• Title/Summary/Keyword: 구리 영향

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실리콘 다이오드를 적용한 다채널 중성 입자 분석기 개발

  • Cheon, Se-Min;Jwa, Sang-Beom;Gang, In-Je;Lee, Heon-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.211-212
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    • 2011
  • 플라즈마를 제어하기 위해서는 플라즈마의 온도, 밀도, 에너지 분포등과 같은 플라즈마의 특성을 정확히 측정할 수 있어야한다. 핵융합발전에서는 플라즈마를 발생하기 위하여 플라즈마의 온도, 밀도 등 각종 변수들을 시공간적으로 계측, 분석할 수 있는 진달설비를 사용하고 있으며, 정확한 플라즈마 제어와 측정을 위한 새로운 진단기술을 개발하고 있다. 그리고 중요한 변수중에 하나인 플라즈마 이온온도를 측정하기 위해 중성입자 검출법이 잘 알려져 있다. 이 실험은 수소 중성입자가 토카막 내부의 플라즈마 이온과 충돌하면서 생성된 고속 중성입자의 에너지를 분석하는 실험이다. 본 연구의 실험방법은 수소 중성입자를 이온빔 장치에서 이온화 시킨 후 자체 제작한 가속기를 통하여 가속시켜 에너지 특성을 분석을 하는 것이다. 본 연구의 실험장치로 에너지 교정용 100 keV 이온빔 소스를 제작 하였고 이온빔 장치 내부에 수소기체를 주입하고 기체방전을 일으켜 플라즈마를 발생시켰다. 이온빔 외부에는 팬을 설치하고 전도성이 강한 물 대신 전도성이 약한 오일을 사용하여 냉각 하였다. 이온빔 장치와 결합될 이온 가속장치는 지름 300 mm, 두께 2 mm의 원형 구리판을 여러층으로 쌓아 전극으로 제작하였고 전극과 전극 사이에서 코로나 방전과 스파크를 방지하기 위해 전극 둘레에 코로나링을 설치 하였다. 또한 전극 사이마다 1G${\Omega}$의 저항을 설치한 후 고전압을 생성하여 이온 가속 효율을 증대시켰다. 진공시스템으로는 Alcatel사의 CFF100 터보분자 펌프와 우성진공사의 MVP24 진공로타리펌프를 결합하여 사용하였으며, 진공도측정은 Alcatel사의 ACS1000 장치를 사용하였다. 고진공후 고속 중성입자의 이온화와 에너지 측정을 위한 전하교환기를 설치하였다. 전하교환기로는 진공시스템을 별도로 설치하고 비용이 비교적 많이 드는 기체형 전하교환기 대신 소형화가 가능하고 유지보수가 좋은 고체형 전하교환기 제작하여 실험 하였다. 전하교환기에서 이온화된 고속 중성입자가 전기장이나 자장에 영향을 받았을때 에너지분포를 디텍터를 통해 측정하였다. 즉, 이온화된 중성입자의 에너지가 실리콘 다이오드를 통해 전압 펄스 신호로 변환되고 이차 증폭기를 통해 전압 펄스 신호들이 증폭한다. 에너지 측정을 위한 디텍터는 소형화가 가능하고 비용이 비교적 적게 드는 실리콘 다이오드를 설치하였다. 본 연구결과 중성입자 에너지 분석 장치가 실제 핵융합 장치의 플라즈마 이온온도와 특성 측정에 적용할 수 있으며, 앞으로 개발될 여러 형태의 응용 플라즈마 발생장치의 플라즈마 진단에 이용될 것으로 기대한다.

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Material modeling of the temperature rise at high-strain-rate deformation (고변형률 변형하에서 재료 내부의 온도상승 계산을 위한 재료 모델링)

  • Choi, Deok-Kee;Ryu, Han-Kyu
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.32 no.7
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    • pp.60-68
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    • 2004
  • High velocity impacts are accompanied with large deformations, which generate a large amount of heat due to plastic works, resulting in a significant temperature rise of the material. Because the elevated temperature affects the dynamic properties of materials, it is important to predict the temperature rise during high-stram-rate deformations. Both existing vacancies and excess vacancies are credited to the stored energy, yet it is difficult to distinguish one from another in contribution to the stored energy using macroscopic level materials models. In this study, an atomistic material model for fee materials such as copper is set up to calculate the stored energy using molecular dynamics (MD) simulations. It is concluded that excess vacancies play an important role for the stored energy during a high-strain-rate deformation.

