• Journal of the Korean Recycled Construction Resources Institute
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• v.12 no.1
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• pp.102-109
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• 2024

In order to use limestone powder as a material for concrete, the mechanical and durability characteristics of cement matrices manufactured by varying the substitution rate were evaluated. In general, limestone powder did not contribute to the cement hydration reaction, so as a result of the compressive strength test of cement mortar using it, the compressive strength decreased as the substitution rate increased. However, as a result of evaluating the durability performance of cement mortar using limestone powder, such as chloride ion penetration resistance, carbonation resistance, and chemical attack resistance, small particles of limestone powder showed superior results compared to the unsubstituted control mortar due to the micro-filler effect of filling the fine pores inside the cement matrix. Therefore, limestone powder is expected to be used as an effective method for improving the durability of concrete. In this study, the durability was evaluated by changing the mixing amount of limestone powder to 0 %, 5 %, 10 %, and 15 %, but it is judged that it is necessary to study in more detail the effect on the durability by changing the end and mixing amount of limestone powder to various levels in the future.

• Composites Research
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• v.31 no.5
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• pp.209-214
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• 2018

This paper explain about the development of environmental friendly, low cost and stable supply material i.e., rice husk and shell were used as micro incorporating bio waste filler. Those were processed by ball mill and analyzed through micro observation by FE-SEM, EDS and particle size distribution. The obtained filler was mixed with epoxy resin for the manufacturing of CFRP composite and study tensile properties. In EDS analysis main contents of rice husk and rice husk ash are C, O and Si. When rice husk was burned C and Si ration were increased. Shell powder has C, O and Ca. It caused $CaCO_3$ from shell. Surface weighted mean of rice husk powder is $6.19{\mu}m$ and volume weighted mean is $14.77{\mu}m$. And it has rod type particles which caused hair and husk structure parts. Surface weighted mean of rice husk ash powder is $1.55{\mu}m$ and volume weighted means is $8.20{\mu}m$. Surface weighted mean of shell powder is $2.53{\mu}m$ and volume weighted mean is $5.79{\mu}m$. The tensile decreased with increasing the content of micro filler in CFRP composites. In case of rice husk, the significant decrement of tensile strength was observed. and in case of shell powder, there is no effect of changes take place in tensile strength.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.51-58
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• 1999

The effects of glass composition on the wettability and reactivity with $ZrO_2$substrate was evaluated and fabrication variables and glass compositions was investigated. Various glass compositions was investigated. Alkaline earth silicate glass show good wettability and lower viscosity and crystallization of glass could be prevented by $B_2O_3$.The sealant glass begin to wet on $ZrO_2$substrate below $900^{\circ}C$ and porosity occurred in various glass compositions, the crystallization and porosity in the glass could be prevented by the addition of flux into glass composition. But flowability and reactivity of glass with $ZrO_2$substrate was enhanced. Processing variables should be optimized to reduce the porosity by enhancing the sintering of glass powder. Many silicate glasses were investigated for the applications of high temperature sealants. Wetting and bonding of glass was good enough to seal together between $ZrO_2$and other ceramic components of SOFC. But porosity and reaction layer were occurred in the sealant glass. It will be possible to produce glass sealant without porosity and reaction layer at the interface by optimization of processing variable and modify the glass compositions. In present study, wettability of glass-filler composite was investigated. The porosity, shape of filler and interfacial reactions of sealant glass with fillers were examined.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.57-63
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• 2015

In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at $166^{\circ}C$, but the sample fabricated by the double-stage pretreatment oxidized at $224^{\circ}C$, indicating definitely improved anti-oxidation property.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.65-71
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• 2017

To prepare the Cu-based filler material indicating enhanced oxidation resistance property and Ag content, Ag-coated Cu particles was fabricated by Ag plating of 40 wt % on the spherical Cu particles with an average size of $2{\mu}m$ and their oxidation behavior was also evaluated. In the case that ethylenediaminetetraacetic acid was used alone, the fabricated particles frequently showed broken structures such as delamination at Ag shell/core Cu interface and hollow structure that are induced by excessive galvanic displacement reaction. As a result, fraction of defect particles increased up to 19.88% after the Ag plating of 40 wt.%. However, the fraction in the 40 wt.% Ag-coated Cu particles decreased to 9.01% and relatively smooth surface and dense microstructure in the Ag shell were also observed with additional usage of hydroquinone as a complexing agent. Ag-coated Cu particles having the enhanced microstructure did not show any weight increase by oxidation for exposure to air at $160^{\circ}C$ for 2 h, indicating increased oxidation resistance property.

