• Journal of Korea Foundry Society
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• v.21 no.3
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• pp.187-191
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• 2001

가스분무장치를 이용하여 제조된 304 stainless steel 분말의 미세응고조직 특성을 투과전자현미경으로 관찰하였다. 분말이 sandwich 현상으로 존재하도록 구리로 전기도금한 후 tripod jig 를 이용하여 기계적 연마하여 TEM 시편을 제작하였다. 이 방법으로 제조된 TEM 시편은 넓은 지역에서 200KV 로 가속된 전자가 투과하기에 충분히 얇았으며, 작은 분말의 경우에는 분말 전체를 관찰할 수 있었다. 제한시야회절법(SADP)을 이용하여 100 ${\mu}m$ 이하 분말의 결정구조를 조사한 결과에 따르면 가스분무법으로 급냉응고된 대부분의 분말은 austenite 상으로 응고되었으며, 모든 austenite 분말은 크기에 관계없이 쌍정조직 (twinstructure)이 발견되었으며 그 밀도 역시 아주 높았다. 그러나 직경이 2 ${\mu}m$ 이하의 분말에서는 큰 과냉 (supercooling) 효과에 의하여 준결정상인 bcc 상으로 응고됨을 발견하였다.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.62-64
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• 2001

In this paper, we present the fabrication and performance of tunable capacitors with various structural geometry of plates. Experimental devices have been fabricated using Cu-electroplating techniques and standard MEMS techniques. In particular, the thickness of electroplated Cu is designed below $0.5{\mu}m$ for lower actuation voltage. The fabricated tunable capacitors has been tested from $OV{\sim}42V$ and achieves a tuning ratio of $46%{\sim}64.2%$.

• 전기의세계
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• v.37 no.1
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• pp.42-54
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• 1988

본 고에서는 화상표시장치로서의 모든 요건을 대부분 만족시키며 제조공정 등이 비교적 용이하고 평면화상표시장치의 대규모 생산에 알맞는 것으로 알려진 직류형 분말 EL을 이용한 표시장치 기술에 대해 논의한다. 서론에 이어 2장에서는 EL의 동작원리 및 동작특성에 대해 설명하고 3장에서는 투명 전극, EL 분말 처리과정 및 분말의 구리 도금 과정등 직류 EL용 재료의 제조방법 및 특성 등에 대해 기술한다. 4장에서 EL 평판제작 및 발광층 형성 과정에 관해 설명하고 이상의 방법으로 제작된 직류구동형 EL 평판의 열화형태 및 이들의 해결책에 대해 5장에 설명한다. 6장에서는 이들 평판표시장치를 구동하기 위한 주변 전자 회로의 집적화 기술에 대해 설명하며 마지막으로 결론 및 앞으로의 연구방향을 7장에 제시한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.228-228
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• 2008

본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.10-10
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• 2008

Flip chip technology is keeping pace with the increasing connection density of the ICs and is capable of transferring semiconductor performance to the printed circuit board. One of the most general flip chip technology is CPB technology presented by Intel. The CPTB technology has similar benefits with CPB but has simpler process and better reliability characteristics. In this paper, process sequence and structure of CPTB are presented.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.55-59
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• 2012

Defects such as voids or seams are frequently found in TSV via filling process. To achieve defect-free copper via filling, organic additives such as suppressor, accelerator and leveler were necessary in a copper plating bath. However, by-products stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this research, the effects of levelers on copper electrodeposition were investigated without suppressor and accelerator to lower the concentration of additives. Threelevelers(janus green B, methylene violet, diazine black) were investigated to study the effects of levelers on copper deposition. Electrochemical behaviors of these levelers were different in terms of deposition rate. Filling performances were analyzed by cross sectional images and its characteristics were different with variations of levelers.

