• Title/Summary/Keyword: 방열성능

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Theoretical Analysis on Heat Transfer Characteristics and Heat Flux Performance in Ondol Systems of Dried Type (건식온돌시스템의 전열특성 및 방열성능에 관한 이론적 분석)

  • Jang, Yong-Sung;Yu, Ki-Hyung;Cho, Dong-Woo
    • Proceedings of the SAREK Conference
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    • 2007.11a
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    • pp.176-181
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    • 2007
  • This study aims to evaluate theoretically heat transfer characteristics and heat flux performance in ondol system of dried type is composed of panel of ceramics to improve of thermal conductivity and fin to expand heat. To this end, we analyzed effect of design factors(temperature of hot water, set temperature of room and thermal conductivity of finishing materials) in ondol system of dried type by heat transfer analysis. The main results of this study are summarized as follows; The deviation of heat flux and temperature was reduced by heat expansion from fin decreasing heat loss generated in air layer. The temperature and heat flux in upper finishing materials surface linearly increased according to temperature increment of hot water, but the temperature distribution in upper surface was assessed uneven. The greater heat resistance value of upper finishing materials, the deviation of maximum temperature and minimum temperature was decreased. Also, we suggested a basic design data about ondol system of dried type through an analysis of simulation results on heat transfer characteristics and heat flux performance.

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Optimization of Al 6063 Heat Sink using CFD Simulation and Comparative Analysis of Thermal Dissipation Properties with Thermal Conductive Polycarbonate (CFD전산모사를 이용한 Al 6063 Heat Sink 최적화 설계와 열전도성 Polycarbonate와의 방열성능 비교 분석)

  • Her, In-Sung;Lee, Se-Il;Lee, A-Ram;Yu, Young Moon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.28 no.7
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    • pp.19-25
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    • 2014
  • In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

A Study on the Method of Estimating Optimum Supply Water Temperature Considering the Heating Load and the Heat Emission Performance of Radiant Floor Heating Panel (난방부하와 온수온돌의 방열성능을 고려한 적정 공급온수온도 산출방법에 관한 연구)

  • Choi, Jeong-Min;Lee, Kyu-Nam;Ryu, Seong-Ryong;Kim, Yong-Yee;Yeo, Myoung-Souk;Kim, Kwang-Woo
    • Proceedings of the SAREK Conference
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    • 2006.06a
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    • pp.795-800
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    • 2006
  • A common approach to achieve better thermal comfort with hydronic radiant floor heating system is supply water temperature control. This is the control method through which supply water temperature is varied with outdoor temperature. In this study, a comprehensive, yet simple calculation method to find optimum supply water temperature is evaluated by combining heat loss from the building and heat emission from the hydronic radiant floor heating system. And then the control performance of suggested calculation method is confirmed through experiment. It is shown that indoor air temperature is stably maintained around the set point.

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Optimal Design of Guide Vane for Improvement of Heat Removal Performance of Electric Vehicles Battery Using Genetic Algorithm (유전 알고리즘을 활용한 전기 자동차 배터리 방열성능 향상을 위한 가이드 베인 최적설계)

  • Song, Ji-Hun;Kim, Youn-Jea
    • Journal of Auto-vehicle Safety Association
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    • v.14 no.1
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    • pp.55-61
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    • 2022
  • Along with global environmental issues, the size of the electric vehicle market has recently skyrocketed. Various efforts have been made to extend mileage, one of the biggest problems of the electric vehicles, and development of batteries with high energy densities has led to exponential growth in mileage and performance. However, proper thermal management is essential because these high-performance batteries are affected by continuous heat generation and can cause fires due to thermal runaway phenomena. Therefore, thermal management of the battery is studied through the optimal design of the guide vanes, while utilizing the existing battery casing to ensure the safety of the electric vehicles. A battery from T-company, one of a manufacturer of the electric vehicles, was used for the research, and the commercial CFD software, ANSYS CFX V20.2, was used for analysis. The guide vanes were derived through optimal design based on a genetic algorithm with flow analysis. The optimized guide vanes show improved heat removal performance.

A Study on the Optimum Design of Heat Sink for Radiant Heat of LED Lighting (LED 조명의 방열을 위한 히트싱크의 최적 설계에 관한 연구)

  • Jang, Han-I;Lee, Dong-Ryul
    • Proceedings of the KAIS Fall Conference
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    • 2012.05b
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    • pp.680-684
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    • 2012
  • 본 연구는 히트싱크의 효율적인 설계를 위하여 히트싱크 휜의 형상을 변화시켜 냉각성능에 대한 연구를 수행하였다. 휜의 형상을 Vertical, Round, S-Curve, Triangle의 네 가지와 휜의 개수를 16개와 64개로 설계해, 총 8가지로 설계 및 해석 하였다. 이와 같이 설계된 히트싱크는 Fluent 6.3.26 으로 수치해석 하였고, 해석 결과 약간의 형상을 변경하는 것 보다는 휜의 개수를 늘리는 것이 냉각성능을 높이는데 더 효과적인 것으로 드러났다. 히트싱크의 온도분포와 열전달계수에 대한 수치해석을 통해 휜의 개수가 64개이고 S-Curve의 형태에서 냉각성능이 가장 우수한 것으로 나타났다.

