• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.107-111
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• 2020

Recently, as an aging society progresses, a lot of interest in health and diagnosis is increasing, As the field of various bio-imaging systems for guided surgery capable of accurate diagnosis has emerged as important, a Fluorescence imaging system capable of accurate measurement and real-time confirmation has emerged as an important field. Fluorescence images currently being used are mainly in the NIR-I band, but many studies are in progress in the NIR-II band in order to improve resolution and confirm fluorescence deeply and accurately. In this paper, the difference between NIR-I and NIR-II, optical characteristics, and SBR (signal to background ration) of a fluorescent imaging system, was investigated using the finite element (FEM) method. After confirming, it was confirmed that the SBR was 16.2 times higher in the NIR-II area than in the NIR-I by making the skin phantom and measuring the fluorescence. It is confirmed that the enhancement in SBR of the Fluorescence imaging system is more effective in the NIR-II region than in the NIR-I region and expected to be used in application fields such as guided surgery, bio-sensor and also device which can detect the defect of optical devices.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.1
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• pp.147-151
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• 2017

Areas of concentrations that can be exploited at all times, such as gas reservoirs in crude oil tanks, are called zero zones. In order to use various equipment in Zone 0, an intrinsically safe certification must be obtained that can guarantee that sparks will not occur in nature. Most devices that acquire intrinsic safety certification are mostly simple single-component devices or devices. In this study, it was a very difficult process because we intend to acquire the intrinsic safety certification of an electronic circuit including an ultrasonic generator and a microcontroller in which hundreds of components are mounted on a PCB substrate. Through this study, we have been able to understand how to design a circuit for intricate intrinsic safety certification. and Using the results of this study, it will be easier to design intrinsically safe circuits when trying to develop a circuit that can obtain intrinsic safety certification.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.35-40
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• 2005

The oxidation of pure Sn and Sn-0.7Cu, Sn-3.5Ag, Sn-lZn, and Sn-9Zn alloys at $150^{\circ}C$ was investigated. Both the chemical nature and the amount of oxides were characterized using electrochemical reduction analysis by measuring the electrolytic reduction potential and total transferred electrical charges. X-ray photoelectron spectroscopy (XPS) was also conducted to support the results of reduction analysis. The effect of Cu, Ag and Zn addition on surface oxidation of Sn alloys is reported. For Sn, Sn-0.7Cu and Sn-3.5Ag, SnO grew first and then the mixture of SnO and $SnO_2$ was found. $SnO_2$ grew predominantly for a long-time aging. For Zn containing Sn alloys, both ZnO and $SnO_2$ were formed. Zn promotes the formation of $SnO_2$. Sn oxide growth rate of Pb-free solder alloys was also discussed in terms of alloying elements.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.49-55
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• 2011

The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

• Journal of Astronomy and Space Sciences
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• v.22 no.4
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• pp.537-558
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• 2005

This paper addresses the results of HAUSAT-2 radiation environment and effect analyses, including TID and SEE analyses. Trapped proton and electron, solar proton, galactic cosmic ray models were considered for HAUSAT-2 TID radiation environment analysis. TID was analyzed through total dose-depth curve and the radiation tolerance of TID for HAUSAT-2 components was verified by using DMBP method and sectoring analysis. HAUSAT-2 LET spectrum for heavy ion and proton were also analyzed for SEE investigation. SEE(SEU, SEL) analyses were accomplished for MPC860T2B microprocessor and K6X8008T2B memory. It was estimated that several SEUs may occur without SEL during the HAUSAT-2 mission life(2 years). Software Hamming Code EDAC has been implemented to detect and correct the SEU. In this study, all radiation analyses were conducted by using SPENVIS software.

• The Journal of the Acoustical Society of Korea
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• v.39 no.6
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• pp.568-575
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• 2020

Ultrasound has been widely used in various industrial fields. One of challenging application areas is cooling microelectronics. Ultrasonic cooling systems can work with air, argon (Ar) and nitrogen (N₂) instead of conventional refrigerant such as freon gas, which can cause global warming. Furthermore, ultrasonic systems do not have moving parts, thus high durability can be obtained. So it is necessary to develop ultrasonic cooling systems due to environmental issues and durability points. In this paper, the design and fabrication processes are explained. When designing the system, a feasibility test was performed with a prototype cooler. Based on the result, finite element analysis with ANSYS software was performed. The predicted anti-resonance frequency for a piezoelectric actuator was 34.8 kHz, which was in good agreement with the experimental result of 34.6 kHz with 0.6% error. In addition, the predicted anti-resonance frequency for the ultrasonic waveguide was 39.4 kHz, which also agreed well with the experimental value of 39.8 kHz with 1.0% error. Based on these results, the developed ultrasonic waveguide might be applicable in microchip cooling.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.43-48
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• 2007

