• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.25 no.10
• /
• pp.1659-1670
• /
• 2001

It has been reported that cracks at mechanical fastener holes usually nucleate as elliptical corner cracks at the faying surface of the mechanical joints and grow as elliptical arc through cracks after penetrating the opposite surface. The weight function method is an efficient technique to calculate the stress intensity factors fur elliptical cracks using uncracked stress field. In this study the weight function method for three dimensional mixed-mode problem applied to elliptical comer cracks Is modified for elliptical arc through cracks and the stress intensity factors at two surface points of elliptical arc through cracks at mechanical fastener holes are analyzed by the weight function method. This study consists of two parts and in part I , the weight function method for elliptical arc through cracks is developed and verified.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.25 no.10
• /
• pp.1671-1677
• /
• 2001

Cracks at mechanical fastener holes usually nucleate as elliptical comer cracks at the faying surface of the mechanical joints and grow as elliptical arc through cracks. The weight function method for elliptical arc through cracks at mechanical fastener holes has been developed and verified in the part I of this study. In part H, applying the weight function method, the effects of the amount of clearance on the mixed-mode stress intensity (actors are investigated and the change of crack shape is predicted from the analysis for various crack shapes. The stress intensity factors leer inclined crack are analyzed and critical angle at which mode I stress intensity factor becomes maximum is determined.

• KSCE Journal of Civil and Environmental Engineering Research
• /
• v.28 no.3A
• /
• pp.375-381
• /
• 2008

This paper deals with the shear capacity of corrugated rib as the shear connector in composite structures. Corrugated rib is modified as perfobond rib shear connector type to evaluate the shear capacity. A total 12 push-out specimens with stud, perfobond rib, and corrugated rib connector were fabricated. Then, the influences of hole-crossing bars, concrete dowel, depth of corrugated panel and height of rib on the shear capacity were evaluated experimentally. As the results of these tests, the failure mechanisms of corrugated rib and perfobond rib specimens were associated with the bearing failure of the concrete slabs, but the failure of weld zone did not occur. The shear capacity of corrugated rib specimens improved as high to 96% compared to the perfobond rib shear connectors. Also, the hole-crossing bars were effective on the improvement of concrete dowel action, and consequently, shear capacity increased by 48%. It was also proven that the increment of the depth of corrugated panel and the height of rib increased the concrete bearing resistance, therefore increasing the shear capacity.

• Proceedings of the KSME Conference
• /
• 2000.11a
• /
• pp.481-485
• /
• 2000

A new type of compliant press-fit pin has been developed and evaluated for use packaging of electronic telecommunications equipments. Main requirements for design are defined the upper limit of pin insertion force and the lower limit of pin retention force. Upper limit of pin insertion force is set to protect the copper plate of the inner PTH wall. Lower limit of pin retention force is set to satisfy a wire-wrapping specification. Results are represented by insertion force and retention force variations according to the front angle, rear angle and material, etc.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.4
• /
• pp.563-569
• /
• 2012

In the semiconductor and display device production processes, the handling of sensitive objects needs new carrying technology. Floating carrying motion is a practical alternative solution for non-contact handling of parts and substrates. This paper presents a study of through paths inside the air pressure pick-up head to generate the floating motion. The air motion by conceptual designed paths inside the head gradually develops positive pressure and vacuum between narrow objects. Positive pressure occurs through the head tip before discharging outside of the head. Negative pressure is developed by evacuating the inside head bottom as result of the radial flow connecting the vertical through-holes. The numerical analysis was done to figure out the stable levitation caused by the two acting forces between surfaces. In comparing with the standard case that the levitation gap gets 0.7-0.9 mm, it confirms the suggested head characteristics to show floating capacity in accordance with the head size, number of through-hole, and locations of through-hole in succession of conceptual design for a prototype.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2012.11a
• /
• pp.123-123
• /
• 2012

