• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.755-758
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• 2000

Rapid prototyping is one of the most important technology for 21th century industry. To overcome the limitation of the material and function, Functional Prototype Development(FPD) concept is newly proposed. Wide function is necessary such as mechanical, optical, chemical and electrical property in order to solve broad requirements of the industry. The process of FPD has more than two conventional processes based on fusion technology and the FPD system is integrated with the interdisciplinary, interfacing and intelligent concepts. This paper shows some representative achievements such as optic coloring prototypes, electric multi layer printed circuit broad(MLB) and MEMS using electrostrictive polymer. Finally, we confirmed that FPD has a great possibility which can be applied in broad industry and will be a powerful tool in near future.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.38-38
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• 2008

무선 통신에 사용되는 기판에서 passive device는 대부분 기판 위에 개별적으로 표면 실장 되고 있으며 전체 기판면적에 80% 정도를 차지하고 있다. 따라서 기판의 소형화, 경량화를 위하여 많은 면적을 차지하는 수동소자들을 다층인쇄회로기판(multi-layer circuit board)에 내장하는 내장형 수동소자(embedded passive device) 기술이 연구되고 있다. 본 연구원에서 개발한 복합재료는 무기물 충전제 $SrTiO_3$를 사용하였으며, 열가소성 수지로는 cyclo-olefin-polymer계열의 수지를 바탕으로 제작 하였고, 유전율7~7.5이고 유전손실은 0.0045이다. 또한 $SrTiO_3$/유기물 복합재료는 공정온도가 낮고 경제적인 유기물에 높은 유전상수를 갖는 무기물이 분산되어 있는 형태이며, 우수한 유전 특성, 화학적 안정성, 저온 제조공정, 제조단가의 감소, 패키징 크기의 감소 등의 장점을 갖는다. 개발된 재료를 기반으로 Multi-layer 구조를 이용한 다양한 용량대의 capacitor를 구현 하였으며, spiral inductor 와 내장형 spiral inductor를 구현하여 다양한 용량대의 inductor를 구현 하였다. 그리고 각각의 구조에 따른 inductance와 Q factor를 분석 하였으며, Q factor가 100이상인 high Q inductor도 구현하였다. 이렇게 구현된 내장형 수동소자는 기판의 크기의 감소와 제조 단가의 절감, 최소 크기의 기판을 구현하는데 응용이 가능 할 것으로 예상 된다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.7
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• pp.1048-1056
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• 2001

Decoupling capacitors are commonly used to reduce the effect of SSN propagated through parallel power and ground planes in high-speed multilayer printed circuit boards (PCBs). In this paper, we introduced a simple high frequency measurement and proposed a wideband (50 MHz ∼3 GHz) equivalent circuit model for decoupling capacitor considering high frequency parasitic effects. The proposed model can be easily combined with the SPICE model of power supply planes far SSN analysis. The circuit simulations with the proposed model show good agreement with the measurement results. Also, we expect to accurately analyze the noise reduction effect as a function of value and location using the proposed model of decoupling capacitor.

• Composites Research
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• v.35 no.3
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• pp.182-187
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• 2022

In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it is necessary to accurately predict the thickness of the PCB through the thickness empirical formulation. To determine the density of the prepreg, the mass and thickness of the prepreg were measured. To manufacture the CCL, the prepreg and copper foil were laminated using a hot press machine, and the thickness was measured using a microscope and micrometer. An 8-layerd PCB was designed with different circuit densities to measure the change in the thickness with the copper foil residual ratio, and the proposed empirical formulation was verified by comparing the measured thickness with the value obtained using the empirical formulation. As a result, the errors for the CCL and multilayer PCB were 2.56% and 4.48%, respectively, which demonstrated the reliability of the empirical formulation.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.36-40
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• 2013

Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1591-1592
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• 2006

이동 및 정보통신 시스템이 소형화 및 고성능화됨에 따라 System OR Package (SOP) 기술의 연구개발이 주목을 받고 있다. 저가형 SOP를 위하여 가장 많은 연구가 다층인쇄회로 기판에 수동소자 및 전송선로를 내장시키는 것이다. 본 논문에서는, 8층 KB 기판에 Meander line과 Radial/T Stub 패턴을 Advanced Design System(ADS) simulation을 이용하여 설계 및 제작하고 분석함으로써 정확한 SOP 디자인 및 설계 방향을 제시하고자 한다. 설계변수-패턴의 length, width, spacing, 각도와 공정변수-1층/3층, 기판 재질(prepreg(PP)과 resin coated copper(RCC))을 두어 제작하여 그 특성을 비교하였다. Meander Line는 PP보다 RCC에서의 인덕턴스가 크고 높은 자가 공진주파수를 가졌고, 3층보다 1층에서의 인덕턴스가 안정적이었다. Radial/T Stub는 PP보다 RCC에서의 커패시턴스가 작으나, 높은 자가 공진 주파수로 커패시턴스가 안정적이었다. Meander Line은 RCC, 병렬 전송선로 간격-400um, 병렬 전송선로 길이-500um, 1층 설계 시, 인덕턴스-1.60nH, 자가 공진주파수-9.21GHz 특성이 가장 우수하고, Radial Stub는 RCC, $60^{\circ}$, 1층 설계 시, 커패시턴스-0.62pF, 자가 공진주파수-9.06GHz의 특성이 나타났고, T Stub는 RCC, Stub 길이-600um, Stub 너비-150um, 1층 설계 시, 커패시턴스 -0.38pF, 자가 공진주파수-10GHz이상으로 우수한 특성을 나타냈다.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.321-325
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• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.7
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• pp.750-755
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• 2003

This paper proposes a new three-line balun. The equivalent circuit of the proposed three-line balun is presented, and impedance matrix［Z］of the equivalent circuit is derived from the relationship between the current and voltage at each port. The design equation for a given set of balun impedance at input and output ports is presented using［S］parameters, which is transferred fom impedance matrix,［Z］. To demonstrate the feasibility and validity of design equation, multi-layer ceramic(MLC) chip balun operated in the 2.4 GHz ISM band frequency is designed and fabricated by the use of the low temperature co-fired ceramic(LTCC) technology. By employing both the proposed new three-line balun equivalent circuit and multi-layer configuration provided by LTCC technology, the 2012 size MLC balun is realized. Measured results of the multi-layer LTCC three-line balun match well with the full-wave electromagnetic simulation results, and measured in band-phase and amplitude balances over a wide bandwidth are excellent. This proposed balun is very easily applicable to multi-layer structure using LTCC as shown in the paper, and also can be realized with microstrip lines on PCB. This distinctive performance is very favorable for wireless communication systems such as wireless LAN(Local Area Network) and Bluetooth applications.