• Proceedings of the Korean Information Science Society Conference
• /
• 2012.06a
• /
• pp.245-247
• /
• 2012

최근 멀티코어 프로세서의 활용이 대중화되고 있다. 멀티코어 시스템에서는 소프트웨어가 동시에 여러 코어를 사용하여 동작을 수행 할 때 성능 향상 효과를 얻을 수 있다. 즉, 하나의 소프트웨어가 여러 코어를 동시에 사용할 수 있는 멀티스레드 프로그래밍 기법을 사용할 때 성능을 높일 수 있다. 이러한 환경에서 효율적인 메모리 할당은 데스크톱, 서버 및 과학 등과 같은 응용에 매우 중요하다. 하지만, 동적으로 메모리를 할당하는 것은 메모리 할당 연산과 반환 연산 및 어떤 스레드가 다른 스레드의 힙 영역에 접근하는 것을 처리하기 위한 동기화 문제로 인한 오버헤드가 발생하여 성능에 영향을 끼치는 문제가 발생하게 된다. 따라서 이와 같은 환경에서 실제로 성능에 어느 정도 영향을 끼칠 것인가를 측정할 수 있는 도구가 필요하다. 이에 멀티코어 환경에서 멀티스레드 기법을 사용하여 메모리 할당 연산이 성능에 어떠한 영향을 끼치는지를 측정 및 평가할 수 있는 시뮬레이터인 MAES(Memory Allocation Evaluation Simulator)를 설계하고 구현한다.

• The KIPS Transactions:PartA
• /
• v.17A no.6
• /
• pp.265-274
• /
• 2010

As the process technology scales down and integration densities continue to increase, interconnection has become one of the most important factors in performance of recent multi-core processors. Recently, to reduce the delay due to interconnection, 3D architecture has been adopted in designing multi-core processors. In 3D multi-core processors, multiple cores are stacked vertically and each core on different layers are connected by direct vertical TSVs(through-silicon vias). Compared to 2D multi-core architecture, 3D multi-core architecture reduces wire length significantly, leading to decreased interconnection delay and lower power consumption. Despite the benefits mentioned above, 3D design technique cannot be practical without proper solutions for hotspots due to high temperature. In this paper, we propose three floorplan schemes for reducing the peak temperature in 3D multi-core processors. According to our simulation results, the proposed floorplan schemes are expected to mitigate the thermal problems of 3D multi-core processors efficiently, resulting in improved reliability. Moreover, processor performance improves by reducing the performance degradation due to DTM techniques. Power consumption also can be reduced by decreased temperature and reduced execution time.

• Proceedings of the Korea Information Processing Society Conference
• /
• 2013.05a
• /
• pp.102-105
• /
• 2013

최근 멀티코어 시스템은 컴퓨터의 성능을 향상시키기 위해 더 많은 수의 코어를 연결시키는 다중코어 시스템으로 발전하고 있다. 그러나 멀티코어 시스템은 사용하는 코어의 아키텍처 구조와 개수에 따라 성능 차이가 발생한다. 이에, 본 논문에서는 코어의 아키텍처 구조와 코어의 개수가 성능에 미치는 영향을 분석하기 위해 Tilera의 다중코어 시스템인 Tile-Gx36, TilePro64와 Intel의 x86-64 멀티코어 시스템인 Core i5의 성능을 비교하였다. 코어의 사용률이 늘어남에 따른 성능차이를 알아보기 위해 벤치마크 프로그램인 SPEC CPU 2006을 이용하여 각 시스템 내 단일코어의 성능을 측정하고, OpenMP 벤치마크 프로그램을 이용하여 시스템의 모든 코어를 사용했을 때의 입력 데이터 크기에 따른 성능을 측정하였다. 실험 결과, 단일코어에서의 성능은 정수형 데이터를 사용하여 측정하였을 경우 Core i5가 Tile-Gx36보다 약 87%, 실수형 데이터를 사용하여 측정하였을 경우 약 94% 더 빠른 것으로 나타났다. 그러나 코어 전체를 이용한 성능 결과에서는 정수형 배열 크기가 이상일 경우 Tile-Gx36 시스템의 처리 속도가 Core i5 시스템 보다 평균적으로 약 7.6배 향상됨을 확인할 수 있었다. 따라서 Tilera의 다중코어 시스템은 클럭 속도와 아키텍처 구조의 영향으로 단일코어의 성능은 떨어지나, 병렬 처리를 이용한 고속연산에서는 성능이 향상된다고 할 수 있다.

• The KIPS Transactions:PartA
• /
• v.15A no.5
• /
• pp.259-268
• /
• 2008

Multi-Core processors have become main-stream microprocessors in recent years. Servers based on these multi-core processors are widely adopted in High Performance Computing (HPC) and commercial business applications as well. These servers provide increased level of parallelism, thus can potentially boost the performance for applications. However, the shared resources among multiple cores on the same chip can become hot spots and act as performance bottlenecks. Therefore it is essential to optimize the use of shared resources for high performance and scalability for the multi-core servers. In this paper, we conduct experimental studies to analyze the positive and negative effects of the resource sharing on the performance of HPC applications. Through the analyses we also characterize the performance of multi-core servers.

