• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.101-104
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• 2022

Mist-CVD is known to have advantages of low cost and high productivity compared to ALD and PECVD methods. It is capable of reacting to the substrate by misting an aqueous solution using ultrasonic waves under vacuum-free conditions of atmospheric pressure. In particular, Ga₂O₃ is regarded as advanced power semiconductor material because of its high quality of transmittance, and excellent electrical conductivity through N-type doping. In this study, Computational Fluid Dynamics were used to predict the uniformity of the thin film on a large-area substrate. And also the deposition pattern and uniformity were analyzed using the flow velocity and particle tracking method. The uniformity was confirmed by quantifying the deposition cross section with an FIB-SEM, and the consistency of the uniformity prediction was secured through the analysis of the CFD distribution. With the analysis and experimental results, the match rate of deposition area was 80.14% and the match rate of deposition thickness was 55.32%. As the experimental and analysis results were consistent, it was confirmed that it is possible to predict the deposition thickness uniformity of Mist-CVD.

• 한국광학회:학술대회논문집
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• 한국광학회 2003년도 제14회 정기총회 및 03년 동계학술발표회
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• pp.54-55
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• 2003

지금까지 반도체 장비 부품 세정을 위한 기존의 세정 방법중 가장 널리 사용되는 화학적 세정 방법은 다량의 유해 화학물질의 발생 및 후처리 문제, 비용문제, 열악한 작업 환경등과 같은 많은 문제를 노출시키고 있다. 이에 최근의 기술은 습식 세정에서 건식세정 방식으로의 기술 전이가 빠르게 이루어지고 있으며, 특히 레이저 광에 의한 건식 세정 기술은 다양한 오염 물질을 하나의 레이저 광원으로 제거할수 있으며, 기존의 습식 방법과 비교해 환경 친화적 청정 기술이고, 다른 건식 세정 기술인 드라이 아이스 및 플라즈마 세정 방법과 비교해 이동용으로 제작이 가능해 반도체 및 평판 디스플레이 생산공정에서 부품을 분리하지 않고 쉽게 세정을 하기 때문에 반도체 생산 현장에서 in-situ 세정으로 시간적, 경제적 이점이 대단히 크다. (중략)

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.60-60
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• 2013

공정용 플라즈마는 반도체 웨이퍼 가공, 평판형 디스플레이, 자동차 및 산업용 부품 코팅, 장식용 코팅에 널리 사용되고 있다. 이를 위한 장비 개발은 플라즈마에 대한 깊은 이해가 없이는 불가능하여 주로 선진 장비 회사의 모델을 참고하여 유사하게 만드는 수준에서 진행되어 왔는데 2D, 3D modeling이 가능한 전산 유체 모델은 일부 상용화 패키지 S/W까지 등장하였으나 플라즈마와 수치 해석에 대한 기본적인 지식이 없이는 사용이 매우 어렵다는 단점이 있어 국내의 일부소자회사의 장비 관련 연구팀 정도에서만 사용이 가능했다. 이를 중견 장비 업체들에 까지 확대하기 위한 작업의 일환으로 2D-ICP, 2D-CCP model의 기본적인 기능을 갖추고 기하적 크기는 파라미터 방식으로 사용자가 조절할 수 있도록 만든 framework을 개발하려는 시도에 대해서 논의 하고자 한다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2014년도 추계학술대회 논문집
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• pp.162-166
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• 2014

정밀 장비의 진동 허용치는 장비의 성능을 저하시키지 않는 외부 진동의 허용 범위를 의미하는 것으로 BBN 기준, NIST 기준 등이 있다. 반도체 및 디스플레이 산업 현장에서 주로 적용되는 BBN 기준을 평가하기 위해 측정시 측정자에 따라 상이한 결과가 발생하기도 한다. 이는 계측기의 설정 및 분석 방법 등 측정 방법의 차이에서 기인하는 것으로 관련된 측정 방법에 대한 가이드가 없기 때문인 것으로 보인다. 본 논문에서는 BBN 기준 평가를 위해 정밀 장비의 진동 허용치를 측정시 분석 방법, 평균화 방법 및 등급 판정 방법에 대한 가이드를 제안한다.

