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http://dx.doi.org/10.7317/pk.2013.37.1.41

Effect of Polyhedral Oligomeric Silsesquioxane on Cure Characterization of an Epoxy/Amine System  

Gu, Puzhong (Department of Polymer Science and Engineering, Kumoh National Institute of Technology)
Lee, Jong Keun (Department of Polymer Science and Engineering, Kumoh National Institute of Technology)
Publication Information
Polymer(Korea) / v.37, no.1, 2013 , pp. 41-46 More about this Journal
Abstract
The glass transition temperature ($T_g$) and conversion (${\alpha}$) were measured for a diglycidyl ether of bisphenol A (DGEBA) epoxy/aromatic amine system incorporated with an organic-inorganic hybrid molecule, polyhedral oligomeric silsesquioxane (POSS). Samples isothermally cured at varying cure temperatures and times were analyzed by differential scanning calorimetry (DSC). $T_g$ vs. ln (time) data at an arbitrary reference were superposed by time-temperature shifts for the kinetically controlled reaction, and the shift factors were used to calculate an Arrhenius activation energy. Influence of POSS was investigated from $T_g$ vs. ${\alpha}$ data, which in turn were fitted with DiBenedetto equation.
Keywords
cure behavior; epoxy; amine; polyhedral oligomeric silsesquioxane;
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