• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.12 no.1
• /
• pp.65-70
• /
• 2001

This paper presents a Receiver MMIC for the CDMA terminal. The complete circuit is composed of Low Noise Amplifier, Down Conversion Mixer, Intermediate Frequency Amplifier and Bias circuit. The Bias circuit implementation, which allows for compensation for threshold voltage and power supply voltage variation are provided. The proposed topology has high linearity and low noise characteristics. Results of the designed circuit are as follows: Overall conversion gain is 28.5 dB, input IP3 of LNA is 8 dBm, input IP3 of down conversion mixer is 0 dBm and total DC current consumption is 22.1 mA.

• Journal of Korea Society of Industrial Information Systems
• /
• v.12 no.2
• /
• pp.79-84
• /
• 2007

This papar reports design and fabrication of CMOS temperature control circuit using MOSIS 0.25um-3.3V CMOS technology. The proposed circuit has a temperature coefficient of $13mV/^{\circ}C$ for a wide operating temperature range with a good linearity. Furthermore, the temperature coefficient of output voltage can be controlled by adjusting external bias voltage. This circuit my be applicable to the design of one-chip IC where quartz crystal resonator is mounted on CMOS oscillator chips.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.8 no.6
• /
• pp.1158-1165
• /
• 2004

This paper describes the design of a two stage 1V power supply SiGe Low Noise Amplifier operating at 5.25㎓ for 802.lla wireless LAN application. The achieved performance includes a gain of 17㏈, noise figure of 2.7㏈, reflection coefficient of 15㏈, IIP3 of -5㏈m, and 1-㏈ compression point of -14㏈m. The total power consumption of the circuit was 7㎽ including 0.5㎽ for the bias circuit.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.49 no.9
• /
• pp.244-250
• /
• 2012

This paper describes a 4-Gb/s receiver circuit for a low-swing ground-referenced differential signaling system. The receiver employs a common-gate level-shifter and a continuous linear equalizer which compensates inter-symbol-interference (ISI) and improves voltage and timing margins. A bias circuit maintains the bias current of the level-shifter when the common level of the input signal changes. The receiver is implemented with a low-power 65-nm CMOS technology. When 4-Gb/s 400mVp-p signals are transmitted to the receiver through the channel with the attenuation of -19.7dB, the timing margin based on bit error rate (BER) of $10^{-11}$ is 0.48UI and the power consumption is as low as 0.30mW/Gb/s.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.17 no.8 s.111
• /
• pp.732-738
• /
• 2006

Divide-by-2 and divide-by-4 circuits which can operate up to 10 GHz are designed. A design method used in these circuits is the TSPC(True Single Phase Clocking) topology. The structure of the TSPC dividers is very simple because they need only a single clock and purely consist of smalt sized cmos devices. Through measurements, we find the fact that in proportion to the bias voltage, the free running frequency increases and the operation region also moves toward a higher frequency region. For operating conditions of bias voltage $3.0{\sim}4.0V$, input power 16dBm and dcoffset $1.5{\sim}2.0V$, 5 GHz and 2.5 GHz output signals divided by 2 and 4 are measured. The layout size of the divide-by-2 circuit is about $500{\times}500 um^2$($50{\times}40um^2$ except pad interconnection part).

• Journal of IKEEE
• /
• v.24 no.1
• /
• pp.59-66
• /
• 2020

In this study, the characteristics of ITO thin film was investigated to finding a low cost and highly transparent electrodes for display of mobile communication devices. The ITO film was deposited by DC magnetron sputter. The experimental conditions were changed as follows: 1. ambient pressure changed 1 to 3 mTorr with 1mTorr step, 2. bias electric voltage changed with 10V step. The chamber was pumped out by rotary pump until 10^-3Torr then the diffusion pump was used to lower the pressure of 10^-6Torr. The results shows us the film growth was obvious when the bias voltage was larger than 300V, but the overall thickness tendency was existed: the more voltage is the thicker thickness. At 330V bias voltage condition, the deposition rate was the largest and apparent grain was showed.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2000.02a
• /
• pp.75-75
• /
• 2000

