• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.81-82
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• 2006

SOI(Silicon-On-Insulator) MOSFET의 전기적 특성에 미치는 게이트 산화막과 계면준위 밀도의 관계를 조사하였다. 결함이 발생하지 않는 얕은 소스/드레인 접합을 형성하기 위하여 급속열처리를 이용한 고상확산방법으로 제작한 SOI MOSFET 소자는 급속열처리 과정에서 계면준위가 증가하여 소자의 특성이 열화된다. 이를 개선하기 위하여 $H_2/N_2$ 분위기에서 후속 열처리 공정을 함으로써 소자의 특성이 향상됨을 볼 수 있었다. 이와같이 급속열처리 공정과 $H_2/H_2$ 분위기에서의 후속 열처리 공정이 소자 특성에 미치는 영향을 분석하기 위하여 소자 시뮬레이션을 이용하여 게이트 산화막과 채널 사이의 계면준위 밀도를 분석하였다. 그 결과, n-MOSFET의 경우에는 acceptor-type trap, p-MOSFET의 경우에는 donor-type trap density가 소자특성에 큰 영향을 미치는 것을 확인하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.3
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• pp.1-6
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• 2011

Low-power logic gates, i.e. inverter, NAND, and NOR, are proposed employing only n-channel oxide thin film transistors (TFTs). The proposed circuits were designed to prevent the pull-up and pull-down switches from being turned on simultaneously by using asymmetric feed-through and bootstrapping, thereby exhibited same output voltage swing as the input signal and no static current. The inverter is composed of 5 TFTs and 2 capacitors. The NAND and the NOR gates consist of 10 TFTs and 4 capacitors respectively. The operations of the logic gates were confirmed successfully by SPICE simulation using oxide TFT model.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.1
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• pp.1-7
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• 2012

We have developed a new gate driver circuit for liquid crystal displays using oxide thin-film transistors (TFTs). In the new gate driver, negative gate bias is applied to turn off the oxide TFTs because the oxide TFT occasionally has negative threshold voltage (VT). In addition, we employed three parallel pull-down TFTs that are turned on in turns to enhance the stability. SPICE simulation showed that the proposed circuit worked successfully covering the VT range of -3 V ~ +6 V And fabrication results confirmed stable operation of the new circuit using oxide TFTs.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.494-497
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• 2002

In this paper, we have presented the simulation results about threshold voltage of nano scale lightly doped drain (LDD) MOSFET with halo doping profile. Device size is scaled down from 100nm to 40nm using generalized scaling. We have investigated the threshold voltage for constant field scaling and constant voltage scaling using the Van Dort Quantum Correction Model(QM) and direct tunneling current for each gate oxide thickness. We know that threshold voltage is decreasing in the constant field scaling and increasing in the constant voltage scaling when gate length is reducing, and direct tunneling current is increasing when gate oxide thickness is reducing. To minimize the roll-off characteristics for threshold voltage of MOSFET with decreasing channel length, we know u value must be nearly 1 in the generalized scaling.

• KIPS Transactions on Computer and Communication Systems
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• v.2 no.3
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• pp.103-110
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• 2013

Logical Effort [1, 2] is a simple hand-calculated method that measures quick delay estimation. It has the advantage of reducing the design cycle time. However, it has shortcomings in designing a path for minimum area or power under a fixed-delay constraint. The method of overcoming the shortcomings is shown in [3], but it is constrained for a single logical path. This paper presents an advanced gate sizing method in multiple logical paths based on the equal delay model. According to the results of the simulation, the power dissipation for both the existing logical effort method and proposed method is almost equal. However, compared with the existing logical effort method, it is about 52 (%) more efficient in space.

• Korean Chemical Engineering Research
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• v.60 no.2
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• pp.313-319
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• 2022

AlGaN/GaN based HfO₂ MOSHEMT (metal oxide semiconductor high electron transistor) with different gate recess depth was simulate to demonstrate a successful normally-off operation of the transistor. Three types of the HEMT structures including a conventional HEMT, a gate-recessed HEMT with 3 nm thick AlGaN layer, and MIS-HEMT without AlGaN layer in the gate region. The conventional HEMT showed a normally-on characteristics with a drain current of 0.35 A at V_G = 0 V and V_DS = 15 V. The recessed HEMT with 3 nm AlGaN layer exhibited a decreased drain current of 0.15 A under the same bias condition due to the decrease of electron concentration in 2DEG (2-dimensional electron gas) channel. For the last HEMT structure, distinctive normally- off behavior of the transistor was observed, and the turn-on voltage was shifted to 0 V.