• Journal of Energy Engineering
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• v.20 no.3
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• pp.242-251
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• 2011

The effects of top and bottom lids on the natural convection heat transfer phenomena inside vertical cylinders were investigated experimentally for $Ra_{Lw}$ from $9.26{\times}10^9$ to $7.74{\times}10^{12}$. Using the concept of analogy between heat and mass transfer, a cupric acid-copper sulfate electroplating system was employed as mass transfer experiments replacing heat transfer experiments. The natural convection heat transfer of both-open cylinders in laminar and turbulent flows was in good agreement with the existing heat transfer correlations developed for vertical plates. The effects of top and bottom lids on the heat transfer rates were very similar to the studies of Krysa et al. and Sedahmed et al. and Chung et al. With the copper lids, the bottom-closed cavity showed the highest heat transfer rates and then followed both-closed, top-closed, both-open ones in both laminar and turbulent flows. However with the acryl lids, the similar trends were observed except that the heat transfer rates for both-open were higher than top-closed one. The use of the copper lids increased the heat transfer rates compared to the acryl lids due to the hydrodynamic interaction of the flows developed for the different heated faces. This study extended the ranges of flow conditions of the existing literatures and proposed the empirical correlations.

• Resources Recycling
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• v.13 no.1
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• pp.28-38
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• 2004

The characteristics of cyanide decomposition in aqueous phase by electric oxidization have been explored in an effort to develop a process to recycle waste water. Considering current efficiency and voltage, the free cyanide decomposition experiment by electric oxidization indicated that 5 V of voltage and copper catalytic Cu/CN mole ratio 0.05 was the most appropriate condition, where current efficiency was 26%, and decomposition speed was 5.6 mM/min. High voltage and excess copper addition increased decomposition speed a little bit but not current efficiency. The experiment of free cyanide density change proves that high density cyanide is preferred because speed and current efficiency increase with density. Also, the overall decomposition reaction could be represented by the first order with respcect to cyanide with the rate constant of $1.6∼7.3${\times}$10^{-3}$ $min^{-1}$ The mass transfer coefficient of electric oxidization of cyanide came out as $2.42${\times}$10^{-5}$ $min^{-1}$ Furthermore, the Damkohler number was calculated as 5.7 in case of 7 V and it was found that the mass transfer stage was the rate determining step.

• Applied Chemistry for Engineering
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• v.17 no.4
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• pp.343-348
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• 2006

The object of this experiment is to recover precious metals from plating rinsed wastewater generated from Lead Frame manufacturing process using electrolysis coupled hybrid process. This was achieved from Amberlite IRA 400 at 1.15 V electrolysis potential using the oxide electrode and at 1.30 V using the Al electrode and from Amberlite IRA 402 at 1.10 V using the oxide electrode and at 1.20 V using the Al electrode. During the first 10~30 min of the process, 90~95% of the silver can be recovered.

• Korean Journal of Ecology and Environment
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• v.44 no.3
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• pp.272-279
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• 2011

Copper cyanide is a chemical produced in large quantities with 2,500 tonnes being produced in 2006. It is mainly used for electroplating copper, particularly alkali-Cu plate and brass plating. The purpose of this study is to reassess the physicochemical properties and environmental fate of copper cyanide based on reliable data and and to conduct an ecotoxicity test according to the OECD test guidelines as an initial environmental risk assessment (need to state where this was done). Metal containing inorganic substances are not subject to degradation, biodegradation or hydrolysis. Aquatic toxicity tests of copper cyanide were conducted according to OECD test guideline 201, 202 and 203 for green algae, daphnia, and fish, respectively. The following acute toxicity test results were obtained for aquatic species: 0.089 mg $L^{-1}$ (Algae, 72 Hr-$EC_{50}$); 0.21 mg $L^{-1}$ (flea, 48 Hr-$LC_{50}$); 0.62 mg $L^{-1}$ (Fish, 96 Hr-$ErC_{50}$). The chemical possesses properties indicating a hazard for the aquatic environment (acute toxicity in fish, daphnia and algae below 1.0 mg $L^{-1}$). As a result of this study, copper cyanide has become a candidate for detailed risk assessment. Countries that produce this chemical in significant quantities are recommended to perform specific assessments.