• Title/Summary/Keyword: 리드

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Design of Biometrics System Using ECG Lead III Signals (심전도 신호의 리드 III 파형을 이용한 바이오인식)

  • Min, Chul-Hong;Kim, Tae-Seon
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.48 no.6
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    • pp.43-50
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    • 2011
  • Currently, conventional security methods including IC card or password type method are quickly switched into biometric security systems in various applications and the electrocardiogram (ECG) has been considered as one of novel biometrics way. However, conventional ECG based biometrics used lead II signal which conventionally used for formulaic signal to heart disease diagnosis and it is not suitable for biometrics since it is rather difficult to find consistent features for heart disease patents. To overcome this problem, we developed new biometrics system using ECG lead III signals. For wave extraction, signal peak points are extracted through AAV algorithm. For feature selection, extracted waves are categorized into one of four wave types and total twenty two features including number of vertices, wave shapes, amplitude information and interval information are extracted based on their wave types. Experimental results for thirty-six people showed 100% specificity, 95.59% sensitivity and 99.17% of overall identification accuracy.

Development of Standard ECG Simulator for 15-Lead ECG Monitor (15-리드 심전계용 표준 시뮬레이터의 개발)

  • Kang, Yu Min;Lee, Jin Hong;Choi, Seong Wook
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.5
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    • pp.391-395
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    • 2015
  • A 15-Lead ECG has been developed to diagnose posterior wall diseases of the heart that a 12-Lead ECG cannot diagnose. However, 15-Lead ECG data for developing heart-diseases-detecting algorithm are limited, and previous ECG simulators cannot predict the ECG waveform according to the changes in electrode. To solve these problems, the lumped parameter model (LPM), which divides the heart into 15 sections with varying electrical capacitance and electrical resistance. To imitate the electrical conduction in the heart, each node was connected to a current source and delivered the specific current considering the positions and time delay. The purpose of this study is to acquire the waveform that can be used in an ECG by delivering the specific current to LPM.

Adhesive Properties of Epoxy Composite According to the Surface Treatment of Cu Substrate and Adhesion Promoter Content (구리기판의 표면처리 및 접착증진제 함량에 따른 에폭시 컴포지트의 접착특성)

  • Eun-jin Kim;Jung Soo Kim;Young-Wook Chang;Dong Hyun Kim
    • Journal of Adhesion and Interface
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    • v.23 no.4
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    • pp.108-115
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    • 2022
  • In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, 1H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

Numerical Analysis for Thermal-deformation Improvement in TSOP(Thin Small Outline Package) by Anti-deflection Adhesives (TSOP(Thin Small Outline Package) 열변형 개선을 위한 전산모사 분석)

  • Kim, Sang-Woo;Lee, Hai-Joong;Lee, Hyo-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.3
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    • pp.31-35
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    • 2013
  • TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

Flow Analysis and Process Conditions Optimization in a Cavity during Semiconductor Chip Encapsulation (반도체 칩 캡슐화성형 유동해석 및 성형조건 최적화에 관한 연구)

  • 허용정
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.67-72
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    • 2001
  • An Effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele-Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The optimization program based on the complex method integrated with flow analysis program has been successfully used to obtain the optimal filling conditions to avoid short shot.

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A Study on the Diagnostic System for Architectural Elements Using Radio Frequency (무선주파수를 응용한 건축부재의 손상자현 시스템에 관한 연구)

  • Kim, Dong Hyun;Choi, Young Wha
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.16 no.2
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    • pp.1-9
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    • 2012
  • Reinforced concrete buildings will be deteriorated as passed time or effect of an earthquake, etc in main elements. In order to manage such cracks, time and efforts, expense, etc, are required. So micro lead switch sensors are embedding or bonding in flexible specimens, and these are smart elements for diagnostic crack damages by external force such as physical load, dynamic load, etc in this study. The monitoring to crack damages are studied using radio frequency system. If load is received on the center of flexible specimens, embedded and bonded lead switch sensors will be destroyed, and these become to send signals of damages at radio frequency system connected with lead switch sensors. This study is fundamental research of the diagnostic system for architectural elements using radio frequency.

