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http://dx.doi.org/10.6117/kmeps.2017.24.4.039

Fabrication and Electrical Insulation Property of Thick Film Glass Ceramic Layers on Aluminum Plate for Insulated Metal Substrate  

Lee, Seong Hwan (Nano Materials and Convergence Center, Korea Institute of Ceramic Engineering and Technology)
Kim, Hyo Tae (Nano Materials and Convergence Center, Korea Institute of Ceramic Engineering and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.4, 2017 , pp. 39-46 More about this Journal
Abstract
This paper presents the fabrication of ceramic insulation layer on metallic heat spreading substrate, i.e. an insulated metal substrate, for planar type heater. Aluminum alloy substrate is preferred as a heat spreading panel due to its high thermal conductivity, machinability and the light weight for the planar type heater which is used at the thermal treatment process of semiconductor device and display component manufacturing. An insulating layer made of ceramic dielectric film that is stable at high temperature has to be coated on the metallic substrate to form a heating element circuit. Two technical issues are raised at the forming of ceramic insulation layer on the metallic substrate; one is delamination and crack between metal and ceramic interface due to their large differences in thermal expansion coefficient, and the other is electrical breakdown due to intrinsic weakness in dielectric or structural defects. In this work, to overcome those problem, selected metal oxide buffer layers were introduced between metal and ceramic layer for mechanical matching, enhancing the adhesion strength, and multi-coating method was applied to improve the film quality and the dielectric breakdown property.
Keywords
planar heater; insulated metal substrate; ceramic film; delamination; breakdown voltage;
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Times Cited By KSCI : 2  (Citation Analysis)
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