• Journal of Aerospace System Engineering
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• v.18 no.2
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• pp.71-78
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• 2024

During the initial thermal design process, determining the thermal effect of various design variables in a complex orbital thermal environment is time-consuming. To save time in the initial design phase, it is necessary to quickly derive optimal design parameters and predict the temperature. To address these challenges, Veritrek, a software specialized in optimal design using a reduced-order model (ROM), was released in 2018. In this paper, we utilized the Veritrek software to build a reduced-order model, conduct sensitivity analysis, and perform optimal design analysis for a graphite sheet-based cryogenic cooler thermal control system. The goal was to determine the optimal design values for the number of graphite sheet layers, radiator area, and thickness that would meet the allowable temperature of the cryogenic cooler.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.39-46
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• 2017

This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.

• Solar Energy
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• v.11 no.2
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• pp.63-69
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• 1991

A Steady laminar natural convection heat transfer from two isothermal square beams attached to a vertical adiabatic plate has been studied numerically. The results have been obtained for dimensionless beam spacings, $0.5{\le}D/L{\le}3.0$, and for Gr=5000-10000 at ${\phi}_2/{\phi}_1=1.0$. 1. The local Nusselt number from the beam surface is increased with the dimension-less beam spacing D/L. but that of the downward surface of the lower beam is almost same as the D/L increases. And, the local Nusselt number from the upward surface of a lower beam is greatly increased with D/L. 2. The beam spacings of the maximum mean Nusselt number for the downward surface of an upper beam and the upward surface of a lower beam occur at. D/L =2.6 and 2.0 respectively. 3. The beam spacing for the maximum total mean Nusselt number occurs at D/L = 2.6.

• Korean Journal of Crystallography
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• v.4 no.1
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• pp.42-48
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• 1993

KTP(KTiOPO4) single crystals were grown by the TSSG(top seeded solution growth) method using the Ksp401s flux. A heat-pipe based growing furnace was used, and the temperature stability and the homogenity of the growing solution in the platinum crucible were within the level of It 0.5℃ and ±0.9℃, respectively. The effects of some operating variables such as operating temperature range, initial cooling rate, forced stirring, reuse of the flux were investigated. As the initial cooling rate was decreased to the degree of 0.1℃/hr and some proper stirring effect by the crystal rotation was introduced to the present experimental condition, bigger and better crystals without inclusion grew. A single crystal with the maximum sixte of 44 ×39 ×17mm3 was obtained and showed the SHG conversion efficiency of 21.39) even without the anti-refilection coating.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.46-54
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• 1998

A planar Bi-Sb multijunction thermal converter, which is consisted of a linear or bifilar thin film NiCr-heater and a thin film Bi-Sb thermopile, has been fabricated, and its ac-dc transfer characteristics were examined in a frequency range from 10 Hz to 10 KHz. In order to increase the thermal sensitivity and to decrease the ac-dc transfer error of a thermal converter, the heater and the hot junctions of a thermopile were prepared on a Si$_3$N$_4$/SiO$_2$/Si$_3$N$_4$-diaphragm which acts as a thermal isolation layer, and the cold junctions on the Si$_3$N$_4$/SiO$_2$/Si$_3$N$_4$-thin film supported with the silicon rim which functions as a heat sink. The respective thermal sensitivities in air and in a vacuum of the converter with a built-in bifilar heater were about 14.0 ㎷/㎽ and 54.0 ㎷/㎽, and the ac-dc voltage and the current transfer difference ranges in air were about $\pm$0.60 ppm and $\pm$0.11 ppm, respectively, indicating that the ac-dc transfer accuracy of the converter are much higher than that of a commercial 3-dimensional multijunction thermal converter. However, the output thermoelectric voltage fluctuation of the converter was rather high.

• Journal of Astronomy and Space Sciences
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• v.26 no.3
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• pp.403-416
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• 2009

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and developed by KARl for communication, ocean and meteorological observations. It will be tested under vacuum and very low temperature conditions in order to verify thermal design of COMS. The test will be performed by using KARI large thermal vacuum chamber, which was developed by KARI, and the COMS will be the first flight satellite tested in this chamber. The purposes of thermal balance test are to correlate analytical model used for design evaluation and predicting temperatures, and to verify and adjust thermal control concept. KARI has plan to use heating plates to simulate space hot condition especially for radiator panels of satellite such as north and south panels. They will be controlled from 90 K to 273 K by circulating GN2 and LN2 alternatively according to the test phases, while the main shroud of the vacuum chamber will be under constant temperature, 90 K, during all thermal balance test. This paper presents thermal modelling including test chamber, heating plates and the satellite without solar array wing and Ka-band reflectors and discusses temperature prediction during thermal balance test.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.4
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• pp.582-593
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• 1999

