• Composites Research
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• v.17 no.6
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• pp.37-43
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• 2004

To determine the effect of chain length and chemical structure of linear amine curing agents on thermal and mechanical properties, a standard bifunctional linear DGEBF epoxy resin was cured with EDA and HMDA having amine group at the both ends of main chain in a stoichiometrically equivalent ratio in condition of preliminary and post cure. From this work, the effect of linear amine curing agents on the thermal and mechanical properties is significantly influenced by numbers of carbon atoms of main chain. In contrast, the results show that the DCEBF/EDA system having two carbons had higher values in the thermal stability, density, shrinkage (%), grass transition temperature, tensile modulus and strength, flexural modulus and strength than the DGEBF/HMDA system having six carbons, whereas the DGEBF/EDA cure system had relatively low values in maximum ekothermic temperature, maximum conversion of epoxide, thermal expansion coefficient than the DGEBF/HDMA cure system. These findings indicate that the packing capability (rigid property) in the EDA structure affects the thermal and mechanical properties predominantly. It shows that flexural fracture properties have a close relation to flexural modulus and strength.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.211-216
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• 2016

In several industrial fields, epoxy resin is widely used as an adhesive for co-curing and manufacturing various structures. Controlling the manufacturing process is required for ensuring robust bonding performance and the stability of the structures. A fiber optic sensor is suitable for the cure monitoring of epoxy resin owing to the thready shape of the sensor. In this paper, a fiber Bragg grating (FBG) sensor was applied for the cure monitoring of epoxy resin. Based on the experimental results, it was demonstrated that the FBG sensor can monitor the status of epoxy resin curing by measuring the strain caused by volume shrinkage and considering the compensation of temperature. In addition, two types of epoxy resin were used for the cure-monitoring; moreover, when compared to each other, it was found that the two types of epoxy had different cure-processes in terms of the change of strain during the curing. Therefore, the study proved that the FBG sensor is very profitable for the cure-monitoring of epoxy resin.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.14-20
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• 2003

In order to study the radiation curing behavior of poly(ethylene glycol 400) dimethacrylate and ethylene glycol dimethacrylate, we investigated the influence of temperature and photoinitiator concentration by photo-DSC. As the number of ethylene glycol unit, the concentration of photoinitiator, and the reaction temperature increased, the reaction speed of PEG400DMA and EGDMA increased. Although the reaction speed of PEG400DMA was lower than EGDMA, the overall conversion of PEG400DMA was high.

• Polymer(Korea)
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• v.37 no.1
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• pp.41-46
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• 2013

The glass transition temperature ($T_g$) and conversion (${\alpha}$) were measured for a diglycidyl ether of bisphenol A (DGEBA) epoxy/aromatic amine system incorporated with an organic-inorganic hybrid molecule, polyhedral oligomeric silsesquioxane (POSS). Samples isothermally cured at varying cure temperatures and times were analyzed by differential scanning calorimetry (DSC). $T_g$ vs. ln (time) data at an arbitrary reference were superposed by time-temperature shifts for the kinetically controlled reaction, and the shift factors were used to calculate an Arrhenius activation energy. Influence of POSS was investigated from $T_g$ vs. ${\alpha}$ data, which in turn were fitted with DiBenedetto equation.

• Polymer(Korea)
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• v.27 no.3
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• pp.176-182
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• 2003

The fluorine-containing epoxy resin, 2-trifluorotoluene diglycidylether (FER) was prepared by reaction of 2-chloro-${\alpha}$,${\alpha}$,${\alpha}$-trifluorotoluene with glycerol diglycidylether in the presence of pyridine catalyst. Curing behavior of FER/DDM system was investigated using dynamic and isothermal DSC. Cure activation energy (Ea) was determined by Flynn-Wall-Ozawa's equation. The rheological properties of FER/DDM system were studied under isothermal condition using a rheometer. Cross-linking activation energy (Ec) was determined from the Arrhenius equation based on gel time and curing temperature. As a result, the chemical structure of FER was confirmed by FT-IR, $\^$13/C NMR, and $\^$19/F NMR spectroscopy. The cure activation energy of FER/DDM system was 55.4 kJ/mol and conversion and conversion rate were increased with the curing temperature. The cross-linking activation energy of FER/DDM system was 41.6 kJ/mol and gel time was decreased with the curing temperature.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.707-713
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• 1998

The influence of plasma carburizing process on the surface hardness of SCM415 low-alloy steel (0.15% C) was investigated under the various process conditions of gas composition. gas pressure, plasma current density. temperature and time. The effective case depth was found to depend on the amount of methan gas containing carbon. thus the deepest case depth and the uniform hardeness were obtained with the 100% methan gas. The case depth increased with the plasma current density. The effective plasma carburizing temperature of SCM415 steel was found to be higher than 85$0^{\circ}C$, and the case depth was proportional to the square root of carburizing time under the same current density. The bending fatigue strength of the plasma carburized specimen is' higher than those of as- received specimen or reheat-quenched specimen.

