• Journal of Welding and Joining
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• v.34 no.5
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• pp.70-76
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• 2016

In this study, Microstructure and tensile properties in arc brazed joints of 1000MPa grade DP steel using Cu-Si insert metal were investigated. The fusion zone was composed of Cu phase which solidified a little Fe and Si. The former phase formed due to dilute the edge of base material by arc, although Fe was not solid solution in Cu at the room temperature. Cu3Si particles formed by crystallization at $1100^{\circ}C$ during faster cooling. After the tensile shear test, there are no differences between the brazed joint efficiencies. The maximum joint efficient was about 37% compared to strength of base metal. It is better than that of arc brazed joint of DP steel using Cu-Sn filler metal. Fracture position of all brazing conditions was in the fusion zone. Crack initiation occurred at three junction point which was a stress singularity point of upper sheet, lower sheet and the fusion zone. And then crack propagated across the fusion zone. The reason why the fracture occurred at fusion zone was that the hardness of fusion zone was lower than that of base material and heat affected zone. The correlation among maximum load and hardness of fusion zone and EST at fractured position was $R^2=0.9338$. Therefore, this means that hardness and EST can have great impact on maximum load.

• Journal of Welding and Joining
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• v.32 no.5
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• pp.44-49
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• 2014

The effect of weldbond hybrid joining process on the mechanical behavior of single lap and L-tensile joints was investigated for the newly developed 1.2GPa grade ultra high strength TRIP(transformation induced plasticity) steel. In the case of single lap shear behavior, the weldbond joint of 1.2GPa TRIP steel showed lower maximum tensile load and elongation than that of the adhesive bonding only. It was considered to be due to the reduction of real adhesion area, which was caused by the degradation of adhesive near the spot weld, and the brittle fracture behavior of the spot weld joint. In the case of L-tensile behavior, however, the maximum tensile load of the weldbond joint of 1.2GPa TRIP steel was dramatically increased and the fracture mode was change to the base metal fracture which is desirable for the spot weld joint. These synergic effect of the weldbond hybrid joining process in 1.2GPa TRIP steel was considered to be due to the stress dissipation around the spot weld joint by the presence of adhesive which resulted in the change of crack propagation path.

• Journal of Welding and Joining
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• v.35 no.2
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• pp.23-29
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• 2017

Mechanical properties and hardness distributions in arc brazed joints of Dual phase steel using Cu-Al insert metal were investigated. The maximum tensile shear load was 10.4kN at the highest brazing current. It was about 54% compared to tensile load of base metal. This joint efficiency is higher than that of joint of DP steel using Cu-based filler metals which are Cu-Si, Cu-Sn. Fracture positions can be divided into two types. Crack initiation commonly occurred at three point junction among upper sheet, lower sheet and the fusion zone. However crack propagations were different with increasing the brazing current. In case of the lower current, it instantaneously propagated along with the interface between fusion zone and upper base material. On the other hand, in case of higher current, a crack propagation occurred through fusion zone. When the brazing current is low (60, 70A), the interface shape is flat type. However the interface shape is rough type, when the brazing current is high (80A). It is thought that the interface shapes were the reason why the crack propagations were different with brazing current. The interface was the intermetallic compounds which consisted of $(Fe,Al)_{0.85}Cu_{0.15}$ IMC formed by crystallization at $1200^{\circ}C$during cooling. Therefore the maximum tensile shear load and the fracture behavior were determined by a interface shape and effective sheet thickness of the fracture position.

• Journal of Welding and Joining
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• v.29 no.6
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.67-67
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• 2009

