• Korean Chemical Engineering Research
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• v.57 no.1
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• pp.111-117
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• 2019

This study proposed the fabrication and deposition of high purity crystalline $core-TiO_2/shell-Al_2O_3$ nanoparticles. Morphological properties of $core-TiO_2$ and coated $shell-Al_2O_3$ were confirmed by transmission electron microscope (TEM) and transmission electron microscope - energy dispersive spectroscopy (TEM-EDS). The electrical properties of the prepared $core-TiO_2/shell-Al_2O_3$ nanoparticles were evaluated by applying them to a working electrode of a Dye-Sensitized Solar Cell (DSSC). The particle size, growth rate and the main crystal structure of $core-TiO_2$ were analyzed through dynamic light scattering system (DLS), scanning electron microscope (SEM) and X-ray diffraction (XRD). The $core-TiO_2$, which has a particle size of 17.1 nm, a thin film thickness of $20.1{\mu}m$ and a main crystal structure of anatase, shows higher electrical efficiency than the conventional paste-based dye-sensitized solar cell (DSSC). In addition, the energy conversion efficiency (6.28%) of the dye-sensitized solar cell (DSSC) using the $core-TiO_2/shell-Al_2O_3$ nanoparticles selectively controlled to the working electrode is 26.1% higher than the energy conversion efficiency (4.99%) of the dye-sensitized solar cell (DSSC) using the conventional paste method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.103-103
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• 2009

본 논문에서는 기존의 GST(GeSbTe=2:2:5)와 비교하여 상변화 재료로서의 Ga 도핑된 $Ge_2Sb_2Te_5$의 가능성을 확인하고자 하였다. 실험에 사용된 Ga 도핑된 $Ge_2Sb_2Te_5$ 박막은 전통적 melt-quenching 방법에 의해 비정질로 제작된 벌크를 Thermal evaporation을 통하여 Si(100) 및 유리 (coming glass, 7059) 기판 위에 200nm의 두께로 증착하여 제작하였다. 각 박막의 상변화 특성은 여러 온도에서 열처리된 박막을 X-ray diffraction (XRD) 측정을 통하여 확인하였다. 각 조성 박막의 비정질-결정질 상변화속도 비교를 위하여 나노-펄스 스캐너 (nano-pulse scanner)를 사용하여 power; 1~17mW, pulse duration; 10~460ns 범위에서 박막의 상변화에 따른 반사도 차이를 측정 분석하였다. Ga의 도핑농도에 따른 전기적 특성 차이를 확인하기 위하여 4-point probe를 이용하여 박막의 면 저항을 측정하였고 또한 hall 측정을 통하여 박막의 흘 계수, 흘 농도 및 이동도를 확인하고 Ga가 상전이에 미치는 영향에 대하여 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.701-701
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• 2013

표면조직화는 입사되는 빛의 반사를 줄이고 태양전지 내부에서 빛의 이동거리를 길게하여 효율을 향상시키는 중요한 요소가 된다. 결정질 실리콘 표면 조직화에서 일반적으로 알카리 습식 식각이 많이 사용되며 이 식각 방법으로 반사도를 400~1000 nm의 파장에서 평균 11%까지 줄일 수 있다. 본 논문에서는 빛의 반사를 더 줄여 단락전류를 향상 시키기 위해 기존 NaOH를 이용한 표면 조직화를 수행한 후에 반응성 이온 식각 공정을 적용하는 2단계 표면 조직화 공정을 최적화 하였다. 먼저 NaOH 2%, IPA 7.5%용액에서 $80^{\circ}C$ 유지하면서 35분간 식각을 한 후에 ICP 장치에서 SF6/O2 비율 1:1, 공정 압력 25 mTorr, 시간 200 s로 고정하고 RF 파워를 25~200 W로 변화를 주면서 실험 하였다. 그 결과 마이크로 크기의 피라미드 위에 나노 크기의 피라미드를 형성할 수 있었으며 400~1,000 nm 파장에서 평균 4.96%까지 반사도를 낮출 수 있었다. 기존 알카리 식각 공정에 비해 반사도가 많이 낮아지게 되어 입사되는 빛의 양이 증가함으로서 단락전류가 증가하고 효율이 향상될 것으로 기대된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.1
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• pp.58-61
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• 2012

