• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.5
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• pp.474-482
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• 1992

This paper describes the speed control system of an induction type ac servomotor drive on the vector control basis of slip frequency and constant secondary flux control for a quick torque response. The system is composed of a digital controller using a SCB-V50 microprocessor and a PWM inverter with power MOSFETs for high speed switching. And, for the measurement of actual instantaneous currents, MDCS A070-051 hall sensors are employed. The rising time of step responce by this system through the test of a 600[W] ac servomotor is 30[ms]. Overall experimental result shows that the drive performance of the system is similar to that of a separately excited armature current control of a dc motior.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.5
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• pp.421-426
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• 2008

The magnetic bio-sensor used the PHR (planar hall resistance) effect generated by the free layer in spin-valve giant magnetoresistance structure of Ta/NiFe/CoFe/Cu/NiFe/IrMn/Ta. The PHR element with micrometer size was fabricated through the photolithograph and dry etching process. The PHR signal with magnetic field was measured under the conditions of with and without single magnetic bead. A single magnetic bead of diameter $2.8\;{\mu}m$ was successfully detected using the PHR sensor. Therefore, the high resolution PHR sensor can be applied to bio-sensor application utilizing the output voltage variation of the PHR signals in the presence and absence of a single magnetic bead.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.41-44
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• 2014

In this paper, we will investigate the activation energies of Nb for $TiO_2$ using Hall effect measurement and photoluminescence (PL) system. Nb-doped $TiO_2$ thin film was grown on $SrTiO_3$ substrate by pulsed laser deposition (PLD) technique. After measurements, activation energies of niobium donor were 14.52 meV in Hall effect measurement, and 6.72 meV in PL measurement, respectively. These results showed different tendencies which are measured from the samples with acceptor materials. Therefore, it is thought that more research on activation energies for dopants of shallow donor level is expected.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.61-65
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• 2020

Suppressing lattice thermal conductivity of thermoelectric materials is one of the most popular approach to improve their thermoelectric performance. However, accurate characterization of suppressed lattice thermal conductivity is challenging as it can only be acquired by subtracting other contributions to thermal conductivity from the total thermal conductivity. Here we explain that electronic thermal conductivity (for all materials) and bipolar thermal conductivity (for narrow band gap materials) need to be determined accurately first to characterize the lattice thermal conductivity accurately. Methods to calculate Lorenz number for electronic thermal conductivity (via single parabolic model and using a simple equation) and bipolar thermal conductivity (via two-band model) are introduced. Accurate characterization of the lattice thermal conductivity provides a powerful tool to accurately evaluate effect of different defect engineering strategies.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.45-54
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• 2020

Recently, market demands of miniaturization, high interconnection density, and fine pitch of PCBs continuously keep increasing. Therefore, SLP (substrate like PCB) technology using a modified semi additive process (MSAP) has attracted great attention. In particular, SLP technology is essential for the development of high-capacity batteries and 5G technology for smartphones. In this study, the reliability of the microvia of hybrid SLP, which is made of conventional HDI (high density interconnect) and MSAP technologies, was investigated by experimental and numerical analysis. Through thermal cycling reliability test using IST (interconnect stress test) and finite element numerical analysis, the effects of various parameters such as prepreg properties, thickness, number of layers, microvia size, and misalignment on microvia reliability were investigated for optimal design of SLP. As thermal expansion coefficient (CTE) of prepreg decreased, the reliability of microvia increased. The thinner the prepreg thickness, the higher the reliability. Increasing the size of the microvia hole and the pad will alleviate stress and improve reliability. On the other hand, as the number of prepreg layers increased, the reliability of microvia decreased. Also, the larger the misalignment, the lower the reliability. In particular, among these parameters, CTE of prepreg material has the greatest impact on the microvia reliability. The results of numerical stress analysis were in good agreement with the experimental results. As the stress of the microvia decreased, the reliability of the microvia increased. These experimental and numerical results will provide a useful guideline for design and fabrication of SLP substrate.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38C no.5
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• pp.409-419
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• 2013

