• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1100-1106
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• 2008

In this study, we presented rapid and simple fabrication method of functionalized surface on various substrates as a universal platform for the selective immobilization of cells. The functionalized surface was achieved by using deposition of polyelectrolyte such as poly(allyamine hydrochloride) (PAH), poly(diallyldimethyl ammonium chloride) (PDAC), poly(4-ammonium styrene sulfonic acid) (PSS), poly(acrylic acid) (PAA) and fabrication of poly(ethylene glycol) (PEG) microstructure through micro-molding in capillaries (MIMIC) technique on each glass, poly(methyl methacrylate) (PMMA), polystyrene (PS) and poly(dimethyl siloxane) (PDMS) substrate. The polyelectrolyte multilayer provides adhesion force via strong electrostatic attraction between cell and surface. On the other hand, PEG microstructures also lead to prevent non-specific binding of cells because of physical and biological barrier. The characteristic of each modified surface was examined by using static contact angle measurement. The modified surface onto several substrates provides appropriate environment for cellular adhesion, which is essential technology for cell patterning with high yield and viability in the micropatterning technology. The proposed method is reproducible, convenient and rapid. In addition, the fabrication process is environmentally friendly process due to the no use of harsh solvent. It can be applied to the fabrication of biological sensor, biomolecules patterning, microelectronics devices, screening system, and study of cell-surface interaction.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.81-87
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• 2011

In this study, UV curing and crosslinking process was introduced for synthesis of acrylic foam tape that can be applied to the the automotive assembly process. Polymerized adhesive are laminated to baseform and varying the thickness of specimens were prepared. To measure basic mechanical properties, stainless steel was used. And in the test peel, dynamic shear and t-block were used. The acrylform adhesive show better results compare with typical adhesive and the properties depand on external factors - thick, wetting time -. To analysis functions of acrylic foam adhesive used to automobile production, evaluate the adhesive properties on the various plastic substrate. In PP and PE are categorized low surface energy materials, their properties have not been expressed. But dynamic shear tests show that some properties could be expressed by the difference break mechanism.

• Journal of the Korean Recycled Construction Resources Institute
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• v.4 no.2
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• pp.101-111
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• 2016

It is possible that aggregates add on to geopolymer based fly ash to mix mortar and concrete like cement. This is necessary to evaluate mineral composition, particle shape, surface, size distribution, density and absorption ratio for fine aggregates due to few detailed research to examine influence of fine aggregates properties on unhardened geopolymer concrete. In this research, used two different fine aggregates, Jumunjin sand(having quartz, mica, feldspar, pyroxene in mineral composition, more than 96% of total size between -0.60 and +0.30mm, angular shape and rough surface) and ISO sand(having almost all quartz in mineral composition, more than 51% size between -1.40 and +0.60mm, simultaneously varied size distribution, spherical shape and smooth surface). After an experimental result of the varied ratio of Si/Al=1.0-4.1 geopolymer paste, mix proportion respectively applied Si/Al=1.5 having the highest compressive strength to mortar and Si/Al=3.5 having the highest consistency to concrete. Geopolymer mortar by mixing with Jumunjin and ISO sand in varied range of 20-50wt.% showed flow size increase between 69.5 and 112.0mm, between 70.5 and 126.0mm respectively. Geopolymer concrete at an addition of 77wt.% of total aggregates ratio showed that average compressive strength was 32MPa and the consistency was favorable to molding. Since ISO sand observing varied size distribution, spherical shape, smooth surface, low absorption ratio resulted in advantageous properties on consistency of geopolymer, geopolymer concrete can be suitable for using the fine aggregates similar to ISO sand.