• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.33-40
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• 1997

본 연구에서는 에폭시 기지에 충진재료 SiC 분말과 SiC 휘스커 AIN분말을 사용하 여 이들 충진재의 함량 및 형상이 복합재료의 열전도도 열팽창계수 및 유전상수에 미치는 영향을 조사하였다. 복합재료의 열전도도는 세라믹 충진재의부피분율이 증가함에 따라 비선 형적으로 증가하였으며 휘스커 형상의 충진재를 첨가한 복합재료의 열전도도는 구형 분말의 충진재를 사용한 복합재료에 비해 높게 관찰 되었다. 이러한 현상은 충진재로 사용한 휘스 커가 구형 분말 충진재에 비하여 동일 부피분율에서 상호 접촉할수 있는 확률이 높기 때문 인 것으로 추정된다. 열팽창 계수는 충진제의 부피분율이 증가함에 따라 감소 하는 경향을 보였으며 충진재의 형상이 휘스커 형상인 경우가 구형에 비하여 감소되는 정도가 크게 관찰 되었다.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.95-99
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• 2018

High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.1-10
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• 2023

Recently, as the demand for high-performance computers and mobile products increases, semiconductor packages are becoming high-integration and high-density. Therefore, in order to transmit a large amount of data at once, micro bumps such as flip-chip and Cu pillar that can reduce bump size and pitch and increase I/O density are used. However, when the size of the bumps is smaller than 70 ㎛, the brittleness increases and electrical properties decrease due to the rapid increase of the IMC volume fraction in the solder joint, which deteriorates the reliability of the solder joint. Therefore, in order to improve these issues, a layer that serves to prevent diffusion is inserted between the UBM (Under Bump Metallization) or pillar and the solder cap. In this review paper, various studies to improve bonding properties by suppressing excessive IMC growth of micro-bumps through additional layer insertion were compared and analyzed.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2011.05a
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• pp.19-22
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• 2011

For underground structures that are exposed to environmental conditions, the declination of the durability of concrete occurs easily because of leakages from high hydraulic pressure and the frequent contact of water due to environmental factors. Therefore this study is to confirm that the leakage reduction of natural inorgnic powder compound applying subsurface structural weak part and make the performance improvement of concrete as an objective. The test was done by making the rebar, flat tie, nail and film infiltration and each of its water tank and cylindrical test body then after pouring water to each of the test body, the test observe the change of the water tank surface absorbed condition and leakage of each specimen with respect to time. As a conclusion, the test was observed that this water proofing admixture has better watertightness from the beginning of the setting time(when it hardens), the ettringite and the thaumasite generates a large quantity of hydration products that controls the formation in a large opening and the CSH produced by pozzolan reaction makes a dent at this opening.

• Composites Research
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• v.34 no.5
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• pp.305-310
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• 2021

Mechanical properties of fiber reinforced composites were affected to fiber volume fractions (FVF) and interfacial property by sizing agent conditions. An optimum interface can relieve stress concentration by transferring the mechanical stress from the matrix resin to the reinforcements effectively, and thus can result in the performance of the composites. The interfacial properties and wettability between the epoxy resin and glass fiber (GF) were evaluated for different sizing agent conditions and FVFs. The surface energies of epoxy resin and different sizing agent treated GFs were calculated using dynamic and static contact angle measurements. The work of adhesion, W_a was calculated by using surface energies of epoxy matrix and GFs. The wettability was evaluated via the GF tow capillary test. The interfacial shear strength (IFSS) was evaluated by microdroplet pull-out test. Finally, the optimized GFRP manufacturing conditions could be obtained by using wettability and interfacial property.

• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1100-1106
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• 2008

In this study, we presented rapid and simple fabrication method of functionalized surface on various substrates as a universal platform for the selective immobilization of cells. The functionalized surface was achieved by using deposition of polyelectrolyte such as poly(allyamine hydrochloride) (PAH), poly(diallyldimethyl ammonium chloride) (PDAC), poly(4-ammonium styrene sulfonic acid) (PSS), poly(acrylic acid) (PAA) and fabrication of poly(ethylene glycol) (PEG) microstructure through micro-molding in capillaries (MIMIC) technique on each glass, poly(methyl methacrylate) (PMMA), polystyrene (PS) and poly(dimethyl siloxane) (PDMS) substrate. The polyelectrolyte multilayer provides adhesion force via strong electrostatic attraction between cell and surface. On the other hand, PEG microstructures also lead to prevent non-specific binding of cells because of physical and biological barrier. The characteristic of each modified surface was examined by using static contact angle measurement. The modified surface onto several substrates provides appropriate environment for cellular adhesion, which is essential technology for cell patterning with high yield and viability in the micropatterning technology. The proposed method is reproducible, convenient and rapid. In addition, the fabrication process is environmentally friendly process due to the no use of harsh solvent. It can be applied to the fabrication of biological sensor, biomolecules patterning, microelectronics devices, screening system, and study of cell-surface interaction.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.51-56
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• 2014

After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.125-133
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• 2016

With the aim of using a filler material in a conductive paste, fine Cu nanoparticles were synthesized through the high-speed chemical reaction between cuprous oxide ($Cu_2O$) powder and sulfuric acid in distilled water. Under external temperature of $7^{\circ}C$, sulfuric acid concentration of 48%, and $Cu_2O$ amount of 30 g, the $Cu_2O$ particles were eliminated and slightly aggregated Cu nanoparticles were synthesized. Futhermore, Cu nanoparticles of 224 nm, in which the aggregation between particles was obviousiy much suppressed, were synthesized with the choice of an additive. In the particle sample, occasionally there are coarse particles formed by the aggregation of fine nanoparticles and weak linkages between the nanoparticles. However, the coarse particles were destroyed and the linkages were broken after mixing with a resin formulation, indicating the behavior of untangling the aggregation between nanoparticles.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.73-77
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• 2021

Flexible electrodes for wearable devices have been actively studied in not only achieving mechanical/electrical stability, but also providing various functionalities for extending its industrial application. In this study, a flexible carbon/PDMS composite is prepared by addition of carbon black (CB) as a conductive filler, and effect of CB with different contents on electrical properties of the composite was investigated for the application of flexible electrodes, temperature sensor and heater. With increase of CB contents, resistivity of the carbon/PDMS was increased, and excellent durability was observed, confirmed by repetitive stretching deformation test. Resistance increase of the carbon/PDMS with temperature reveals the property of positive temperature coefficient, which can be applied for temperature sensor. Also, joule heating on the carbon/PDMS was observed when electrical potential was applied, indicating the applicability of the carbon/PDMS for heater.