This paper presents the design and fabrication of the diplexer for a KOREASAT-III Ka-band satellite transponder. The transmission characteristics of the diplexer is analyzed by calculating the generalized scattering matrix using mode matching method. It is composed of 2 bandpass filters, coupled with H-plane T-junction having symmetrical inductive iris and E-plane metal insert structures. Compared with the size and weight of the Rx and Tx filter loaded with a transponders respectively, those of the diplexer can be effectively reduced. In a high power transmission, the variation of the filter characteristics is minimized by the scheme that irises are extended to the exterior of H-plane of the waveguide. This scheme needs no extra heat sinks for dissipating high power. The diplexer is designed to improve the simplification, durability and reliability by eliminating tuning screws, which have been used to compensate for the characteristics of fabricated filters. The bandpass filters of the diplexer show the insertion loss of less than 1.2 dB and the return loss in excess of 15 dB. The isolations of more than 65 dB have been achieved between Rx and Tx filter.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.2
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• pp.5-12
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• 2000

Uncooled metallic thin-film thermopile infrared detectors have been fabricated, and the figures of merit for the detectors were examined. The hot junctions of a thermopile were prepared on a $Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$-membrane which acts as a thermal isolation layer, the cold junctions on the membrane supported with the silicon rim which functions as a heat sink, and Au-black was used as an infrared absorber. Infrared absorbance of Au-black, which strongly depends on the chamber pressure during Au-evaporation and its mass per area, was found to be about 90 ％ in the wavelength range from 3${\mu}{\textrm}{m}$ to 14${\mu}{\textrm}{m}$. Voltage responsivity, noise equivalent power, and specific detectivity of Bi-Sb thermopile infrared detector at 5 Hz-chopping frequency were about 10.5V/W, 2.3 nW/Hz$^{1/2}$, 및 $1.9\times10^{7}$ cm.Hz$^{1/2}$/w at room temperature in air, respectively.

• The Bulletin of The Korean Astronomical Society
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• v.42 no.2
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• pp.87.3-88
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• 2017

한국천문연구원은 차세대소형위성 1호의 근적외선 영상분광기 NISS (Near-infrared Imaging Spectrometer for Star formation history) 탑재체를 개발하여 2017년 6월 30일에 최종 비행모델을 납품하였고, 이 발표는 탑재체 NISS 구조체의 비행모델 개발 결과를 보고한다. NISS는 0.9 - 2.5um (R~20) 근적외선 파장에서 관측을 해야 하기 때문에, 구조체의 배경잡음을 없애기 위해서 200K까지 passive cooling으로 냉각되며, H2RG 검출기는 소형 냉동기에 의해 약 88K에서 운영된다. NISS 구조체의 passive cooling을 효율적으로 수행하기 위해서 방열판, Kevlar 지지대, MLI, 표면제어용 필름 등을 조립하였고, 실제 지상 시험을 통해서 그 성능을 확인하였다. NISS 구조체는 최종 시스템 조립 과정에서 전자부 하네스 조립을 함께 수행했으며, 온도 모니터링 센서를 부착하고 소형 냉동기 피드백 온도를 반복 시험을 통해서 결정하였다. NISS 구조체는 미러 및 렌즈를 지지하는 광기계부를 함께 포함하기 때문에 발사 및 우주환경에서 광학 성능을 유지하기 위한 설계를 거쳐서 제작 되었으며, 최종 시스템 검교정 시험, 진동 및 열진공 시험을 통해서 그 성능을 확인하였다. NISS를 탑재한 차세대소형위성 1호는 2018년 상반기에 미국의 Falcon 9 발사체에 실려서 발사될 예정이다.

• Journal of the Korea Society of Computer and Information
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• v.16 no.9
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• pp.1-10
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• 2011

Unfortunately, in current microprocessors, increasing the frequency causes increased power consumption and reduced reliability whereas it improves the performance. To overcome the power and thermal problems in the singlecore processors, multicore processors has been widely used. For 2D multicore processors, interconnection is regarded as one of the major constraints in performance and power efficiency. To reduce the performance degradation and the power consumption in 2D multicore processors, 3D integrated design technique has been studied by many researchers. Compared to 2D multicore processors, 3D multicore processors get the benefits of performance improvement and reduced power consumption by reducing the wire length significantly. However, 3D multicore processors have serious thermal problems due to high power density, resulting in reliability degradation. Detailed thermal analysis for multicore processors can be useful in designing thermal-aware processors. In this paper, we analyze the impact of workload distribution, distance to the heat sink, and number of stacked dies on the processor temperature. We also analyze the effects of the temperature on overall system performance. Especially, this paper presents the guideline for thermal-aware multicore processor design by analyzing the thermal problems in 2D multicore processors and 3D multicore processors.