• Journal of KIISE
• /
• v.44 no.5
• /
• pp.469-475
• /
• 2017

The emerging NVMe-based multi-queue SSDs provides a high bandwidth by parallel I/O, i.e., each core performs I/O through its dedicated queue in parallel with other cores. To provide a bandwidth share for each application with I/O, a fair-share scheduler that provides a bandwidth share to each core is required. In this study, we proposed a multi-core scalable fair-queuing algorithm for multi-queue SSDs. The algorithm adopts randomization to minimize the inter-core synchronization overheads and provides a weight-proportional bandwidth share to each core. The results of our experiments indicated that the proposed algorithm gives accurate bandwidth partitioning and outperforms the existing FlashFQ scheduler, regardless of the number of cores for a Linux kernel with block-mq.

• Journal of IKEEE
• /
• v.17 no.4
• /
• pp.564-569
• /
• 2013

The current embedded devices are growing rapidly in the multi-core, and these demand fast boot time. But method of previous boot uses core only one. The method includes parallel techniques and modification of CPU Frequency policy. Parallel methods, after analyzing the Android boot process with analysis tool, applied to location where a lot of CPU operation. CPU Frequency policy is modified for high performance of core. The proposed method was applied to S5PV310 dual core and Exynos4412 quad core embedded system. As a result of the experiment, we found that the proposed method makes boot time fast about 20.71% and 31.34% in dual core and quad core environment as compared with the previous method.

• Electronics and Telecommunications Trends
• /
• v.28 no.2
• /
• pp.1-10
• /
• 2013

1980년대와 1990년대가 서버와 데스크톱 중심 컴퓨팅의 시대였다고 한다면 2000년대 들어 모바일 분야를 포함하는 임베디드 프로세서 시장이 급격히 확장되며 임베디드 중심 시대로 산업구조가 재편되고 있다. 그리고, 2010년대에는 임베디드 프로세서 시장이 더욱 확대되고 기술도 더불어 발전되고 있는데, 최근 기술을 주도하고 있는 뜨거운 용어 중의 하나가 이기종 멀티코어 컴퓨팅이라 할 수 있다. 시장이 요구하는 고성능 컴퓨팅을 수용하고 임베디드 기기의 특성상 저전력을 실현해야 하는 현실적 문제를 해결하기 위한 이기종 멀티코어 하드웨어가 임베디드 기기에도 적용을 앞다투고 있는 상황이며, 적절한 응용 콘텐츠에 맞춰 이기종 멀티코어 하드웨어를 활용하기 위한 소프트웨어에 대한 관심과 발전도 발 맞춰 진행되고 있다. 이에 본고에서는 임베디드 기기 분야에 한정하여 이기종 멀티코어 하드웨어와 소프트웨어의 기술 동향을 살펴보고자 한다.

• Journal of the Korea Society of Computer and Information
• /
• v.15 no.11
• /
• pp.1-9
• /
• 2010

As the process technology scales down, an interconnection has became a major performance constraint for multi-core processors. Recently, in order to mitigate the performance bottleneck of the interconnection for multi-core processors, a 3D integration technique has drawn quite attention. The 3D integrated multi-core processor has advantage for reducing global wire length, resulting in a performance improvement. However, it causes serious thermal problems due to increased power density. For this reason, to design efficient 3D multi-core processors, thermal-aware design techniques should be considered. In this paper, we analyze the temperature on the 3D multi-core processors in function unit level through various experiments. We also present temperature characteristics by varying application features, cooling characteristics, and frequency levels on 3D multi-core processors. According to our experimental results, following two rules should be obeyed for thermal-aware 3D processor design. First, to optimize the thermal profile of cores, the core with higher cooling efficiency should be clocked at a higher frequency. Second, to lower the temperature of cores, a workload with higher thermal impact should be assigned to the core with higher cooling efficiency.

• KIPS Transactions on Computer and Communication Systems
• /
• v.4 no.5
• /
• pp.153-160
• /
• 2015

The effectiveness of multicores depends on how well a scheduler can assign tasks onto the cores efficiently. In a heterogeneous multicore platform, the execution time of an application depends on which core it executes on. That is to say, the effectiveness of task assignment is one of the important components for a multicore systems' performance. This work proposes a load scheduling technique that analyzes execution time of each task by profiling. The profiling result provides a basic information to predict which task-to-core mapping is likely to provide the best performance. By using such information, the proposed technique is about 26% performance gain.

• Journal of the Korea Society of Computer and Information
• /
• v.16 no.6
• /
• pp.1-10
• /
• 2011

In designing multi-core processors, interconnection delay is one of the major constraints in performance improvement. To solve this problem, the 3-dimensional integration technology has been adopted in designing multi-core processors. The 3D multi-core architecture can reduce the physical wire length by stacking cores vertically, leading to reduced interconnection delay and reduced power consumption. However, the power density of 3D multi-core architecture is increased significantly compared to the traditional 2D multi-core architecture, resulting in the increased temperature of the processor. In this paper, the floorplan methods which change the forms of vertical placement of the core and the level-2 cache are analyzed to solve the thermal problems in 3D multi-core processors. According to the experimental results, it is an effective way to reduce the temperature in the processor that the core and the level-2 cache are stacked adjacently. Compared to the floorplan where cores are stacked adjacently to each other, the floorplan where the core is stacked adjacently to the level-2 cache can reduce the temperature by 22% in the case of 4-layers, and by 13% in the case of 2-layers.