In our report a relatively simple process for fast nano-texturing of p-type(100) CZ- silicon surface using silver catalyzed wet chemical etching in aqueous hydrofluoric acid (HF) and hydrogen peroxide solution($H_2O_2$) at room temperature. The wafers were saw-damaged by NaOH(6 wt%) at $60^{\circ}C$ for 150s. To obtain a nano-structured black surface, a thin layer of silver with thickness of 1 - 10 nm was deposited on the surfaces by evaporation system. After this process the samples were etched in HF : $H_2O_2$ : $H_2O$ = 1:5:10 at room temperature for 80s - 220s. Due to the local catalytic of the Ag clusters, this treatment results in the nano-scale texturing on the surface. This resulted in average reflectance values less than 9% after the silver on the surface of the wafers were removed.

• Journal of Surface Science and Engineering
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• v.38 no.4
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• pp.156-162
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• 2005

Nickel-iron nanocrystalline alloys with different compositions and grain sizes were fabricated by electro-plating for MEMS devices. The iron content of the deposits was changed by varying the nickel/iron ion ratio in the electrolyte. X-ray diffraction (XRD) analysis was applied for measuring the strength of the texture and grain size of the deposits. The nickel/iron atom ratio of the deposits was analyzed by EDS. The hardness of the alloys was evaluated by Vickers hardness indenter. The internal stress of the deposits was measured by Thin Film Stress Measurement using Stoney's formula. Surface morphology and roughness were investigated by Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM). The results of this study revealed that at a grain size of approximately $17\~24$nm the hardness, internal stress and roughness depend strongly on the iron content. With increasing the iron content, the hardness and internal stress of the deposits increased. An excellent correlation between the increase in the internal stress and the loss of (200) texture was found.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.218.1-218.1
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• 2013

GeSbTe 삼원계 칼코겐화물 합금은 광디스크 및 상변화 메모리에서 활성물질로 사용되는 대표적인 재료이다. GeSbTe 합금은 결정질 상과 비정질 상의 두 종류의 상을 갖는데 그 상에 따라 반사율 및 전기저항이 서로 다르기 때문에 활성물질로서 작용한다. GeSbTe 합금 구성원소의 일부를 포함하는 두 종류의 물질로 접합을 형성하고 열처리 공정을 수행함으로써 GeSbTe 합금을 국부적으로 생성하는 방법이 최근에 보고되었다. 이러한 방법을 상변화 메모리 소자 제조에 이용하면 GeSbTe 합금을 제한된 영역에 나노 스케일로 만드는 것이 가능해져서 GeSbTe 합금의 상변화를 유도하는데 필요한 프로그래밍 전류를 낮추는 효과를 얻을 수 있다. 상변화 메모리 소자 내에서의 GeSbTe 합금의 두께 또는 크기는 상변화 메모리 소자의 동작 특성을 좌우하는 중요한 파라미터이며 이것은 열처리 공정 조건에 따라 결정되므로 열처리 공정 조건에 따라 GeSbTe 합금이 생성되는 양상이 어떻게 변화하는지를 밝힐 필요가 있다. 따라서 본 연구에서는 다양한 열처리 온도 조건에서 Ge-Sb-Te 삼성 분계에서의 구성 원소들의 상호확산 거동을 조사하였다. 순수한 Ge 박막과 조성이 다른 SbTe 박막의 접합을 형성하고 773K까지의 온도 범위에서 열처리를 실시하였다. Auger 수직 분석을 이용하여 Ge, Sb, 및 Te 원소의 깊이 방향의 확산 정도를 조사하였으며 그 결과로서 열처리 온도가 증가함에 따라 상호확산 정도가 심해지고 Te 원소가 상호확산에 있어서 중요한 역할을 한다는 사실을 확인하였다.

