A Study on Laser Micro Joining of Small Diameter Gold Wires to Nickel Thin Films

미소 직경 골드 와이어와 니켈 박막의 레이저 마이크로 접합에 관한 연구

Rapidity and flexibility are very important in the electronic components industry. The laser process provides the industry with more rapidity and flexibility. For this reason, the laser process is considered as an acceptable method in terms of rapidity and flexibility. In this study, a wide range of experiments have been carried out on the gold wire-to-nickel thin film joining using the continuous wave fiber laser. In particular, changes in the shape of joint depending on the changes of a target point have been observed.