Effects of Superheat and Coating Layer on Interfacial Heat Transfer Coefficient between Copper Mold and Aluminum Melt during Solidification |
Kim, Hee-Soo
(New Materials Processing Team, Advanced Materials R&D Center, Korea institute of Industrial Technology)
Shin, Je-Sik (New Materials Processing Team, Advanced Materials R&D Center, Korea institute of Industrial Technology) Lee, Sang-Mok (New Materials Processing Team, Advanced Materials R&D Center, Korea institute of Industrial Technology) Moon, Byung-Moon (New Materials Processing Team, Advanced Materials R&D Center, Korea institute of Industrial Technology) |
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