The Effects of Current Types on Through Via Hole Filling for 3D-SiP Application (전류인가 방법이 3D-SiP용 Through Via Hole의 Filling에 미치는 영향)

  • Chang, Gun-Ho;Lee, Jae-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.4
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    • pp.45-50
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    • 2006
  • Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

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Induction and Inhibition of Amphibian(Rana dybowskii) Oocyte Maturation by Proteolytic Enzymes In vitro. (단백질분해효소들의 양서류 난자에 대한 성숙유도와 억제작용에 관하여)

  • 권혁방;고선근;박현정
    • The Korean Journal of Zoology
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    • v.33 no.1
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    • pp.53-62
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    • 1990
  • Fully grown amphibian oocytes undergo their maturation (germinal vesicle breakdown, GVBD) during in vitro follicle culture when they are stimulated with frog pituitary homogenate (FPH) or progesterone. Present experiments were designed to determine whether proteolytic enzymes are involved in the regulation of the matunation process. Treatment of a $\alpha$ -chymoiyypsin inhibitor, N a -tosyl-L-phenylalanine-chloromethyl-ketone(TP) to the oocytes exhibited a biphasic phenomenon, the induction of the maturation without added hormone at relatively low doses (0.001-1 $\mu$M) and inhibition of the hormone induced oocyte maturation at a high dose (100 $\mu$M). Treatment of a trypsin inhibitor, N a -tosyl-L-lysine-chloromethyl ketone(TLCK) to the oocytes did not induce the maturation, but rather suppressed the hormone induced oocyte maturation in a high dose(100 $\mu$ M). Treatment of exogenous iyypsin to the oocyte induced their maturation without added hormone in a dose dependent manner (0.001-1 $\mu$ M). The data presented here indicate that some proteolytic enzymes play a role in the regulation of the maturation(meiotic arrest or reinitiation) in amphibians.

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Effect of Additional Electrical Current on Adhesion Strength between Copper and Polyimide Films (인가 전류가 구리 도금 피막과 폴리이미드 필름의 접합력에 미치는 영향)

  • Lee, Jang-Hun;Han, Yoonsung;Lee, Ho-Nyun;Hur, Jin-Young;Lee, Hong Kee
    • Journal of the Korean institute of surface engineering
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    • v.46 no.1
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    • pp.9-15
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    • 2013
  • The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.

Effects of Superheat and Coating Layer on Interfacial Heat Transfer Coefficient between Copper Mold and Aluminum Melt during Solidification (응고중 구리 주형과 알루미늄 용탕의 계면열전달계수에 미치는 용탕과열도와 도형재의 영향)

  • Kim, Hee-Soo;Shin, Je-Sik;Lee, Sang-Mok;Moon, Byung-Moon
    • Journal of Korea Foundry Society
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    • v.24 no.5
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    • pp.281-289
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    • 2004
  • The present study focused on the estimation of the interfacial heat transfer coefficient as a function of the surface temperature of the aluminum casting at the mold/casting interface to investigate the effects of superheat and coating layer. The casting experiments of aluminum into a cylindrical copper mold were systematically conducted to obtain the thermal history during solidification. The thermal history recorded by four thermocouples embedded both in the mold and the casting was used to solve the inverse heat conduction problem using Beck's method. The effects of superheat and coating on the interfacial heat transfer coefficient in the liquid state, during the solidification, and in the solid state were comparatively discussed. In the liquid state, the interfacial heat transfer coefficient is thought to be affected by the roughness of the mold, the wettability of the casting on the mold surface, and the thermophysical properties of the coating layer. When the solidification begins, the air gap forms between the casting and the mold, and the interfacial heat transfer coefficient becomes a function of the air gap as well as surface roughness and the superheat. In the solid phase, it depends only upon the thermal conductivity and the thickness of the air gap. The coating layer reduces seriously the interfacial heat transfer coefficient in the liquid state and during the solidification.

