Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2000.07c
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- Pages.1485-1487
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- 2000
Characterization of Cu-Ni alloy thin films deposited by magnetron co-sputtering as a function of target configurations
마그네트론 코-스퍼터링에 의한 구리-니켈 합금박막 증착시 타겟의 구성방법에 따른 물성 분석
- SEO, Soo-Hyung (Center for Electronic Materials and Components) ;
- LEE, Jae-Yup (Center for Electronic Materials and Components) ;
- PARK, Chang-Kyun (Dept. of Electrical Engineering, Hanyang University) ;
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PARK, Jin-Seok
(Dept. of Electrical Engineering, Hanyang University)
- 서수형 (한양대학교 전자재료 및 부품연구센터) ;
- 이재엽 (한양대학교 전자재료 및 부품연구센터) ;
- 박창균 (한양대학교 공학대학 전기공학과) ;
-
박진석
(한양대학교 공학대학 전기공학과)
- Published : 2000.07.17
Abstract
A variety of target configurations in sputtering process have been proposed to deposit various structures of thin film alloys and compound films. In this study, we presented the comparative experimental results regarding to the characterization of properties of Cu-Ni thin films deposited by using a magnetron co-sputtering method, as a function of target configurations; one is using a single target with varying the area of Ni chips attached on the Cu target and another is using a dual-type target with two targets of Ni and Cu separated each other. Structural(d-spacing, crystal orientation, crystallite size, cross-sectional morphology) and electrical(resistivity) properties of deposited films are characterized and compared as a function of target configurations as well as deposition conditions.
Keywords