This study is focused on the effect of the surface properties for the post electrode, which is used in pad formation consisted of SMT such as IC, passive component, combined with fired LTCC substrate, We carried out the surface microstructure of sintered electrode and the basic reliability evaluations with sample fired by microwave sintering to solve the problems occurred in post electrode by electric sintering. We evaluated surface densification status of post electrode according to various conditions of microwave sintering. In additions, it is obtained strong effect on blister improvement of post electrode because of over-sintering and the insufficient out gas in bum out process. As a result of adhesion strength, we confirmed $44.3N/mm^2$ in microwave sintering and $34.5N/mm^2$ in electric sintering, respectively. This result will be used for the basic reliability test. Finally, microwave sintering seems to be economic in process time with 30 min compared to electric sintering with 10 hr. In terms of Mass production and efficiency, microwave sintering are excepted to be higher than electric sintering.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.90-94
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• 2023

Carbon fiber(CF) with excellent thermal conductivity and electrical conductivity is attracting attention as an alternative material because metal heating elements have problems such as high heat loss and fire risk. However, since CF is oxidized and disconnected at about 200℃ or higher, the application of heating elements is limited, and CF heating elements in the form of vacuum tubes are currently used in some commercial heaters. In this work, polyimide(PI) with high heat resistance was coated on the surface of carbon fiber by electrophoretic deposition to prevent oxidation of CF in the atmosphere without using a vacuum tube, and the coating thickness and heat resistance were investigated according to the applied voltage. The heater made by connecting the PI-coated CF heating elements in series showed stable heating characteristics up to 292℃, which was similar to the heating temperature result of the heat transfer simulation. The PI layer coated by the electrophoretic deposition method is effective in preventing oxidation of CF at 200℃ or higher and is expected to be applicable to various heating components such as secondary batteries, aerospace, and electric vehicles that require heat stability.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.131-131
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• 2016

기원전 5000년 이집트에서부터 시작된 도금은 시간이 지남에 따라 점점 발전하여, 1900년대에 들어 전기를 이용한 도금공정이 개발되었고, 현재 뿌리산업으로써 각종 제조업에 널리 이용되고 있다. 도금 공정은 금속을 부식으로부터 보호하고, 제품의 심미성과 기능성, 생산성 등을 높이기 위해 주로 이용된다. 전주도금 공정은 완벽하게 동일한 형태의 생산품을 다량으로 제작 할 수 있기 때문에, 그 높은 생산성으로 주목 받고 있다. 특히, 나노/마이크로 크기의 정밀 소자 등을 가공하는 차세대 기술인 LIGA공정과 접목이 가능하다는 장점이 있다. 몰드를 이용하여 복제하는 방식인 전주 도금은 도금공정이 끝난 후 몰드와 완성된 제품을 분리해내는 추가공정이 필연적으로 발생하게 되는데, 둘 사이의 접착력을 낮추기 위하여 몰드의 표면에 이형박리제를 도포하게 된다. 이형박리제로는 전기가 잘 흐르면서 접착력이 낮은 이산화 셀렌이나 중크롬산이 주로 이용되지만, 원활한 박리를 위해서는 그 두께가 30 um 이상 확보되어야 하기 때문에 정밀한 미세구조 전주도금이 어렵다는 문제점이 있다. 또한 이와 같은 화학 약품들은 매우 유독하기 때문에 추가적인 폐수 처리 공정이 필요하며, 작업자의 안전을 위협하고 심각한 환경 오염을 초래한다는 추가적인 문제가 발생한다. 따라서, 매우 얇고 친 환경적이며 안전한 전주도금 이형박리제에 대한 연구가 요구되고 있다. 본 연구에서는 전주도금 몰드로 사용한 구리의 표면에 TCVD를 이용하여 단일 층 그래핀을 성장시킨 후, 그래핀이 코팅된 몰드에 구리를 전주도금하여 박리하였다. 박리 후 그래핀은 몰드에 손상 없이 남아있는 것을 Raman microscopy를 통해서 확인하였고, 몰드와 그래핀 사이의 접착력 (약 $0.71J/m^2$)에 비해 그래핀과 전주도금 샘플간에 낮은 접착력 (약 $0.52J/m^2$)을 갖는 것을 확인하였다. 이와 같이 낮은 접착력을 통해 박리 시 표면구조의 손상 없이 정밀한 구조의 미세 패턴구조를 형성할 수 있었다. 전주도금을 이용한 전극 형성과 고분자와의 융합을 통해 유연기판을 제작하여 bending 실험을 진행하였다. $90^{\circ}$의 bending 각도로 10000회 이하에서는 저항의 변화가 없었고, LED chip을 mounting한 후 곡률반경 4.5 mm까지 bending을 진행하여도 이상 없이 LED가 발광하는 것을 확인하였다. 위와 같은 전주도금 공정을 이용하여 고집적 전자기기, 광학기기, 센서기기 등의 다양한 어플리케이션의 부품제조에 활용될 수 있을 것으로 기대한다.