Effects of Wafer Warpage on the Misalignment in Wafer Level Stacking Process (웨이퍼 레벨 적층 공정에서 웨이퍼 휘어짐이 정렬 오차에 미치는 영향)

  • Shin, Sowon;Park, Mansoek;Kim, Sarah Eunkyung;Kim, Sungdong
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.3
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    • pp.71-74
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    • 2013
  • In this study, the effects of wafer warpage on the misalignment during wafer stacking process were investigated. The wafer with $45{\mu}m$ bow height warpage was purposely fabricated by depositing Cu thin film on a silicon wafer and the bonding misalignment after bonding was observed to range from $6{\mu}m$ to $15{\mu}m$. This misalignment could be explained by a combination of $5{\mu}m$ radial expansion and $10{\mu}m$ linear slip. The wafer warpage seemed to be responsible for the slip-induced misalignment instead of radial expansion misalignment.

Complex Formation of 1,15-Diaza-3,4:12,13-dibenzo-5,8,11-trioxacycloheptadecane with Some Transition Metal Ions (전이금속이온과 1,15-Diaza-3,4:12,13-dibenzo-5,8,11-trioxacycloheptadecane과의 착물형성)

  • Cheul-Gyu Chang;Young-Kook Shin;Si-Joong Kim
    • Journal of the Korean Chemical Society
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    • v.30 no.6
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    • pp.526-531
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    • 1986
  • The stability constants of 1,15-diaza-3,4:12,13-dibenzo-5,8,11-trioxacycloheptadecane (NenOdien H$_4$, L) with transition metal ions such as $Co^{2+},\;Ni^{2+},\;Cu^{2+},\;and\;Zn^{2+}$ have been determined by potentiometry in 95% methanol solution at 25$^{\circ}$C. The complex formation of the NenOdien $_4$ with the transition metal ions depends on the basicity of the donor atoms. The order of complex stability was Co(II) < Ni(II) < Cu(II) > Zn(II). The geometries of the complexes in solid state were discussed by visible-near infrared and infrared spectrophotometry, elemental analysis and electro-conductivity. The results suggest that the geometries of the solid complexes are octahedral for $[CoL_2(OH_2)Cl]Cl{\cdot}2H_2O$, $[NiL_2(OH_2)Cl]Cl{\cdot}2H_2O$, and $[ZnLCl_2]{\cdot}\frac{1}{2}H_2O$ and square pyramidal for [CuLCl]Cl, respectively.

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Potentiometric Study of Transition Metal Ions Complexes of Hexadentate($N_4$, $O_2$) Ligands (질소-산소계 여섯 자리 리간드들의 전이금속이온 착물에 대한 전위차법 연구)

  • Kim, Sun-Deuk;Kim, Jun-Kwang;Lee, Woo-Sik
    • Journal of the Korean Chemical Society
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    • v.44 no.6
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    • pp.518-525
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    • 2000
  • The open-chain hexadentate N$_4$, O$_2$ ligands 1,13-bis(2-hydroxybenzyl)-2,5,9,12-tetraazatridecane-tetrahydrochloride (BSATD${\cdot}$4HCl) and 1,14-bis (2-hydroxybenzyl)-2,6,9,12-tetraazatetradecane-tetrahydrochloride (BSATED${\cdot}$ 4HCl) have been synthesized as their tetrahydrochloride salt and characterized by EA, IR, NMR and Mass. Their proton dissociation constants(log$K^{n}_{H}$) and stability constants(log$K_{ML}$) for Cu(II), Ni(II), Co(II), and Zn(II) ions were determined in aqueous solution by potentiometry and compared with those of analogous N$_4$, O$_2$ ligands contain ethylenic spacers or propylenic spacers, which make six-membered chelate rings between the aliphatic nitrogen atoms. Synthesis and characterization of [Cu(BSATD)]ClO$_4$ and [Cu(BSATED)](ClO$_4$)$_2$ complexes are described.

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Effect of Specimen Area on the Corrosion Rate of Low Alloy Steel (저합금강의 부식속도에 미치는 시편 면적의 영향)

  • Kim, Min-Jun;Jang, Young-Wook;Yoo, Yun-Ha;Kim, Jong-Jip;Kim, Jung-Gu
    • Journal of the Korean Electrochemical Society
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    • v.13 no.2
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    • pp.96-102
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    • 2010
  • Effects of specimen area on the corrosion rate of low alloy steel were studied in sulfuric acid solution. The corrosion behavior of specimen was tested by electrochemical impedance spectroscopy (EIS), linear polarization resistance measurement (LPR) and potentiodynamic polarization measurement. The surface was analyzed by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and electron probe X-ray micro analyzer (EPMA). As surface area was increased, corrosion rate was increased by the effect of small anode-large cathode.