최근 연구되고 있는 TSV(Through Silicon Via) 기술은 Si 웨이퍼 상에 직접 전기적 연결 통로인 관통홀을 형성하는 방법으로 칩간 연결거리를 최소화 할 수 있으며, 부피의 감소, 연결부 단축에 따른 빠른 신호 전달을 가능하게 한다. 이러한 TSV 기술은 최근의 초경량화와 고집적화로 대표되는 전자제품의 요구를 만족시킬 수 있는 차세대 실장법으로 기대를 모으고 있다. 한편, 납땜 재료의 주 원료인 주석은 주로 반도체 소자의 제조, 반도체 칩과 기판의 접합 및 플립 칩 (Flip Chip) 제조시의 범프 형성 등 반도체용 배선재료에 널리 사용되고 있다. 최근에는 납의 유해성 때문에 대부분의 전자제품은 무연솔더를 이용하여 제조되고 있지만, 주석을 이용한 반도체 소자가 고밀도화, 고 용량화 및 미세피치(Fine Pitch)화 되고 있기 때문에, 반도체 칩의 근방에 배치된 주석으로부터 많은 알파 방사선이 방출되어 메모리 셀의 정보를 유실시키는 소프트 에러 (Soft Error)가 발생되는 위험이 많아지고 있다. 이로 인해, 반도체 소자 및 납땜 재료의 주 원료인 주석의 고순도화가 요구되고 있으며, 특히 알파 방사선의 방출이 낮은 로우알파솔더 (Low Alpha Solder)가 요구되고 있다. 이에 따라 본 연구는 4인치 실리콘 웨이퍼상에 직경 $60{\mu}m$, 깊이 $120{\mu}m$의 비아홀을 형성하고, 비아 홀 내에 기능 박막증착 및 전해도금을 이용하여 전도성 물질인 Cu를 충전한 후 직경 $80{\mu}m$의 로우알파 Sn-1.0Ag-0.5Cu 솔더를 접합 한 후, 접합부 신뢰성 평가를 수행을 위해 고속 전단시험을 실시하였다. 비아 홀 내 미세구조와 범프의 형상 및 전단시험 후 파괴모드의 분석은 FE-SEM (Field Emission Scanning Electron Microscope)을 이용하여 관찰하였다. 연구 결과 비아의 입구 막힘이나 보이드(Void)와 같은 결함 없이 Cu를 충전하였으며, 고속전단의 경우는 전단 속도가 증가할수록 취성파괴가 증가하는 경향을 보였다. 본 연구를 통하여 전해도금을 이용한 비아 홀 내 Cu의 고속 충전 및 로우알파 솔더 볼의 범프 형성이 가능하였으며, 이로 인한 전자제품의 소프트에러의 감소가 기대된다.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.16 no.7
• /
• pp.5015-5020
• /
• 2015

Push-out test is performed on perfobond shear connectors applying ultra high performance concretes with compressive strength higher than 80 MPa to evaluate their shear resistance. The test variables are chosen to be the diameter and number of dowel holes and, the change in the shear strength of the perfobond rib connector is examined with respect to the strength of two types of UHPC: steel fiber-reinforced concrete with compressive strength of 180 MPa and concrete without steel fiber with compressive strength of 80 MPa. The test results reveal that higher concrete strength and larger number of holes increased the shear strength, and that higher increase rate in the shear strength was achieved by the dowel action.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.47 no.12
• /
• pp.55-67
• /
• 2010

The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.

• Journal of the Korean Society of Visualization
• /
• v.18 no.1
• /
• pp.59-66
• /
• 2020

In the present study, we experimentally investigated the flow around a circular cylinder with axially arranged holes (AAH). The wind-tunnel experiment was performed at Re = 3.2 × 10⁴ while varying the angle of attack (α) from 0° to 90°. At low α, the passive jet from the AAH pushes near wake to the downstream, increasing the wake formation length. On the other hand, at high α, blowing and suction through AAH occurs alternatively, rather decreasing the wake formation length. The passive jet generated by AAH can effectively control not only the wake where AAH is located, but also the wake between holes. As a result, the AAH reduce the drag on the cylinder up to 23.8% at low α but rather increase the drag at high α, as compared to that on a smooth cylinder.

• Journal of the Korean Solar Energy Society
• /
• v.31 no.4
• /
• pp.103-111
• /
• 2011

Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.