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D. S. Jung, H. M. Lee, Y. C. Kang and S. B. Park, "Air-stable Silver-coated Copper Particles of Sub-micrometer Size", J. Colloid Interface Sci., 364(2), 574 (2011).
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H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung and C. O. Kim, "Developing Process for Coating Copper Particles with Silver by Electroless Plating Method", Sur. Coat. Technol., 201, 3788 (2006).
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D.-H. Kim, S. Yoo, C.-W. Lee and T. Y. Lee, "Temperature Measurement and Contact Resistance of Au Stud Bump Bonding and Ag Paste Bonding with Thermal Heater Device", J. Microelectron. Packag. Soc., 17(2), 55 (2010).
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Y.-S. Lin and S.-S. Chiu, "Electrical Properties of Copperfilled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles", J. Adhes. Sci. Technol., 22, 1673 (2008).
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M. Tsuji, S. Hikino, Y. Sano and M. Horigome, "Preparation of Cu@Ag Core-Shell Nanoparticles Using a Two-Step Polyol Process under Bubbling of Gas", Chem. Lett., 38(6), 518 (2009).
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R. Zhang, W. Lin, K. Lawrence and C. P. Wong, "Highly Reliable, Low Cost, Isotropically Conductive Adhesives Filled with Ag-Coated Cu Flakes for Electronic Packaging Applications", Int. J. Adhes. Adhes., 30, 403 (2010).
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X. G. Cao and H. Y. Zhang, "Fabrication and Performance of Silver Coated Copper Powder", Electron. Matter. Lett., 8(4), 467 (2012).
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Y. Peng, C. Yang, K. Chen, S. R. Popuri, C.-H. Lee and B.-S. Tang, "Study on Synthesis of Ultrafine Cu-Ag Core-Shell Powders with High Electrical Conductivity", Appl. Sur. Sci., 263, 38 (2012).
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S.-S. Chee and J.-H. Lee, 'Preparation and Oxidation Behavior of Ag-Coated Cu Nanoparticles Less Than 20 nm in Size", J. Mater. Chem. C., 2, 5372 (2014).
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10 |
A. Muzikansky, P. Nanikashvili, J. Grinblat and D. Zitoun, "Ag Dewetting in Cu@Ag Monodisperse Core-Shell Nanoparticles", J. Phys. Chem. C., 117, 3093 (2013).
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E. B. Choi and J.-H. Lee, "Ethylene Glycol-Based Ag Plating for the Wet Chemical Fabrication of One Micrometer Cu/Ag Core/Shell Particles, J. Alloys Compd., 643, S231 (2015).
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J. Ryu, H.-S. Kim and H. T. Hahn, "Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronic", J. Elecron. Mater., 40(1), 42 (2010).
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S.-J. Joo, H.-J. Hwang and H.-S. Kim, "Highly Conductive Copper Nano/microparticles Ink via Flash Light Sintering for Printed Electronics", Nanotechnology, 25, 265601 (2014).
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14 |
D. A. Porter and K. E. Easterling, Phase Transformations in Metals and Alloys, 2nd Ed., pp.185-197, Chapman & Hall, London (1992).
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15 |
Y. D. Mott, J. Galkowski, L. Wang, J. Luo and C.-J. Zhong, "Synthesis of Size-Controlled and Shaped Copper Nanoparticles", Langmuir, 23, 5740 (2007).
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16 |
Y. M. Shin, S.-S. Chee and J.-H. Lee, "Trends on Synthesis of Cu Nanoparticles by a Wet Reduction Method", J. Microelectron. Packag. Soc., 20(3), 11 (2013).
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17 |
Y. M. Shin and J.-H. Lee, "Effects of Process Parameters on Cu Powder Synthesis Yield and Particle Size in a Wet-chemical Process", Arch. Metall. Mater., 60 (2015).
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18 |
H. J. Kang, T. Kim and M. Y. Jeong, "PLC Devices Fabricated on Flexible Plastic Substrate by Roll-to-Roll Imprint Lithography", J. Microelectron. Packag. Soc., 22(4), 25 (2015).
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V. Brusic, G. S. Frankel, J. Roldan and R. Saraf, "Corrosion and Protection of a Conductive Silver Paste", J. Electrochem. Soc., 142(8), 2591 (1995).
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20 |
G. Kim, K.-M. Jung, J.-T. Moon and J.-H. Lee, "Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-Coated Cu Flake Filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014).
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S. H. Seo, J.-H. Lee, J.-Y. Song and W.-J. Lee, "Control of Position of Neutral Line in Flexible Microelectronic System Under Bending Stress", J. Microelectron. Packag. Soc., 23(2), 79 (2016).
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22 |
T.-I. Lee, C. Kim, M. S. Kim and T.-S. Kim, "Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates", J. Microelectron. Packag. Soc., 23(3), 63 (2016).
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23 |
N. Cabrera and N. F. Mott, "Theory of the Oxidation of Metals", Rep. Prog. Phys., 12, 164 (1949).
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24 |
X. Xu, X. Luo, H. Zhuang, W. Li and B. Zhang, "Electroless Silver Coating on Fine Copper Powder and Its Effects on Oxidation Resistance", Mater. Lett., 57(24-25), 3987 (2003).
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25 |
J. Zhao, D. M. Zhang and J. Zhao, "Fabrication of Cu-Ag Core-Shell Bimetallic Superfine Ppowders by Eco-friendly Reagents and Structures Characterization", J. Solid State Chem., 184(9), 2339 (2011).
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