• 반도체디스플레이기술학회지
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• 제4권3호
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• pp.29-33
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• 2005

As the integrated devices become more and more sophistcated, the diameter of wafers increased up to 300 mm and strict level of cleaning is necessary to remove the particulates on the surface of wafer. Therefore we need a new type of wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is important to control the temperature and the concentration of chemical in the wet-station. In the conventional chemical supply system, it is difficult not only to fit the mixing rate of chemicals in cleaning process, but also to fit the quantity and temperature. Thus, we propose a new chemicals supply system, which overcomes above problems by the analysis of fluid and thermal transfer on chemical supply system.

• 반도체디스플레이기술학회지
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• 제11권4호
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• pp.13-18
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• 2012

The semiconductor equipments generate a lot of data traffic via communication channels for the effective manufacturing processes of semiconductors and for the automation of semiconductor equipments. These data should be sent to a host computer in order to keep in a safe. The IEEE 802.11e specification gives differentiated and distributed access to a wireless communication medium with four access categories. These four access categories use different priority parameters which lead to quality of service in data traffic. In this paper, it is shown that the throughput of data depends upon the priority parameters provided by IEEE802.11e. We implement the usage of priority parameters in the SECS protocol for semiconductor equipments. It is necessary that the data from semiconductor equipments should be classified with certain priority for the effective use of our proposed method. Therefore, our scheme will contribute to improving the performance of the manufacturing processes of semiconductors.

• 반도체디스플레이기술학회지
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• 제10권2호
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• pp.13-17
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• 2011

We have developed a new energy-consuming monitoring system that has made it possible to measure the energy consumption of a gas scrubber, one of semiconductor processing equipments, and installed this system to the gas scrubber under operating at a manufacture site. Using this system, we have measured consumptions of electric power and processing gas consumed at standby to operating mode. In case of the gas scrubber, processing gas flows continuously into it at standby and operating mode. Therefore, if the electric power has been supplied, the processing gas can flows into the device for 24 hours. Moreover, at operating of gas scrubber, the amount of electricity consumption is 5 kWh. At Standby of gas scrubber, it spends 3kwh. It is certain that the energy consumption is greater at operating mode than at standby mode. The carbon emission rates from 24 hour gas scrubber operation are 236 $kgCO_2$/day of $N_2$, 57 $kgCO_2$/day of electric power and 0.001 $kgCO_2$/day of cooling water. Most of carbon is emitted from $N_2$ gas and electric power consumption.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.92-95
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• 2019

Automation control and the data for control of industrial equipment for the diagnosis and prediction is a key to success in the 4th industrial revolution. It increases process efficiency and productivity through data collection, realtime monitoring, and the data analysis. However, university and research environment are still suffering from logging the data in manual way, and we occasionally loss the equipment data logging due to the lack of automatic data logging system. State variable presents the current condition of the equipment operation which is closely related to process result, and it is valuable to monitor and analyze the data for the equipment health monitoring. In this paper, we demonstrate the collection of equipment state variable data via programmable logic controller (PLC) and the visualization of the collected data over the Web access supervisory control and data acquisition (SCADA). Test vehicle for the implementation of the suggested SCADA system is a relay switched physical vapor deposition system in the university environment.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.40-45
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• 2019

The smart factory has developed with the help of several technologies such as automation, artificial intelligence, big data, smart sensors and communication protocols. The Internet of things(IOT) among communication protocols has become the key factor for the seamless integration of various manufacturing equipment. Therefore, it is important that the IOT cooperate with the standards of communication protocols proposed by the SEMI in the semiconductor industry. In this paper, we suggest a novel reference model of the communication protocols for semiconductor equipment by introducing an IOT service layer. With the IOT service layer, we can use the functions and the additional services provided by the IOT standards that give the inter-operability between factory machines and host computers. We implement the standard of the communication protocols for semiconductor equipment with the IOT service layer by using ns3 simulator. It concludes that it is necessary to provide the platform for the IOT service layer to deploy efficiently the proposed reference model of the communication protocols.

• 반도체디스플레이기술학회지
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• 제20권3호
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• pp.152-156
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• 2021

Cartesian robot is used in semiconductor manufacturing. Friction between steel band and mover wears the steel band. The emission of wear particle from steel band contaminates semiconductor equipment. At the manufacturing site, the steel band is replaced periodically to minimize the generation of wear particle. But this is not a good way to minimize the generation of wear particle, because it is hard to specify the moment of replacement. We suggested the methodology to minimize the generation of wear particle using TRIZ technique. Also we made prototype robot which the solution is applied, and the performance of the solution was verified through experiments. As a result of verification, it was confirmed that the solution significantly reduced the generation of wear particle compared to the standard way.