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Effects of Contact Resistance on temperature Rise in a MCCB (접촉저항이 배선용 차단기 내부 온도상승에 미치는 영향)

  • 박성규;이종철;김윤제
    • Journal of Energy Engineering
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    • v.13 no.1
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    • pp.12-19
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    • 2004
  • A Molded Case Circuit Breaker (MCCB) is an electric control device to interrupt the abnormal currents which result from the over-loads or short-circuits. Its malfunction will result in severe accidents. In the development of the MCCB, higher current-rating and improved thermal performance become more and more important in providing the safe function and reliability for the modern devices requiring small scale and high performance. It is also very important to consider the factors of temperature rise in the design of MCCB. The major reasons of temperature rise in the MCCB result from the resistances, which are come from the connection and contact surfaces. These resistances are influenced by current, time, configuration of contact surfaces and applied voltage. In order to predict the temperature distribution inside MCCB, we have simulated the model with some assumptions and simplifications, using commercial code ICEPAK. To verify the results of temperature field analysis, the numerical results are compared with experimental ones for the same model. The results show a good agreement with actual temperature rise obtained by experiments.

Power Conversion Unit for Hybrid Electric Vehicles (하이브리드 전기자동차 구동용 전력변환장치)

  • Lee, Ji-Myoung;Lee, Jae-Yong;Park, Rae-Kwan;Chang, Seo-Geon;Choi, Kyung-Soo
    • The Transactions of the Korean Institute of Power Electronics
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    • v.13 no.6
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    • pp.420-429
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    • 2008
  • This paper describes design procedure and control strategy of HDC(High side DC/DC Converter) and MCU(Motor Control Unit) for diesel hybrid electric vehicle. In designing HDC and MCU for HEV high power density and reliability is strongly needed to meet the demand of automotive industry. In order to achieve the high performance of a controller, MPC5554 based control board is developed. An optimized film capacitor and inductor are also developed for high efficiency driving. Skim 63 IGBT module of SEMIKRON for automotive is used for power switching device. The most efficient cooling model for optimal size and reliability were verified by simulation. These procedures are verified by bench or driving test and the results are present in this paper.

A Study of the Cooling Effect of an Evaporation-Type Cool Roof Fan (기화방열식 Cool Roof Fan의 냉풍효과에 대한 연구)

  • Kim, Yeong Sik;Chung, Hanshik;Jeong, Hyomin;Choi, Soon-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.3
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    • pp.191-200
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    • 2016
  • The ventilation effect of a ventilation system, which is classified as the forced ventilation and natural ventilation, is predominantly dependent on the combination of air supply and discharge. Perhaps the simplest ventilation is merely supplying the air as it is. However, to improve the indoor working environment during the summer, an air supply that is cooled to some extent has been widely adopted. Recently, a cooling method utilizing the vaporization of water was introduced. In this study, the performance of an evaporation-type air supply unit that was produced by Japan K-company and was installed in a shoe-manufacturing plant in Busan was investigated. The purpose of the experiment was to measure how much the supplied air could be cooled. From this experimental study, we confirmed that the evaporation-type air supply system is efficient, capable of improving the working environment during the summer while minimizing the energy cost.

Analysis of Characteristics on Small Air Conditioning Type Condenser (소형 공조용 응축기의 특성 해석)

  • 김재돌;장재은;윤정인
    • Journal of Energy Engineering
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    • v.8 no.1
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    • pp.14-22
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    • 1999
  • 본 연구는 일반적으로 소·중용량의 냉동·공조기에 많이 사용되고 있는 플레이트 핀 코일형 공냉응축기를 대상으로 수치해석에 의해 응축기의 특성을 파악하였다. 해석에서는 응축기를 과열증기영역, 2상영역 및 과냉각액영역으로 구분하여 공냉 응축기의 성능에 큰 영향을 미치고 있는 공기온도, 공기측열전달률, 입구 냉매온도, 응축온도 및 질량유량 등을 파라메터로하여 이들의 상호관계와 이들이 응축완료점까지의 거리 및 방열량 등에 미치는 영향을 파악하였다. 해석결과로는 해석모델로부터 각 영역의 냉매 상태량, 온도분포 및 열전달률을 구할 수 있었고, 일반적으로 응축기의 성능에 많은 영향을 미치는 각종 파라메터들을 중심으로 광범위한 동작조건에서 이들의 상관관계 및 특성을 파악하므로서 응축기 설계를 위한 기초 자료 및 설치장소나 주위환경 등에 따라 서로간에 다양한 영향을 미치는 실제장치의 동적특성 해석을 위한 자료를 얻을 수 있었다.

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Simulation of thermal design and thermoelectric cooling for 3D Multi-chip packaging (3D Multi-chip packaging 을 위한 열 설계 및 열전 냉각 성능 시뮬레이션)

  • Jang, B.;Hyun, S.;Kim, J.H.;Lee, H.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2009.10a
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    • pp.711-712
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    • 2009
  • MCP 기술을 이용한 반도체 칩에서 문제가 되는 방열문제를 해결하기 위한 방법으로 열전 냉각 소자를 이용하여 열을 방출 시키는 방법에 관하여 연구를 수행하였다. 시뮬레이션을 통하여 열전 소자가 작동할 때, 흡수하는 열량을 계산할 수 있었으며, 열전 소자의 냉각 성능도 평가 할 수 있었다. 이러한 열 해석 및 열전 해석을 통하여 적층 구조의 MCP 모듈을 위한 열 설계 및 효율적 냉각을 가능하게 할 수 있을 것이다.

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