알루미늄 합금 재질은 무게의 경량화와 기계적강도가 우수하며 다른 비철금속에 비하여 값이 저렴한 장점이 있다. 현재 산업현장에서 활용하는 가장 흔한 접합법으로 TIG, RSW 등과 같은 용융 용접법을 현재는 많이 사용 하고 있지만 열전도도가 높아 열 확산이 빠르고, 이에 따라 모재의 팽창이 일어나 열변형을 유발하며, 산화피막은 그 내부에 함유된 결정수가 아크용접 중 분해되어 수소를 방출함으로 기공이 발생하여 부도체로 저항용접시 전도성을 방해하는 등의 문제를 발생시킨다. 또한 철에 비해 4배정도 큰 전기전도율에 따라 저항용접시 대전류를 사용해야 하는 등의 문제점이 발생하고 있다. 이와 같은 알루미늄 합금의 용융용접 과정에서 발생하는 단점을 극복하는 기술로 고상접합 방법인 마찰교반용접법(Friction Stir Welding)이 활용되고 있다. FSW는 1991년 영국의 TWI에서 개발된 최신 용접법으로 모재를 용융점 아래에서 고상용접시키는 방법으로 용융에 따른 열변형과 흄가스(hume gas)와 스패터(spatter)를 억제시켜 주는 친환경적인 용접법이다. 이러한 마찰교반용접의 기술은 그동안 특허에 따른 로열티가 산업현장에서 사용하는데 문제가 되었으나 특허보호 기간인 20년이 1년정도의 기간밖에 남지 않은 상황에서 그 사용은 날로 증가하리라 본다. 이러한 마찰교반용접부의 결함을 평가하는 방법에는 UT, RT 등이 활용되고 있으나 얇은 박판에서의 결함검출은 용이하지 않다. 이리한 문제점을 해결하기위하여 초음파 가진을 이용한 적외선 열화상 검출 기법을 이용하여 마찰교반용접부의 결함 검출 가능성을 연구하였다. 20kHz의 주파수를 400Watt로 가진시켜 겹치기(lap joint) 마찰교반용접이된 A6061-T6의 용접부에 초음파를 입사하였을 때 발생하는 열을 적외선 열화상 카메라를 이용하여 측정함으로써 마찰교반겹치기 용접부의 결함 검출에 활용하였다. 용접부에 초음파를 입사하였을 때 부분적으로 온도차이가 발생하였고, 그에 따른 열화상을 검출 할 수 있었다. 이러한 열화상과 실제 시험편의 용접부의 강도를 평가하기 위하여 인장시험을 하였다. 그 결과 초음파 적외선 열화상 검출에서 발열부위가 나타난 부분이 인장시험에서 낮은 인장강도를 보였다.

• The Journal of Korean Institute for Practical Engineering Education
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• v.3 no.1
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• pp.45-50
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• 2011

Despite the highly sophisticated development of finite element analysis, a finite element model for structural dynamic analysis can be inaccurate or even incorrect due to the difficulties of correct modelling, uncertainties on the finite element input data and geometrical oversimplification, while the modal data extracted from measurement are supposed to be correct, even though incomplete. The assumption that the test results represent the true dynamic behaviour of the structure, however, may not be correct because of various measurement errors. The measurement errors are investigated and their effects on estimated frequency response functions(FRFs) are also investigated.

• Journal of the Korea institute for structural maintenance and inspection
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• v.27 no.4
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• pp.23-32
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• 2023

The seismic performance of buried PE pipes is reported to be favorable due to their exceptional elongation capacity at break. Although a seismic performance evaluation procedure based on the response displacement method has been summarized in Korea for fusion-bonded PE pipes, there is currently no procedure available for mechanically jointed PE pipes. This article aims to present a seismic performance evaluation procedure based on the response displacement method specifically designed for mechanically jointed PE pipes in Korea. When employing the mechanical joining method for PE pipes, it is recommended to adhere to the evaluation procedure established for segment-type pipes. This involves assessing the stress induced by the pipe, the expansion and contraction strain of the joint, and the bending angle of the pipe joint. Furthermore, the coefficient of inhomogeneity of the soil, which is necessary for estimating the axial strain of the ground, is introduced. Additionally, a computation method for determining lateral displacement and reconsolidation settlement in soil susceptible to liquefaction is proposed. As a result of the sensitivity analysis considering the typical soil condition in Korea, the mechanically jointed PE pipe with a certain quality was shown to have good structural seismic safety when soil liquefaction was not considered. This procedure serves as a valuable tool for seismic design and evaluating the seismic performance of mechanically joined buried PE pipes, which are primarily utilized for connecting small-diameter pipes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.226-226
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• 2008

