• Title/Summary/Keyword: 니켈박막

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The electrochromic properties of nickel oxide films (니켈산화물 박막의 전기적착색특성)

  • 이길동
    • Journal of the Korean Vacuum Society
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    • v.8 no.2
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    • pp.127-135
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    • 1999
  • Nickel oxide films were prepard by using the electron beam evaporation technique. Coloring and bleaching experiments for cyclic durability were repeated in KOH electrolyte by cyclic voltammetry. Visible spectrophtometry was used to assess the stability of the transmittance in the degraded films. X-ray photoelectron spectroscopy results showed that the grain surface are oxygen-rich compared to the grain interiors in a NiO film. Open circuit memory of colored films is about 400hours in lN KOH. The rate of self discharge was evaluated by measuring the transmittance at 550nm of a fully oxidized NiO film. The rate of self discharge was increased polynomially with time and the film is nearly bleached after about 400hours. It was also found that the degraded film by repeated cycles in the KOH solution changed the grain shape of film surface The film prepared under a vacuum pressure of $3\times10^{-4}$ mbar was found to be rather stable when subjected to the repeated coloring and bleaching cycles in KOH electrolyte. Band theory applied to explain the electrochromic mechanism was discussed.

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Characterization of Cu-Ni alloy thin films deposited by magnetron co-sputtering as a function of target configurations (마그네트론 코-스퍼터링에 의한 구리-니켈 합금박막 증착시 타겟의 구성방법에 따른 물성 분석)

  • SEO, Soo-Hyung;LEE, Jae-Yup;PARK, Chang-Kyun;PARK, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1485-1487
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    • 2000
  • A variety of target configurations in sputtering process have been proposed to deposit various structures of thin film alloys and compound films. In this study, we presented the comparative experimental results regarding to the characterization of properties of Cu-Ni thin films deposited by using a magnetron co-sputtering method, as a function of target configurations; one is using a single target with varying the area of Ni chips attached on the Cu target and another is using a dual-type target with two targets of Ni and Cu separated each other. Structural(d-spacing, crystal orientation, crystallite size, cross-sectional morphology) and electrical(resistivity) properties of deposited films are characterized and compared as a function of target configurations as well as deposition conditions.

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Characterization and stability of electrochromic NiO thin films (전기적 착색 니켈산화물 박막의 특성과 안정성)

  • 이길동
    • Journal of the Korean Vacuum Society
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    • v.9 no.1
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    • pp.48-59
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    • 2000
  • Electrochromic NiO films were prepared by using an electron-beam deposition method. The influence of the preparation conditions, especially the substrate temperature, on the electrochemical stability of film was investigated. The optical properties and stability of as-deposited films strongly depended on the substrate temperature during deposition. The NiO film prepared at a substrate temperature of 150~$200^{\circ}C$ was found to be the stabel when subjected to 5000cycles in a 0.5M solution of KOH between -6.0 and +0.8V. The best electrochromic parameters after 5000cycles were obtained for samples with substrate temperature of $150^{\circ}C$. The obtained electrochromic parameters are CE=-0.049($\lambda$=550nm), $\Delta$OD=0.88($\lambda$=550nm)$\textrm{cm}^2$/mC, Qin=-18.11mC/$\textrm{cm}^2$ and Qleft= 14.8mC/$\textrm{cm}^2$.

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A Study on Laser Micro Joining of Small Diameter Gold Wires to Nickel Thin Films (미소 직경 골드 와이어와 니켈 박막의 레이저 마이크로 접합에 관한 연구)

  • Park, K.W.;Na, S.J.
    • Laser Solutions
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    • v.10 no.2
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    • pp.25-28
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    • 2007
  • Rapidity and flexibility are very important in the electronic components industry. The laser process provides the industry with more rapidity and flexibility. For this reason, the laser process is considered as an acceptable method in terms of rapidity and flexibility. In this study, a wide range of experiments have been carried out on the gold wire-to-nickel thin film joining using the continuous wave fiber laser. In particular, changes in the shape of joint depending on the changes of a target point have been observed.