Research on Pre-service Teacher Education Through Understanding of Conic Sections in Non-Endidean Geometry (비유클리드 기하학에서 이차곡선의 이해를 통한 예비교사교육)

  • Jieun Kang;Daehwan Kim
    • Journal of Science Education
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    • v.47 no.3
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    • pp.263-272
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    • 2023
  • We consider how a pre-service teacher can understand and utilize various concepts of Euclidean geometry by learning conic sections using mathematical definitions in non-Euclidean geometry. In a third-grade class of D University, we used mathematical definitions to demonstrate that learning conic sections in non-Euclidean space, such as taxicab geometry and Minkowski distance space, can aid pre-service teachers by enhancing their ability to acquire and accept new geometric concepts. As a result, learning conic sections using mathematical definitions in taxicab geometry and Minkowski distance space is expected to contribute to enhancing the education of pre-service teachers for Euclidean geometry expertise by fostering creative and flexible thinking.

Design of an Encoding-Decoding System using Majority-Logic Decodable Circuits of Reed-Muller Code (다수논리 결정자를 이용한 리드뮬러코드의 시스템 설계)

  • 김영곤;강창언
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.10 no.5
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    • pp.209-217
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    • 1985
  • Using the Reed-Muller Codes, the encoder and decoder system has been designed and tested in this paper. The error correcting capability of this code is [J/2} or less and the error correcting procedure can be implemented easily by using simple logic circuitry. The encoding and decoding circuits are obtained by the cyclic property and for the O15, 11) Reed-Muller code majority-logic decoding is taken. The performance is measured in error probability and weight destribution. The encoder and decoder system has been designed, implemented and interfaced with the microcomputer by using the 8255 chip. Experimental results show that the system has single error-correcting capability and total execution time for a data is about 70usec. When the probability of channel error is $10^{-6}$~$10^{-4}$ the system using the (15, 11) Reed-Muller code works very good.

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Study on Magnetic Property for Test Coil and Permanent Magnet (Test Coil과 영구자석의 자기 특성 연구)

  • Park, Yun Bum;Kim, Jong Wook;Lee, Jae Seon
    • Journal of the Korean Magnetics Society
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    • v.26 no.5
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    • pp.154-158
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    • 2016
  • A CRDM (Control Rod Drive Mechanism) is an electromagnetic device which drives a control rod assembly linearly to regulate the reactivity of a nuclear core. An RPIS (Rod Position Indication System) is used as a position indicator for a control rod assembly of a CRDM of SMART, and an RPIS consists of permanent magnets and reed switches. SMART is designed for the maximum coolant temperature of $350^{\circ}C$, and the permanent magnets are installed inside of the reactor. The reed switches and electrical circuit are installed outside of the reactor on the other hand. Test coil for a reed switch is test equipment for quality verification of a reed switch, and a test coil consists of a coil and core. In this study, magnetic property of test coil and permanent magnet on a reed switch is compared by using finite element electromagnetic simulation.

A Technique of Measuring Leadwire-Site for Automatic Leadwire Cutting Machines (리드선 자동절단기를 위한 리드선 위치측정법)

  • ;Seiichi Noguchi;Koei Igarashi
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.19 no.1
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    • pp.120-130
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    • 1994
  • The leadwire cutting machine that has been used recently cuts leadwires by putting one-side force with the same priciple as a saw, and applies a stress at soldered part of PCB. Because the stress becomes one cause of contact-defect, a leadwire cutting robot that cuts leadwire-site with nipper and does not apply stress is considered, In this paper a technique of detecting leadwire-site is studied for the purpose of using on automatic leadwire cutting robots. A technique deriving 2-dimensional site-information with many I-dimensional binary data of perspective front-view of PCB taken from various direction was proposed. Simulation and experiments were done under the same condition each other and a small universal PCB was choosen as an experimental object. As a result of simulations and experiments, the proposed technique turns out to be very useful for automatic leadwire cutting robots.

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