• Textile Coloration and Finishing
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• v.31 no.4
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• pp.258-267
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• 2019

Synthetic suede without PFCs(perfluorinated compounds) are followed by subsequent high temperature treatment. But migration fastness of synthetic suede may be reduced due to sublimation of disperse dyes that results from the high temperature treatment. Therefore, in this study, chitosan treatment was used to improve the migration fastness before polyurethane dipping process. Polyester fiber was treated with sodium hydroxide aqueous solution before chitosan processing. This samples treated with a chitosan concentration upto 0.5% were dyed and coated with PUD(polyurethane dispersion). The migration fastness was most improved at 0.35% application. This is presumably due to the fact that the chitosan may increase the dye-binding capability through intermolecular hydrogen bonding.

• Journal of Korean Society for Atmospheric Environment
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• v.26 no.6
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• pp.624-632
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• 2010

Perfluorocarbons (PFCs) are widely used in semiconductor industry. These gases need to be removed efficiently because of their strong absorption of infrared radiation and long atmospheric lifetimes which cause the global warming effect. To destruct $CF_4$, a waterjet gliding arc plasma was designed and manufactured. The highest $CF_4$ destruction showed at waterjet plasma case, compared to plasma discharge only or water scrubber only, respectively. In addition, it could be known that the $CF_4$ destruction should be associated with the electron and OH radicals. The operating conditions such as waterjet flow rate, initial $CF_4$ concentration, total gas flow rate, specific energy input were investigated experimentally using a plasma waterjet scrubber. Through the parametric studies, the highest $CF_4$ destruction of 94.5% was achieved at 0.2% $CF_4$, 2.1 kJ/L SEI, 20 L/min total gas flow rate and 18.5 mL/min waterjet flow rate.

• Journal of Korean Society of Environmental Engineers
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• v.34 no.10
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• pp.702-708
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• 2012

Tetrafluoromethane ($CF_4$) has been used as etching and Chemical Vapor Deposition (CVD) gases for semiconductor manufacturing processes. These gases need to be removed efficiently because of their strong absorption of infrared radiation and long atmospheric lifetimes which cause the global warming effect. Also, the wastewater including the fluorine is caused by of the ground water pollution. Long-term consumption of water containing excessive fluoride can lead to fluorosis of the teeth and bones. The wastewater including the fluorine among the by-product which is generated by using the waterjet plasma after destroying $CF_4$ by HF is generated. The system which can remove the hydrogen fluoride among the wastewater by using the electrocoagulation using this wastewater the aluminum electrode was developed. The operating condition such as initial pH, electrocoagulation time, wastewater flow rate, current density were investigated experimentally using a electrocoagulation. Through the parametric studies, the highest hydrogen fluoride destruction of 85% was achieved at 3.5 initial pH, 10 min electrocoagulation time, 10 mL/min wastewater flow rate and $159A/m^2$ current density.

• Journal of Korean Society of Environmental Engineers
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• v.34 no.6
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• pp.391-396
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• 2012

The destruction study of $NF_3$ gas emitted from the semiconductor industry is performed with electron-beam technology. Absorbed dose (kGy) and current ranged from 0 (0) to 400 kGy (20 mA). The concentration of $NF_3$ gas ranged from 500 to 2,000 ppm. In order to assess the effect of a residence time on DRE (Destruction and Removal Efficiency, %), experiments also conducted at different irridiation times of 5 sec, 10 sec, 15 sec and 20 sec respectively. As absorbed dose and current increased, DRE of $NF_3$ was also increased. However, DRE (%) of $NF_3$ decreased with increasing the concentration of $NF_3$ gas. The DRE of $NF_3$ was about 90% at an absorbed dose of 400 kGy.

• Journal of the Korea institute for structural maintenance and inspection
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• v.19 no.5
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• pp.45-55
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• 2015

Currently, extreme weather events such as super typhoon, extreme snowfall, and heat wave are frequently occurring all over the world by natural and human caused factors. After industrial growth in the 1970s, earth's temperature has risen sharply. due to greenhouse effect. Global warming can be attributed to gases emitted from using fossil fuel such as average carbon dioxide, perfluorocarbons, nitrous oxide, and methane. Especially, carbon dioxide has the highest composition of about 90%. in the fossile fuel usage emitted gas. Concrete has excellent durability as a building material climate change. However, due to various of physical and chemical environmental effect such as conditions during its curing process, the performance degradation may occur. Carbon dioxide in the atmosphere causes steel corrosion and durability decreases by lowering the alkalinity of concrete. Therefore, in this study, concrete durability performance with respect to carbonation from curing conditions change due to wind speed and sunshine exposure time. Concrete carbonation experiment are performed. using wind speed (0, 2, 4, 6) m/s and sunlight exposure time (2, 4, 6, 8) hrs. Also, performance based evaluation through the satisfaction curve based on the carbonation depth and carbonation rate test results are performed.

• Journal of the Korea Organic Resources Recycling Association
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• v.30 no.4
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• pp.51-57
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• 2022

This paper investigated catalytic and adsorption equations among the technologies for removing hazardous substances generated in the semiconductor process. As the semiconductor industry develops, harmful substances used and discharged in the semiconductor process are also increasing. Hazardous substances adversely affect the global environment in terms of atmospheric and water quality. As regulations on the emission of harmful substances are strengthened in the 21st century, it is expected that there will be limitations in industrial development in the future. Therefore, technology for removing harmful substances generated in semiconductor processes is essential. In this paper, the goal is to remove PFCs, which are harmful substances, through adsorption technology and catalyst technology. Descriptions from the semiconductor process to the technology in which harmful substances generated are removed were summarized.