플라즈마 화학증착법(Plasma Enhanced Chemical Vapor Deposition, PECVD)을 이용하여 양질의 Si3N4 금속-유전막-금속(Metal-Insulator-Metal, MIM) 커페시터를 구현하였다. Fig.1에 나타낸 바와 같이 p형 실리콘 웨이퍼의 열 산화막 위에 1%의 실리콘을 함유하는 알루미늄을 스퍼터링으로 증착하여 전극을 형성하고 두 전극사이에 Si3N4 박막을 증착하여 MIM구조의 박막 커패시터를 제조하였다. Si3N4 유전막은 150Watt의 RF 출력하에서 반응 가스 N2/SiH4/NH3를 각각 300/10/80 sccm로 흘려주어 전체 압력을 1Torr로 유지하면서 40$0^{\circ}C$에서 플라즈마 화학증착법을 이용하여 증착하였으며, Al과 Si3N4 층의 계면에는 Ti과 TiN을 스퍼터링으로 증착하여 확산 장벽으로 이용하였다. 각 시편의 커패시턴스 및 바이어스 전압에 따른 누설 전류의 변화는 LCR 미터를 이용하여 측정하였고 각 시편의 커패시턴스 및 바이어스 전압에 따른 누설 전류의 변화는 LCR 미터를 이용하여 측정하였고 각 시편의 유전 특성의 차이점을 미세구조 측면에서 이해하기 이해 극판과 유전막의 단면 미세구조를 투과전자현미경(Transmission Electron Microscope, TEM)을 이용하여 분석하였다. 유전체인 Si3N4 와 전극인 Al의 계면반응을 억제시키기 위해 TiN을 확산 장벽으로 사용한 결과 MIM커패시터의 전극과 유전체 사이의 계면에서는 어떠한 hillock이나 석출물도 관찰되지 않았다. Fig.2와 같은 커패시턴스의 전류-전압 특성분석으로부터 양질의 MIM커패시터 특성을 f보이는 Si3N4 의 최소 두께는 500 이며, 그 두께 미만에서는 대부분의 커패시터가 전기적으로 단락되어 웨이퍼 수율이 낮아진다는 사실을 알 수 있었다. TEM을 이용한 단면 미세구조 관찰을 통해 Si3N4 층의 두께가 500 미만인 커패시터의 경우에 TiN과 Si3N4 의 계면에서 형성되는 슬릿형 공동(slit-like void)에 의해 커패시터의 유전특성이 파괴된다는 사실을 알게 되었으며, 이러한 슬릿형 공동은 제조 공정 중 재료에 따른 열팽창 계수와 탄성 계수 등의 차이에 의해 형성된 잔류응력 상태가 유전막을 기준으로 압축응력에서 인장 응력으로 바뀌는 분포에 기인하였다는 사실을 확인하였다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2014.10a
• /
• pp.569-572
• /
• 2014

This paper presents a CMOS switched-capacitor interface circuit for MEMS capacitive sensors. It consist of a capacitance to voltage converter(CVC), a second-order ${\Sigma}{\Delta}$ modulator, and a comparator. A bias circuit is also designed to supply constant bias voltages and currents. This circuit employes the correlated-double-sampling(CDS) and chopper-stabilization(CHS) techniques to reduce low-frequency noise and offset. The designed CVC has a sensitivity of 20.53mV/fF and linearity errors less than 0.036%. The duty cycle of the designed ${\Sigma}{\Delta}$ modulator output increases about 5% as the input voltage amplitude increases by 100mV. The designed interface circuit shows linearity errors less than 0.13%, and the current consumption is 0.73mA. The proposed circuit is designed in a 0.35um CMOS process with a supply voltage of 3.3V. The size of the designed chip including PADs is $1117um{\times}983um$.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.16 no.10
• /
• pp.2237-2246
• /
• 2012

A bias circuit required for an oral sensor is manufactured inside the oral sensor chip to reduce its size and cost. The proposed DC-DC converter supplies the required reference and bias currents for their corresponding regulators by using IREF of the reference current generator. Their target voltages of the voltage regulators are regulated by the negative mechanism by generating their reference voltages required for their corresponding regulators. In addition, a constant current IB0/IB1 is supplied by being mirrored by a current mirror ratio and then VREF is generated. It is confirmed by measurements that the average volatge, ${\sigma}$, and $4{\sigma}$ of the designed DC-DC converter for intra oral sensors with a $0.18{\mu}m$ X-ray CMOS process are within their required ranges. And the line-pair pattern image shows a high-resolution characteristic without blurring. Also, a good oral image can be obtained.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.3 no.3
• /
• pp.569-577
• /
• 1999

A wideband RF receiver for satellite mobile communications system was fabricated and evaluated of performance in low noise amplifier and high gain amplifier. The low noise amplifier used to the resistive decoupling and self-bias circuits. The low noise amplifier is fabricated with both the RF circuits and the self-bias circuits. Using a INA-03184, the high gain amplifier consists of matched amplifier type. The active bias circuitry can be used to provide temperature stability without requiring the large voltage drop or relatively high-dissipated power needed with a bias stabilized resistor. The bandpass filter was used to reduce a spurious level. As a result, the characteristics of the receiver implemented here show more than 55 dB in gain, 50.83 dBc in a spurious level and less than 1.8 : 1 in input and output voltage standing wave ratio(VSWR), especially the carrier to noise ratio is a 43.15 dB/Hz at a 1 KHz from 1537.5 MHz.