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Electrochemical Characterization of Anti-Corrosion Film Coated Metal Conditioner Surfaces for Tungsten CMP Applications (텅스텐 화학적-기계적 연마 공정에서 부식방지막이 증착된 금속 컨디셔너 표면의 전기화학적 특성평가)

  • Cho, Byoung-Jun;Kwon, Tae-Young;Kim, Hyuk-Min;Venkatesh, Prasanna;Park, Moon-Seok;Park, Jin-Goo
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.1
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    • pp.61-66
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    • 2012
  • Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.

그래핀 투명전도막의 전기적 특성에 미치는 Strain 영향

  • Lee, Byeong-Ju;Jeong, Gu-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.462-462
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    • 2011
  • 그래핀은 탄소원자로 구성된 원자단위 두께의 매우 얇은 2차원의 나노재료로서 높은 투광도 뿐만 아니라 우수한 기계적, 전기적 특성을 지니며 구조적 화학적 으로도 매우 안정한 것으로 알려져 있다. 이러한 그래핀을 얻는 방법에는 물리·화학적 박리법, 탄화규소의 흑연화, 열화학기 상증착법(thermal chemical vapor deposition; TCVD)등 많은 방법들이 존재한다. 이중 TCVD방법이 대면적으로 두께균일도가 높은 그래핀을 얻는데 가장 적합한 방법으로 알려져 있다. 한편 그래핀은 우수한 특성들을 기반으로 센서나 메모리와 같은 기능성 소자로 응용이 가능할 뿐 아니라 투명고분자 기판으로 전사함으로서 유연성 투명전극을 제작 가능하여 기존의 인듐산화물(indium tin oxide; ITO) 투명전극을 대체하여 디스플레이, 터치스크린, 전·자기 차폐재 등의 다양한 분야로의 응용이 가능하다고 예측되고 있다. 본 연구에서는 TCVD법을 이용하여 대면적으로 두께균일도가 높은 그래핀을 합성하여 투명 고분자 기판(polyethylene terephthalate; PET) 위에 전사하여 투명전도막을 제작한 후, 압축변형률(compressive strain)의 변화에 따른 전기적 특성 변화를 측정하였다. 그래핀은 300 nm 두께의 니켈박막이 증착된 산화물 실리콘 기판위에 원료가스로 메탄(CH4)을 사용하여 합성하였다. 합성 결과 단층 그래핀의 면적은 약 80% 이상이었으며, 합성된 그래핀은 분석의 용이함 및 향후 다양한 응용을 위하여 식각공정을 통해 산화막 실리콘 기판과 PET기판으로 전사하였다. PET기판 위로 전사하여 제작한 그래핀 투명전도막의 strain 인가에 따른 전기적 특성을 관찰한 결과, 약 20%의 비교적 높은 strain하에서도 전기적특성이 크게 변화하지 않는 것을 확인하였다. 그래핀의 특성분석을 위해서는 광학현미경, 라만 분광기, 투과전자현미경, 자외 및 가시선 분광광도계, 4탐침측정기 등을 이용하였다.

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Microstructure Characterization for Nano-thick Nickel Cobalt Composite Silicides from 10 nm-Ni0.5Co0.5 Alloy films (10 nm 두께의 니켈 코발트 합금 박막으로부터 제조된 니켈코발트 복합실리사이드의 미세구조 분석)

