• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.5-13
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• 2000

지금까지의 기계산업의 발달은 대규모의 플랜트 혹은 대형기계 개발 등 대형화를 추구해왔다. 그러나, 최근 에너지와 환경에 대한 인식과 정보 통신, 전자산업, 생명산업의 발달로 소형화와 미세화의 기술 개발이 요구되고 있다. 그 예로 크기가 micron혹은 sub-millimeter 단위인 초소형기계 (Micro Machine)이 등장하게 되었고, 이러한 부품 및 시스템을 제작하는 미세 가공 기술을 Micro Machining이라고 할 수 있다.(중략)

• Ceramist
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• v.7 no.3
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• pp.28-33
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• 2004

1987년 미국 버클리 대학의 연구진은 반도체 미세공정 기술을 이용해 머릿카락 굵기의 초소형 모터를 발표하였다(Fig. 1).1) 이는 MEMS(Micro Electro Mechanical System, 혹은 MST , Micro System Technology)라는 새로운 학문 분야의 실질적 효시로, 명실공히 마이크론 단위의 기계-전자 시스템의 구현이라는 새로운 장을 열게되었다. (중략)

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.12
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• pp.113-118
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• 2020

Recently, eco-friendly electric motorcycles have been considered to replace aging gasoline motorcycles to reduce the amount of suspended fine dust in air. However, existing rechargeable battery-powered electric motorcycles have been found unacceptable by users because of their many limitations, such as long charging time, short travel distance per charge, and low driving speed. To overcome the drawbacks of conventional electric motorcycles, this paper proposes an exchangeable battery-powered electric motorcycle and a new frame shape for housing the exchangeable battery. The proposed frame is similar to that of current electric motorcycles; however, the shape and position of the saddle support, battery, and controller mount section are redesigned. The safety of the presented frame is verified through static and dynamic analyses using ABAQUS. In particular, the dynamic analysis is conducted under the most extreme condition among the various operating situations, thus confirming the robustness of the proposed frame design.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.5
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• pp.496-501
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• 2009

In micro electrochemical machining(micro-ECM), it is important to measure and control the potential of a tool electrode and a workpiece electrode because electrochemical reaction rate depends on the potential of the electrodes. When the electrode potential was measured against a reference electrode, the error of measured electrode potential could be minimized by proper tool electrode design. In this paper, multi-function electrodes consisting of a tool electrode and a reference electrode was fabricated by micro fabrication techniques. The machining conditions in micro-ECM using multi-function electrodes, such as pulse voltage parameters and electrode potential, were investigated.

• Proceedings of the Korea Information Processing Society Conference
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• 2022.11a
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• pp.952-954
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• 2022

본 연구에서는 스마트 홈 솔루션 IoT 허브 시스템의 하드웨어를 개발한다. IoT를 통해 스마트기기의 상태를 모니터링하다가, 특정 센싱값을 받으면 제어를 통해 스마트기기를 제어할 수 있도록 개발한다. 미세먼지 측정과 온습도를 조절하고, 가정 온도를 측정하여 전자제품의 전원을 조절하는 등 홈을 자동 제어하기 위한 소프트웨어도 함께 개발한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.68-68
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• 2009

최근 디스플레이 산업의 발달로 LCD 판넬의 수요가 급증함에 따라 검사장치 분야도 동반 성장하고 있다. LCD 검사를 위한 probe unit은 미세전기기계시스템 (MEMS) 공정을 이용하여 제작된다. 본 연구에서는 probe card의 미세 슬릿을 제작하기 위한 Si 깊은 식각 공정을 수행하였다. 공정에 사용된 장비는 STS 사의 D-RIE 시스템으로 식각가스로 $SF_6$, passivation용으로 $C_4F_8$ 가스를 각각 사용하였다. 식각용 마스크는 $30{\sim}50{\mu}m$의 선폭을 probe card의 패턴에 따라 제작되었으며, 분석은 SEM 측정을 이용하였다. 식각 공정 중 발생하는 scallop은 시료를 oxidation 시켜 $SiO_2$ 층을 형성한 후에 식각용액에 에칭하여 제거하였다. 제거전 scallop의 크기는 약 120 nm에서 제거후 약 $50{\mu}m$로 크게 개선됨을 SEM 사진으로 확인하였다.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• Journal of Dental Rehabilitation and Applied Science
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• v.29 no.3
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• pp.290-298
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• 2013

It will be possible to predict the success and failure of the prosthodontic treatment and prevent clinical complications if the oral environment including prostheses and their supporting teeth and periodontium can be monitored in real time. The aim of this report is to introduce the concept of a smart prosthesis, which monitors specific factors in the oral cavity, and investigate its feasibility through a literature review of MEMS (Micro-electro-mechanical System) and Biosensing.

• Composites Research
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• v.20 no.5
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• pp.43-48
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• 2007

The absorption and the interference shielding of electromagnetic wave have been very important issues for commercial and military purposes. The stealth technique is one of the most typical applications of electromagnetic wave absorption technology. This study has started for the development of composite fillers containing dielectric and magnetic lossy materials. To improve the electromagnetic characteristics of conductive nano fillers, carbon nanofibers (CNFs) with nickel-phosphorous (Ni-P) or nickel-iron (Ni-Fe) have been fabricated by the electroless plating process. Observations by the electron microscopy (SEM/TEM) and element analyzer (EDS/ELLS) showed the uniform Ni-P and Ni-Fe coated CNFs. The compositions of the plating layers were about Ni-6wt%P and Ni-70wt%Fe, respectively. The average thicknesses of the plating layers were about $50\;{\sim}\;100\;nm$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.228-229
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• 2006

본 연구에서는 초음파 모터 등의 고출력 액츄에이터에 응용 가능한 $04Pb(Ni_{1/3}Nb_{2/3})O_3-6Pb(Zr_xTi_{1-x})O_3$ 조성시스템에 소결온도를 달리하여 압전, 유전특성 및 미세구조에 관해 고찰하였다. 본 조성을 $1200^{\circ}C$ 온도에서 2, 4, 6, 8시간 소결하여 시편을 제조하였으며 이의 결정구조 및 미세조직을 분석하였다. 소결시간 증가에 따라 전기기계결합계수와 기계적품질계수는 증가하였으며, 압전상수는 Zr(Zr+Ti)비 0.390까지 증가하였으나 그 이상 증가함에 따라 감소하였다. 압전특성은 $1200^{\circ}C$에서 4시간 소결한 Zr=0.390인 조성에서 ${\varepsilon}_r$ = 4487, $k_p$ = 0.72. $d_{33}$ = 710, $Q_m$ =109의 우수한 특성을 나타내었다.