• Journal of the Korea Institute of Building Construction
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• v.9 no.5
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• pp.127-133
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• 2009

It is important to increase the strength of binders in order to enhance the strength of concrete. However, when the mineral admixture used for high strength concrete is incorporated individually, its dispersibility decreases due to the phenomenon of compaction, which reduces its fluidity and results in insufficient strength being created. To solve this problem, we can pre-mix each binder in advance to disperse a mineral admixture among binders, which will strengthen the fluidity and strength of concrete. Therefore, this study analyzed the properties of high strength concrete depending on the mix method used, to determine the effect of pre-mix cements ranging from W/B 15 to 35%. It was found that the fluidity of pre-mix increased to a level higher than that of individual mix due to its dispersion and ball bearing effect. The air content was slightly decreased from the result of individual mix due to the micro filler effect, which causes fine particles of silica-fume to fill the voids among cement particles, while the setting time of pre-mix was shorter than that of individual mix, because enhanced dispersion of pre-mix affects hydration heat time. The compressive strength of pre-mix increased due to the phenomenon of compaction of gap structure, and the variation of coefficient decreased by 1.69% on average in strength variation.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.55-61
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• 2015

Stretchable electrode materials are focused to apply to flexible device such as e-skin and wearable computer. Used as a flexible electrode, increase in electrical resistance should be minimalized under physical strain as bend, stretch and twist. Carbon black is one of candidates, for it has many advantages of low cost, simple processing, and especially reduction in resistivity with stretching. However electrical conductivity of carbon black is relatively low to be used for electrodes. Instead graphene is one of the promising electronic materials which have great electrical conductivity and flexibility. So it is expected that graphene added carbon black may be proper to be used for stretchable electrode. In this study, under stretching electrical property of graphene added carbon black composite electrode was investigated. Mechanical stretching induced cracks in electrode which means breakage of conductive path. However stretching induced aligned graphene enhanced connectivity of carbon fillers and maintained conductive network. Above all, electronic structure of carbon electrode was changed to conduct electrons effectively under stretching by adding graphene. In conclusion, an addition of graphene gives potential of carbon black composite as a stretchable electrode.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.49-54
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• 2020

To attach a stretchable/flexible electrode to something or something to on electrode, conductive adhesives must be stretchable/flexible to suit the properties of the electrode. In particular, conductive adhesive require durability and heat resistance, and unlike conventional adhesives, they should also have conductivity. To this end, Epoxy, which has good strength and adhesion, was selected as an adhesive, and a plasticizer and a reinforcement were mixed instead of a two-liquid material consisting of a conventional theme and a hardener, and a four-liquid material was used to give stretchability/flexibility to high molecules. The conductive filler was selected as silver, a material with low resistance, and for high conductivity, three shapes of Ag particles were used to increase packing density. Conductivity was compared with these developed conductive adhesives and two epoxy-based conductive adhesives being sold in practice, and about 10 times better conductivity results were obtained than products being actually sold. In addition, conductivity, mechanical properties, adhesion and strength were evaluated according to the presence of plasticizers and reinforcement agent. There was also no problem with 60% tensile after 5 minutes of curing at 120℃, and pencil hardness was excellently measured at 6H. As a result of checking the adhesion of electrodes through 3M tape test, all of them showed excellent results regardless of the mixing ratio of binders. After attaching the Cu sheet on top of the electrode through conductive adhesive, the contact resistance was checked and showed excellent performance with 0.3 Ω.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.51-56
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• 2016

To fabricate a copper (Cu)-based fine conductive filler having antioxidation property, submicron silver (Ag)-coated Cu particles were fabricated and their antioxidation property was evaluated. After synthesizing the Cu particles of $0.705{\mu}m$ in average diameter by a wet-reduction process, Ag-coated Cu particles were fabricated by successive Ag plating using ethylene grycol solvent. Main process parameters in the Ag plating were the concentration of reductant (ascorbic acid), the injection rate of Ag precursor solution, and the stirring rate in mixed solution. Thus, Ag plating characteristics and the formation of separate fine pure Ag phase were observed with different combinations of process parameters. As a result, formation of the separate pure Ag phase and aggregation between Ag-coated Cu particles could be suppressed by optimization of the process parameters. The Ag-coated Cu particles which were fabricated using optimal conditions showed slight aggregation, but excellent antioxidation property. For example, the particles indicated the weight gain not exceeding 0.1% until $225^{\circ}C$ when they were heated in air at the rate of $10^{\circ}C/min$ and no weight gain until 75 min when they were heated in air at $150^{\circ}C$.