  • Song, Oh-Sung;Kim, Sang-Yeob;Kim, Jong-Ryul
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.4
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    • pp.308-317
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    • 2007
  • We fabricated thermally-evaporated 10 nm-Ni/(poly)Si and 10 nm-$Ni_{0.5}Co_{0.5}$/(Poly)Si structures to investigate the microstructure of nickel silicides at the elevated temperatures required lot annealing. Silicides underwent rapid annealing at the temperatures of $600{\sim}1100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope and an Auger depth profilescope were employed for the determination of vortical microstructure and thickness. Nickel silicides with cobalt on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1100^{\circ}C$ and $900^{\circ}C$, respectively, while the conventional nickle monosilicide showed low resistance below $700^{\circ}C$. Through TEM analysis, we confirmed that a uniform, $10{\sim}15 nm$-thick silicide layer formed on the single-crystal silicon substrate for the Co-alloyed case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of $1000^{\circ}C$. Auger depth profile analysis also supports the presence of this mixed microstructure. Our result implies that our newly proposed NiCo-alloy composite silicide process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

Milling of NiCo Composite Silicide Interconnects using a FIB (FIB를 이용한 니켈코발트 복합실리사이드 미세 배선의 밀링 가공)

  • Song, Oh-Sung;Yoon, Ki-Jeong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.9 no.3
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    • pp.615-620
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    • 2008
  • We fabriacted thermal evaporated $10nm-Ni_{1-x}Co_x$(x=0.2, 0.6, and 0.7) films on 70 nm-thick polysilicon substrate with $0.5{\mu}m$ line width. NiCo composite silicide layers were formed by rapid thermal annealing (RTA) at the temperatures of $700^{\circ}C$ and $1000^{\circ}C$. Then, we checked the microstructure evaluation of silicide patterns. A FIB (focused ion beam) was used to micro-mill the interconnect patterns with low energy condition (30kV-10pA-2 sec). We investigated the possibility of selective removal of silicide layers. It was possible to remove low resistance silicide layer selectively with the given FIB condition for our proposed NiCo composite silicides. However, the silicides formed from $Ni_{40}Co_{60}$ and $Ni_{30}Co_{70}$ composition showed void defects in interconnect patterns. Those void defects hinder the selective milling for the NiCo composite silicides.

Structural and optical properties of Ni-substituted spinel $LiMn_2O_4$ thin films (니켈 치환된 스피넬 LiMn2O4 박막의 구조적, 광학적 성질)

  • Lee, Jung-Han;Kim, Kwang-Joo
    • Journal of the Korean Vacuum Society
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    • v.15 no.5
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    • pp.527-533
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    • 2006
  • Spinel $LiNi_xMn_{2-x}O_4$ thin films were synthesized up to x = 0.9 by a sol-gel method employing spin-coating. The Ni-substituted films were found to maintain cubic structure at low x but to exhibit tetragonal structure for $x{\geq}0.6$. Such cubic-tetragonal phase transition indicates that $Ni^{3+}(d7)$ ions with low-spin $(t_{2g}^6,e_g^1)$ state occupy the octahedral sites of the compound, thus being subject to the Jahn-Teller distortion. By x-ray photoelectron spectroscopy both $Ni^{2+}$ and $Ni^{3+}$ ions were detected. Optical properties of the $LiNi_xMn_{2-x}O_4$ films were investigated by spectroscopic ellipsometry (SE) in the visible?ultraviolet range. The measured dielectric function spectra by SE mainly consist of broad absorption structures attributed to charge-transfer (CT) transitions, $O^{2-}(2p){\rightarrow}Mn^{4+}(3d)$ for 1.9 $(t_{2g})$ and $2.8{\sim}3.0$ eV $(e_g)$ structures and $O^{2-}(2p){\rightarrow}Mn^{3+}(3d)$ for 2.3 $(t_{2g})$ and $3.4{\sim}3.6$ eV $(e_g)$ structures. Also, sharp absorption structures were observed at about 1.6, 1.7, and 1.9 eV, interpreted as due to d-d crystal-field transitions within the octahedral $Mn^{3+}$ ion. The strengths of these absorption structures are reduced by the Ni substitution. Rapid reduction of the CT transition strength involving the eg states for x = 0.6 is attributed to the reduced wavefunction overlap between the $e_g$ and the $O^{2-}(2p)$ states due to the tetragonal extension of the lattice constant by the Jahn-Teller effect.