• 제목/요약/키워드: 계면접착특성

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Effect of surface modification on adhesion of copper films on PET prepared by ECR-MOCVD (ECR 상온화학증착법에 의해 PET기판에 제조된 구리 박막의 표면전처리에 따른 접착력 특성)

  • Hyun, Jin;Byun, Dong-Jin;Lee, Jung-Gi
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.210-210
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    • 2003
  • ECR(Electron Cyclotron Resonance)은 전자기장에 의한 회전주파수와 전원으로 가해지는 마이크로웨이브(microwave)의 주파수가 일치할 때 발생하는 공진(resonance)현상이다. ECR에 의해 형성된 고밀도, 고에너지의 플라즈마가 상온하에서도 표면에너지가 낮은 고분자수지상에 접착력과 내구성 및 성능이 우수한 금속박막을 형성시킬 수 있는 특징을 지니고 있다. [1] 이러한 고분자수지 표면에 제조되는 금속박막소재는 반도체산업을 비롯하여, 박막전지, 전자파 차폐 등의 다양한 용도로 개발되고 있다. 그러나, 고분자수지와 금속박막계면간의 접착성의 저하로 후처리 공정에서 외부의 응력을 받게되면 막이 쉽게 탈리되는 문제점이 대두되었고, 이에 대한 개선이 요구되고 있다. 따라서, 본 연구에서는 공업적으로 많이 사용되는 표면 전처리방법을 통하여 구리 박막의 접착력을 향상시키고자 하였다. 상온화학증착 방법에 의해 고분자수지표면에 구리금속박막을 제조하고 여러 가지 표준방법을 사용하여 고분자수지와 구리박막간의 접착특성을 조사하였다.

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Cu Thickness Effects on Bonding Characteristics in Cu-Cu Direct Bonds (Cu 두께에 따른 Cu-Cu 열 압착 웨이퍼 접합부의 접합 특성 평가)

  • Kim, Jae-Won;Jeong, Myeong-Hyeok;Carmak, Erkan;Kim, Bioh;Matthias, Thorsten;Lee, Hak-Joo;Hyun, Seung-Min;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.61-66
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    • 2010
  • Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

Antistatic Behavior of UV-curable Multilayer Coating Containing Organic and Inorganic Conducting Materials (유·무기 전도성 물질을 함유한 UV 경화형 다층 코팅의 대전방지 특성)

  • Kim, Hwa-Suk;Kim, Hyun-Kyoung;Kim, Yang-Bae;Hong, Jin-Who
    • Journal of Adhesion and Interface
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    • v.3 no.3
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    • pp.22-29
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    • 2002
  • UV curable coating system described here consists of double layers, namely under layer and top laser coatings. The former consists of organic-inorganic conductive materials and the latter consists of multifunctional acrylates. Transparent double layer coatings were prepared on the transparent substrates i.e. PMMA, PC, PET etc. by the wet and wet coating procedure. Their surface resistances and film properties were measured as a function of the top layer thickness and relative humidity. As the thickness of the top layer was less than $10{\mu}m$, the surface resistance in the range of $10^8{\sim}10^{10}{\Omega}/cm^2$ was obtained. The surface properties of the two-layer coating were remarkably improved compared with the single layer coating. The effects of migration of conducting materials on the film properties of multilayer coating were investigated by using contact angle and Fourier transform infrared/attenuated total reflection(FT-IR/ATR). It was found that the migration of dopant(dodecyl benzenesulfonic acid, DBSA) molecules were occurred from film-substrate interface to film-air interface in the organic conductive coating system but not in the inorganic one.

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Irreversible Charge Trapping at the Semiconductor/Polymer Interface of Organic Field-Effect Transistors (유기전계효과 트랜지스터의 반도체/고분자절연체 계면에 발생하는 비가역적 전하트래핑에 관한 연구)