지난 10여년 동안 Sn-3.0Ag-0.5(wt%)Cu 합금은 대표 무연솔더 조성으로 다양한 전자제품의 실장 및 접합에 적용되어 왔으며, 그 신뢰성 역시 충분히 검증된 바 있다. 그러나 최근 Ag 가격의 급격한 상승과 솔더 접합부의 내 충격 신뢰성을 보다 향상시키고자 하는 업계의 동향은 Ag의 함량이 낮은 무연솔더 조성의 적용 확대를 유도하고 있다. 이에 따라 본 연구자들은 저 Ag 함유 무연슬더로 Sn-1.2Ag-0.5Cu-0.4In 조성을 제안한 바 있는데, 이는 Sn-3.0Ag-0.5Cu 조성 이상의 solderability를 가지면서도 그 금속원료 가격이 약 20% 가량 저렴한 특징을 가진다. 또한 열 싸이클링 (cycling) 테스트를 통한 슬더 조인트의 신뢰성을 평가한 결과, Sn-3.0Ag-0.5Cu에 크게 뒤떨어지지 않는 양호한 특성이 관찰되었다. 따라서 본 연구에서는 열 싸이클링 테스트와 더불어 최근 그 중요성이 지속적으로 커지고 있는 내 충격 신뢰성 평가 시험을 실시하여 개발된 4원계 무연솔더 조성의 기계적 특성을 기존 무연솔더 조성과 비교, 분석해 보았다. 각 솔더 조성은 솔더 볼 형태로 제조되어 CSP(Chip Scale Package) 상에 범핑 (bumping)되었으며, CSP를 PCB(Printed Circuit Board) 상에 실장하는 공정에서도 Sn-3.0Ag-0.5Cu 및 Sn-1.2Ag-0.5Cu-0.4In의 두 종류의 솔더 페이스트가 사용되었다. 본 연구에서의 내 충격 신뢰성 시험에는 자체 제작한 rod drop 시험기를 사용하였는데, 고정된 CSP 실장 board의 후면 부위를 일정한 높이에서 추를 반복적으로 자유 낙하시켜 급격한 충격을 주는 방식으로 실험을 실시하였다. 이 때 추의 무게는 30g, 낙하 높이는 10cm 였으며, 추의 낙하 시 측정된 board 의 휨 변위량은 약 0.7mm로 측정되었다. 사용된 CSP와 PCB 는 모두 daisy chain 방식으로 연결되어 있기 때문에 저항측정기를 사용한 간단한 실시간 저항 측정 방법으로 시험 이력에 따른 파단부의 발생 시점과 대략의 위치를 손쉽게 확인할 수 있었다. 솔더 조인트의 파단 기준 저항값으로 $1000\Omega$을 설정하였으며. 각 조건 당 5 개 이상의 샘플에 대해 평가를 실시한 후 그 평균값을 조사하였다. 시험 결과 제안된 Sn-1.2Ag-0.5Cu-0.4In 조성은 대표적인 저 Ag 함유 조성인 Sn-1.0Ag-0.5Cu에 비해서는 떨어지는 내 충격 신뢰성을 나타내었지만, 우수한 연성에 기인하여 Sn-3.0Ag-0.5Cu 조성에 비해서는 약 2 배 이상 우수한 신뢰성이 관찰되었다. 또한 CSP의 실장 시 Sn-3.0Ag-0.5Cu보다 Sn-1.2Ag-0.5Cu-0.4In 조성 솔더 페이스트를 적용한 경우에서 보다 우수한 내 충격 신뢰성을 나타내어 기본적으로 개발된 Sn-1.2Ag-0.5Cu-0.4In 솔더 페이스트가 Sn-3.0Ag-0.5Cu 조성의 기존 솔더 페이스트 보다 내 충격 신뢰성이 우수함을 검증할 수 있었다. 각 조성의 솔더 조인트를 $150^{\circ}C$ 에서 500시간 aging한 후 실시한 내 충격 신뢰성 평가에서는 모든 조성에서 그 신뢰성이 급감하는 경항을 나타내었으나, Sn-1.2Ag-0.5Cu-0.4In가 Sn-l.0Ag-0.5Cu보다도 그 상대적인 신뢰성이 우수한 것으로 관찰되었다. 이와 같이 aging 후 실시하는 충격시험은 가장 실제적인 상황과 유사한 조건이므로 상기의 실험 결과는 매우 고무적이었으며, 이에 대한 보다 면밀한 분석이 요청되었다. 마지막으로 파면 및 미세조직 관찰을 통하여 각 조성에서의 충격 파단 특성을 비교, 분석해 보았다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.85-90
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• 2010

Friction welding is a common practice to join axially symmetrical parts for automobile industry applications. The shaft for automobile reverse idle gear is generally produced by forging steel, SF 45. This method is not so good because of high cost of material and production. In this study, in order to investigate the possibility of application of SM 45C to SF 45 dissimilar friction welding, the dissimilar friction welded joints were performed using 20 mm diameter solid bar in forging steel(SF 45) to carbon steel(SM 45C). The optimal friction welding parameters were selected to ensure reliable quality welds on the basis of visual examination, tensile test, micro-Virkers hardness surveys of the bond of area and optical microstructure investigations for welded joint parts. Finally, post weld heat treatment(PWHT) of the high-frequency induction hardening was performed for the friction welded specimens under the optimal welding conditions. And then, the mechanical properties were compared for as-welded and PWHT in SM 45C to SF 45.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.97-103
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• 2014

Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.