/kmeps.2018.25.4.155 인용 PDF KSCI HTML