• Polymer(Korea)
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• v.26 no.5
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• pp.599-606
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• 2002

In this study, 4,4'-tetraglycidyl diaminodiphenyl methane (TGDDM)/polyamideimide (PAI) blends were cured using diaminodiphenyl sulfone (DDS). And the effect of addition of different PAI contents to neat TGDDM was investigated in the thermal, mechanical, and morphological properties of the blends. The cure behavior and thermal stability of the cured specimens were monitored by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. Also, the critical stress intensity factor (K$\_$IC/) was measured in UTM, and the phase separation behavior and final morphology of TGDDM/PAI blends were examined in scanning electron microscopy(SEM). As a result, the cure temperature and cure activation energy (E$\_$a/) were decreased with increasing the PAI content. The decreasing of cure temperature and cure activation energy were probably due to the presence of secondary amine group of PAI backbone used as co-initiator. But, the decomposition activation energy (E$\_$t/) and K$\_$IC/ value were increased up to 5. 10 phr of PAI content, respectively and they were decreased above the PAI contents. These results were explained on the basis of chain scission reaction by etherification. And morphology of blends observed from SEM was confirmed in co-continuous structures.

• Proceedings of the KAIS Fall Conference
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• 2000.10a
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• pp.237-240
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• 2000

본 연구에서는 비스페놀 A, 에피크로로히트린을 반응시킨 에폭시 기본주제를 중심으로 경화제, 희석제, 충진제, 촉매 등을 배합하여 토목, 건축용 반고체형 에폭시 접착제를 개발하였다. 여기서 특히 에폭시 주제와 희석제의 종류 및 배합비율에 따른 기본 물성, 접착성능 등을 측정하였다. 상온 경화 특성을 측정하기 위하여 경화시 간을 측정한 결과 희석제의 종류와 관계없이 희석제의 양이 증가할수록 경화시간이 증가하고 경화온도도 증가하는 경향을 알 수 있었으며 촉매의 양이 적을 경우가 경화시간이 빠른 것을 알 수 있었다. 또한 경화 시간은 30분 내지 40분 정도로 상온에서 사용할 수 있을 것으로 기대한다. 접착력 시험 결과는 촉매의 양이 적당한 때 가장 좋은 접착력을 나타내고 희석제 중에서 HDGE의 경우가 가장 좋은 접착력을 나타내었고 희식제의 양이 증가할수록 접착력은 증가하였다. 실리카와 철분을 섞어 반고체형 에폭시 접착제를 제조한 경우 기존의 제품보다 우수한 접착력을 나타내었다. 따라서 본 연구에서 개발한 반고체형 접착제는 제조공정 코스트 등에 대한 검토와 함께 제품화하여 토목, 건축 분야의 콘크리트 균열 접착, 볼트와 콘크리트의 접합, 목재의 접합 등에 간편하게 사용될 수 있으며, 배합물질과 비율에 따라 전기전자. 토목건축, 자동차산업 등의 산업용 접착제로서 응용될 수 있을 것으로 기대된다.

• Polymer(Korea)
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• v.24 no.5
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• pp.690-700
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• 2000

In this study, an elastomer-assistered compression molding process was investigated by experiments as well as modeling for the long-fiber reinforced thermoset composites. The consolidation pressure generated by fixed-volume and variable-volume conditions was thermodynamically derived for both elastomer and curing prepregs, and was compared with the pressure measured during curing of epoxy matrix. Exhibiting non-linear viscoelastic characteristics in the compressive stress-strain tests, the measured stress was well compared with a modifed KWW (Kohlrausch-Williame-Watts) equation, which is based on the Maxwell viscoelastic model. Using the developed model equations, the consolidation pressure generated by the elastomer was successfully predicted for the compression molding process of thermoset composite materials in tile closed mold system.

• Composites Research
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• v.33 no.5
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• pp.302-308
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• 2020

We measured the thermal conductivity of composite materials manufactured by the autoclave and vacuum bag only processes and predicted the cure behavior of the external and internal of composite parts with a cure kinetics model. The temperature difference between the external and internal depends on the processes because of the change of thermal conductivity. In the autoclave process, the temperature and cure behavior of the internal were similar to those of the external because of the high thermal conductivity. However, the temperature of the internal of the vacuum bag only process was different from that of the external. The difference can influence the part quality and evacuation of air. Compression tests were performed to find the mechanical property using 0° unidirectional specimens. The composite of the vacuum bag only process was found to have a lower compressive strength than that of the autoclave process.