  • Im, Jaemin;Choi, Hyun Ho
    • Journal of Adhesion and Interface
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    • v.21 no.4
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    • pp.129-134
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    • 2020
  • Understanding charge trapping at the interface between conjugated semiconductor and polymer dielectric basically gives insight into the development of long-term stable organic field-effect transistors (OFET). Here, the charge transport properties of OFETs using polymer dielectric with various molecular weights (MWs) have been investigated. The conjugated semiconductor, pentacene exhibited morphology and crystallinity, insensitive to MWs of polymethyl methacrylate (PMMA) dielectric. Consequently, transfer curves and field-effect mobilities of as-prepared devices are independent of MWs. Under bias stress in humid environment, however, the drain current decay as well as transfer curve shift are found to increase as the MW of PMMA decreases (MW effect). The charge trapping induced by MW effect is irreversible, that is, the localized charges are difficult to be delocalized. The MW effect is caused by the variation in the density of polymer chain ends in the PMMA: the free volumes at the PMMA chain ends act as charge trap sites, corresponding to drain current decay depending on MWs of PMMA.

Enhanced Environmental Stability of Graphene Field-Effect Transistors through Interface Control (계면 제어를 통한 그래핀 기반 전계효과 트랜지스터의 환경 안정성 향상)

  • Seong, Jun Ho;Lee, Dong Hwa;Lee, Eunho
    • Journal of Adhesion and Interface
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    • v.23 no.3
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    • pp.75-79
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    • 2022
  • Graphene is a two-dimensional carbon allotrope composed of honeycomb sp2 hybrid orbital bonds. It shows excellent electrical and mechanical properties and has been spotlighted as a core material for next-generation electronic devices. However, it exhibits low environmental stability due to the easy penetration or adsorption of external impurities from the formation of an unstable interface between the materials in the electronic devices. Therefore, this work aims to improve and investigate the low environmental stability of graphene-based field-effect transistors through direct growth using solid hydrocarbons as a precursor of graphene. Graphene synthesized from direct growth shows high electrical stability through reduction of change in charge mobility and Dirac voltage. Through this, a new approach to utilize graphene as a core material for next-generation electronic devices is presented.

Preparation and Adhesion of One Part Room Temperature Curable Alkoxy Type Silicone Sealant (일액형 알코올형 실리콘 실란트의 제조 및 접착 물성)

  • Kim, Dae-Jun;Park, Young-Jun;Kim, Hyun-Joong;Lee, Bong Woo;Han, Jae Chul
    • Journal of Adhesion and Interface
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    • v.2 no.4
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    • pp.1-9
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    • 2001
  • Silicone sealants are composed of polymer, plasticizer, crosslinker, catalyst and filler. Types and compositions of components are effected on sealant performances. In recent, use of alkoxy type silicone sealant increased due to environmental advantage. In this study, we investigated effects of component types and ratios on one-part room temperature curable alkoxy type silicone sealant preparation and adhesion properties. Alkoxy type silicone sealants were prepared with various PDMS (polydimethylsiloxane) viscosities. In addition, the effect of plasticizer, crosslinkers, and catalyst on sealant obtained from by mixture of PDMS viscosities of 20000 and 80000 was investigated. Reaction temperature on change of mixing time was observed, and then proper crosslinking systems were found. Adhesion (properties) of silicone sealants were measured. In the sealants preparation, stable reaction was achieved by adjusting composition variance ratio in the sealant mixture temperature below $40^{\circ}C$. The adhesion properties of sealant differ from substrate composition. The order of adhesion strength was glass/glass > glass/aluminum > aluminum/aluminum system. The elongation of sealant was increased as polymer viscosity and plasticizer content increased. The strength was increased as crosslinker and plasticizer decreased, while catalyst increased.

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Fabrication and characterization of the nano- and micro-particles applied dry adhesives (나노 또는 마이크로 입자의 전사를 이용한 건식 접착제의 제조 및 특성 분석)

  • Yu, Min Ji;Vu, Minh Canh;Han, Sukjin;Park, Jae Hong;Kim, Sung-Ryong
    • Journal of Adhesion and Interface
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    • v.20 no.1
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    • pp.23-28
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    • 2019
  • In this study, the micro- and nano-particles were used and their shapes were transferred into the polydimethylsiloxane (PDMS) film to fabricate the dry adhesives and their properties were investigated. The Cu nanoparticles of the sizes of 20 nm, 40 nm and 70 nm and the polymethylmethacrylate (PMMA) beads of the size of $5{\mu}m$ were used to transfer their images and the resultant properties of the dry adhesives were compared. The effects of particle size and materials on the mechanical property, tensile adhesion strength, light transmittance, surface morphology, water contact angle were studied. The dry adhesives obtained from the transfer process of Cu nanoparticles with the size of 20 nm resulted in the enhancement of tensile adhesion strength more than 300% compared to that of the bare PDMS. The formation of nanostructure of large surface area on the surface of the PDMS film by the Cu nanoparticles may responsible for the improvement. This study suggests that the use of nanoparticles during the fabrication of PDMS dry adhesives is easy and effective and could be applied to the fabrication of the medical patch.