Kinect released by Microsoft in November 2010 is a motion sensing camera in xbox360 and gives depth and color images. However, Kinect camera also generates holes and noise around object boundaries in the obtained images because it uses infrared pattern. Also, boundary flickering phenomenon occurs. Therefore, we propose a real-time virtual-view video synthesis algorithm which results in a high-quality virtual view by solving these problems. In the proposed algorithm, holes around the boundary are filled by using the joint bilateral filter. Color image is converted into intensity image and then flickering pixels are searched by analyzing the variation of intensity and depth images. Finally, boundary flickering phenomenon can be reduced by converting values of flickering pixels into the maximum pixel value of a previous depth image and virtual views are generated by applying 3D warping technique. Holes existing on regions that are not part of occlusion region are also filled with a center pixel value of the highest reliability block after the final block reliability is calculated by using a block based gradient searching algorithm with block reliability. The experimental results show that the proposed algorithm generated the virtual view image in real-time.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.4
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• pp.556-562
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• 2012

Micro electrical discharge machining (${\mu}EDM$) has been used for non-conventional material removal. One drawback of ${\mu}EDM$ is low productivity. In this study, we tried to find the optimal machining conditions to manufacture the micro hole with an optimal machining time without loss of accuracy. Taguchi method was used to figure out the relation between machining parameters and characteristics of the process. It was found that the electrode wear, the entrance and exit clearance gave a significant effect on the diameter of the micro hole when the diameter of the electrode was identical. Grey relational analysis was used to determine the optimal machining condition for minimum machining time without loss of accuracy. The obtained optimal machining condition was the input voltage of 80V, the capacitance of 680pF, the resistance of $500{\Omega}$, the feed rate of $1.5{\mu}m$/s and the spindle speed of 2900rpm. The machining time was reduced to 48% without loss of accuracy under the optimal machining condition.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.91-97
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• 2022

The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.

• Journal of the Korean Geotechnical Society
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• v.39 no.4
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• pp.31-44
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• 2023

A base expansion micropile was developed to improve the bearing capacity of the micropile, which bears a simple device installed at the pile base. Under an axial load, this base expansion structure radially expands at the pile tip and attaches itself around ground, compressing the boring wall in the construction stage. In this study, conventional and base expansion micropiles were constructed in the weathered rock where micropiles are commonly installed. Further, field load tests were conducted to verify the bearing capacity enhancement effect. From the load test results, it was revealed that the shaft resistance of base expansion micropiles was about 12% higher than that of conventional micropiles. The load transfer analysis results also showed that compared to conventional micropiles, the unit skin friction and unit end bearing of base expansion micropiles were 15.4% and 315.1% higher, respectively, in the bearing zone of the micropile.

• Progress in Medical Physics
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• v.25 no.2
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• pp.116-121
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• 2014

Next future, The bio technology will be a rapidly developing. This paper is the scattering beam measurement of the red blood cell (RBC) and the fabrication of the micro cell biochip using the bio micro electro mechanical system (Bio-MEMS) process technology. The Major process method of Bio-MEMS technology was used the buffered oxide etchant (BOE), electro chemical discharge (ECD) and ultraviolet sensitive adhesives (UVSA). All experiments were the 10 times according to the process conditions. The experiment and research are required the ultraviolet expose, the micro fluid current, the cell control and the measurement of the output voltage Vpp (peak to peak) waveform by scattering angles. The transmitting and receiving of the laser beam was used the single mode optical fiber. The principles of the optical properties are as follows. The red blood cells were injected into the micro channel. The single mode optical fiber was inserting in the guide channel. The He-Ne laser beam was focusing in the single mode optical fiber. The transmission He-Ne laser beam is irradiating to the red blood cells. The manufactured guide channel consists of the four inputs and the four outputs. The red blood cell was allowed with the cylinder pump. The output voltage Vpp waveform of the scattering beam was measured with a photo detector. The receiving angle of the output optical fiber is $0^{\circ}$, $5^{\circ}$, $10^{\circ}$, $15^{\circ}$. The magnitude of the output voltage Vpp waveform was measured in the decrease according to increase of the reception angles. The difference of the output voltage Vpp waveform is due differences of the light transmittance of the red blood cells.