• The Transactions of the Korea Information Processing Society
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• v.2 no.4
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• pp.603-610
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• 1995

In this paper, we present a highly efficient simulation package which supports simulation from functional level to gate level. The package consists of a set of front-end tools, a logic simulator, named HSIM(Highly efficient logic SIMulator), and an waveform analyzer. The front-end tools include a netlist compiler, functional primitive compiler and behavioral compiler. Key feature of developed simulator is that the compiled behavioral models written in C language are directly executed in the simulation engine using incremental loader. By doing so, we achieved significant speed up as compared with the interpretive functional simulator. Experimental results show that HSIM runs about 55% faster than traditional unit-delay event-driven interpretive simulator.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.3
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• pp.220-228
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• 2001

Simulation of an instruction set is essential to design and optimize new microprocessors, and to develop application programs. Though many simulation tools are widely used, their low-level description and simulation make users construct simulators difficult and spend a lot of time for simulation. We developed an automatic generator of instruction set simulators that perform register-transfer-level simulation. This automatic generator might be adaptable so as to be suitable for new modification or different conditions in designing microprocessors. In this paper, we describe a structure of automatic generation system and an implementation details.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.2
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• pp.28-28
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• 2001

능동제어형 전계방출 디스플레이의 전자공급원으로서 능동제어형 전계 에미터 어레이의 회로모델이 제안되었다. 능동제어형 전계 에미터 어레이는 전계방출을 안정화시키고 저전력구동을 위한 수소화 된 비정질 실리콘 박막 트랜지스터와 Spindt형 Mo 전계 에미터 어레이로 구성되었고 같은 유리기판 위에 제작되었다. 비정질 박막 트랜지스터와 Spindt형 Mo 전계 에미터 어레이의 전기적 특성으로부터 추출된 기본 모델 변수는 제안된 능동제어형 전계 에미터 어레이 회로모델에 입력되었고 SPICE 회로 시뮬레이터를 사용하여 특성을 분석하였다. 제작된 소자의 측정값과 DC 시뮬레이션 결과를 비교한 결과 두 값이 상당히 일치함으로써 등가회로 모델의 정확성을 확인하였다. 또한 제작된 소자의 transient 시뮬레이션 결과 전계 에미터 어레이의 게이트 커패시턴스와 TFT의 구동능력이 반응시간에 가장 크게 영향을 끼치고 있음을 확인하였다. 제작된 능동제어형 전계방출 에미터 어레이는 pulse width modulation으로 구동하는 경우 15㎲의 반응시간을 얻었고 이 값으로는 4bit/color의 계조(gray scale)표현이 가능하였다.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1124-1125
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• 2015

밴드-갭이 큰 반도체는 실리콘에 비하여 다양한 전기 물성 장점을 가져 고주파수 증폭 소자나 차세대 전력 반도체 소자로 각광을 받고 있다. 다양한 와이드 밴드-갭 반도체 중 AlGaN/GaN 이종접합 반도체는 채널의 높은 전도성과 높은 임계 전계로 인하여 우수한 전기적 특성을 가진다. 최근 발전된 수치해석 시뮬레이션을 이용하여 AlGaN/GaN 고전자 이동도 트랜지스터 (high-electron-mobility transistor, HEMT)의 설계연구를 진행하였다. AlGaN 장벽층의 두께가 증가할수록 채널의 전자 면 농도가 증가하도록 설계하였다. 또한 게이트 필드 플레이트 설계를 통하여 AlGaN/GaN HEMT의 역방향 전계 피크를 1개에서 2개로 증가시켜 항복전압을 368 V에서 최대 822 V로 개선하였다. 수렴문제를 개선한 수치해석 시뮬레이션은 RF power AlGaN/GaN HEMT의 설계에 유용하다.