Interfacial Evaluation of Single-Carbon Fiber/Phenolic and Carbon Nanotube-Phenolic Composites Using Micromechanical Tests and Electrical Resistance Measurements (미세역학시험법과 전기저항 측정을 이용한 탄소섬유/페놀수지 및 탄소나노튜브-페놀수지 복합재료의 계면특성 평가)

  • Wang, Zuo-Jia;Kwon, Dong-Jun;Gu, Ga-Young;Park, Jong-Kyoo;Lee, Woo-Il;Park, Joung-Man
    • Journal of Adhesion and Interface
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    • v.11 no.4
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    • pp.149-154
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    • 2010
  • Interfacial evaluation was investigated for single-carbon fiber/phenolic and carbon nanotube (CNT)-phenolic composites by micromechanical technique and electrical resistance measurement combined with wettability test. Compressive strength of pure phenol and CNT-phenolic composites were compared using Broutman specimen. The contact resistance of CNT-phenolic composites was obtained using a gradient specimen by two and four-point methods. Surface energies and wettability by dynamic contact angle measurement were measured using Wilhelmy plate technique. Since hydrophobic domains are formed as heterogeneous microstructure of CNT in the surface, the dynamic contact angle exhibited more than $90^{\circ}$. CNT-phenolic composites exhibited a higher apparent modulus than neat phenolic case due to better stress transferring effect. Work of adhesion, $W_a$ between single-carbon fiber and CNT-phenolic composites exhibited higher than neat phenolic resin due to the enhanced viscosity by CNT addition. It was consistent with micro-failure patterns in microdroplet test.

Self-Sensing and Interfacial Property of Carbon Nanofiber/Epoxy Composites with Different Aspect Ratios (형상비가 다른 탄소나노섬유/에폭시 복합재료의 자체 감지능 및 계면특성)

  • Jang, Jung-Hoon;Kim, Pyung-Gee;Kim, Sung-Ju;Wang, Zuo-Jia;Park, Joung-Man;Yoon, Dong-Jin
    • Journal of Adhesion and Interface
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    • v.9 no.1
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    • pp.3-8
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    • 2008
  • Self-sensing was evaluated for carbon nanofiber (CNF)/epoxy composites with two different aspect ratios via electro-micromechanical technique and wettability test. Volumetric electrical resistance was measured to evaluate the comparative dispersion degree indirectly and it decreased due to the increase of electric contacts with increasing CNF concentration. The dispersion degree was evaluated indirectly by calculating coefficient of variation (COV) of volumetric electrical resistance. The CNF type A with a high aspect ratio showed better self-sensing than the case of CNF type B with a short aspect ratio. The CNF type B/epoxy composite showed little self-sensing at a concentration higher than 2 vol% probably due to poor dispersion. The apparent modulus of CNF type B was higher than that of CNF type A due to the orientation effect and the high surface area. The thermodynamic work of adhesion was consistent with the result of apparent modulus.

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Synthesis and Hydrolysis-Resistance Characterization of Waterborne Polyurethane (Waterborne Polyurethane의 합성 및 내가수분해 특성 연구)

  • Jeong, Booyoung;Cheon, Jungmi;Chun, Jaehwan
    • Journal of Adhesion and Interface
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    • v.13 no.3
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    • pp.116-120
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    • 2012
  • In this study, waterborne polyurethane was prepared from polyester polyol, $H_{12}MDI$, DMPA and sulfopropylated polypropyleneglycol-${\alpha}$,${\omega}$-diamine (SP). The $T_g$ of waterborne polyurethane was increased as the SP content increased, while it was decreased at the NCO/OH ratio of 1.8. Also the hydrolysis-resistance and tensile strength were increased as the SP content increased. The tensile strength decrement of WPU-SP was 2~5% with the exception of WPU-SP-1.