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.660-666
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• 2010

30 nm thick Ni layers were deposited on a glass substrate by e-beam evaporation. Subsequently, 30 nm or 60 nm ${\alpha}-Si:H$ layers were grown at low temperatures ($<220^{\circ}C$) on the 30 nm Ni/Glass substrate by catalytic CVD (chemical vapor deposition). The sheet resistance, phase, microstructure, depth profile and surface roughness of the $\alpha-Si:H$ layers were examined using a four-point probe, HRXRD (high resolution Xray diffraction), Raman Spectroscopy, FE-SEM (field emission-scanning electron microscopy), TEM (transmission electron microscope) and AES depth profiler. The Ni layers reacted with Si to form NiSi layers with a low sheet resistance of $10{\Omega}/{\Box}$. The crystallinty of the $\alpha-Si:H$ layers on NiSi was up to 60% according to Raman spectroscopy. These results show that both nano-scale NiSi layers and crystalline Si layers can be formed simultaneously on a Ni deposited glass substrate using the proposed low temperature catalytic CVD process.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.449-455
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• 2010

To enhance the efficiency of dye sensitized solar cells, we proposed crystalline anatase-$TiO_{2}$ by using a low temperature process ($150^{\circ}C{\sim}250^{\circ}C$). We successfully fabricated 30 nm-$TiO_{2}$ at a fixed atomic layer deposition condition of 1.0 sec of TDMAT pulse, 20 sec of TDMAT purge, 0.5 sec of H$_{2}$O pulse, and 20 sec of H$_{2}$O purge. In order to examine the microstructure, phase, and band-gap of the TiO$_{2}$ respectively, we employed a Nano-Spec, transmission electron microscope, high resolution XRD, Auger electron spectroscopy, scanning probe microscope, and UV-VIS-NIR. We were able to fabricate a crystalline anatase-phase of 30 nm-TiO$_{2}$ successfully at temperatures above $180^{\circ}C$. Our results showed that our proposed low temperature ALD process (below $200^{\circ}C$) might be applicable to glass and flexible polymer substrates.

• Journal of the Korean Vacuum Society
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• v.14 no.2
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• pp.78-83
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• 2005

Nanometric crystalline silicon (no-Si) embedded in dielectric medium has been paid attention as an efficient light emitting center for more than a decade. In nc-Si, excitonic electron-hole pairs are considered to attribute to radiative recombination. However the surface defects surrounding no-Si is one of non-radiative decay paths competing with the radiative band edge transition, ultimately which makes the emission efficiency of no-Si very poor. In order to passivate those defects - dangling bonds in the $Si:SiO_2$ interface, hydrogen is usually utilized. The luminescence yield from no-Si is dramatically enhanced by defect termination. However due to relatively high mobility of hydrogen in a matrix, hydrogen-terminated no-Si may no longer sustain the enhancement effect on subsequent thermal processes. Therefore instead of easily reversible hydrogen, phosphorus was introduced by ion implantation, expecting to have the same enhancement effect and to be more resistive against succeeding thermal treatments. Samples were Prepared by 400 keV Si implantation with doses of $1\times10^{17}\;Si/cm^2$ and by multi-energy Phosphorus implantation to make relatively uniform phosphorus concentration in the region where implanted Si ions are distributed. Crystalline silicon was precipitated by annealing at $1,100^{\circ}C$ for 2 hours in Ar environment and subsequent annealing were performed for an hour in Ar at a few temperature stages up to $1,000^{\circ}C$ to show improved thermal resistance. Experimental data such as enhancement effect of PL yield, decay time, peak shift for the phosphorus implanted nc-Si are shown, and the possible mechanisms are discussed as well.

• Journal of the Korean Ceramic Society
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• v.41 no.4
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• pp.328-333
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• 2004

Hydroxyapatite (HAp) and HAp-Ag composite layers were coated on ZrO$_2$and Si wafer substrates by RF magnetron sputtering technique. The thickness of coating layers was in the range of 0.7∼1.0$\mu\textrm{m}$ and its roughness was 3∼4nm. The heat treated HAp coating layers were composed with nano-sized crystallines. However, the HAp-Ag composite layers showed the mixed structure with crystalline and amorphous phases. The Ca/P ratio of the as-received HAp coating layer was 1.9, but, the value was decreased as the Ag content with increased. Also, the Vickers hardness of HAp coating layer decreased as the Ag content increase.