• 제목/요약/키워드: $p^+$-emitter

검색결과 140건 처리시간 0.025초

실리콘 이종접합 태양전지에서 계면 결함 밀도의 영향 (Influence of the interface defect density on silicon heterojunction solar cells)

  • 김찬석;이승훈;탁성주;최수영;부현필;이정철;김동환
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.103.1-103.1
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    • 2011
  • 실리콘 이종접합 태양전지에서 계면 결함 밀도는 효율을 결정하는데 가장 중요한 요인으로 작용한다. 계면 결함은 캐리어의 재결합 위치로 작용하여, 계면 결함 밀도가 증가하면 재결합 속도가 증가하게 된다. 흡수층으로 사용되는 실리콘 웨이퍼 (결정질 실리콘)를 가능한 깨끗하게 세정함으로써, 또한 emitter로 쓰이는 비정질 실리콘을 낮은 데미지로 증착하여 계면 결함 밀도를 감소 시킬 수 있다. 이러한 계면 결함 밀도의 감소가 어떠한 변화로 인해 태양전지 특성에 영향을 주는지 시물레이션을 통해 알아보았다. n-type 웨이퍼에 p-type 비정질 실리콘을 emitter로 하여 TCO/p/i/n-type wafer/i/n/TCO/metal의 구조를 적용했고, wafer 전면과 i로 쓰인 무첨가된 비정질 실리콘 간의 계면 결함 밀도를 변수로 적용했다. 그 결과, 계면 결함 밀도가 감소함에 따라 재결합이 감소하여 태양전지 특성이 증가하는 측면도 있지만, 흡수층의 장벽 (barrier height)이 높아져 재결합을 더욱 감소시킴으로 인해 태양전지 특성이 증가함을 알 수 있었다.

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병렬식 광 인터컨넥트용 멀티채널 수신기 어레이 (Multichannel Photoreceiver Arrays for Parallel Optical Interconnects)

  • 박성민
    • 대한전자공학회논문지SD
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    • 제42권7호
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    • pp.1-4
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    • 2005
  • 본 논문에서는 병렬식 광 인터컨넥트 응용을 위한 멀티채널 광수신기 어레이를 구현한다. 0.8$\mu$m Si/SiGe HBT 공정을 이용하여 설계한 수신기 어레이는 4채널의 전치증폭기 (transimpedance amplifier 혹은 TIA)와 PIN 광다이오드를 포함하는데, TIA는 일반적인 에미터 접지 (common-emitter 혹은 CE) 입력단을 취한다. 측정결과로서, CE TIA 어레이는 3.9GHz 주파수 대역폭과 62dB$\Omega$ 트랜스 임피던스 이득, 7.SpA/sqrt(Hz) 평균 노이즈 전류 스펙트럼 밀도 및 -2SdB 채널 간 crosstalk 성능을 가지며, 4채널 전체 모듈이 40mW 전력소모를 보인다.

Comparison of light-induced degradation and regeneration in P-type monocrystalline full aluminum back surface field and passivated emitter rear cells

  • Cho, Eunhwan;Rohatgi, Ajeet;Ok, Young-Woo
    • Current Applied Physics
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    • 제18권12호
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    • pp.1600-1604
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    • 2018
  • This paper reports on a systematic and quantitative assessment of light induced degradation (LID) and regeneration in full Al-BSF and passivated emitter rear contact cells (PERC) along with the fundamental understanding of the difference between the two. After LID, PERC cells showed a much greater loss in cell efficiency than full Al-BSF cells (~0.9% vs ~0.6%) because the degradation in bulk lifetime also erodes the benefit of superior BSRV in PERC cells. Three main regeneration conditions involving the combination of heat and light ($75^{\circ}C/1\;Sun/48h$, $130^{\circ}C/2\;Suns/1.5h$ and $200^{\circ}C/3\;Suns/30s$) were implemented to eliminate LID loss due to BO defects. Low temperature/long time ($75^{\circ}C/48h$) and high temperature/short time ($200^{\circ}C/30s$) regeneration process was unable to reach 100% stabilization. The intermediate temperature/time ($130^{\circ}C/1.5h$) generation achieved nearly full recovery and stabilization (over 99%) for both full Al-BSF and PERC cells. We discussed the effect of temperature, time and suns in regeneration mechanism for two cells.

이종접합 태양전지용 p a-Si:H 에미터 층 최적화 및 태양전지 특성 거동 연구

  • 김경민;정대영;송준용;박주형;오병성;송진수;이정철
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.129.2-129.2
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    • 2011
  • 본 연구에서는 a-Si:H/c-si 구조의 이종접합 태양전지의 p a-Si:H 에미터 층의 박막 조건에 따라 태양전지 특성을 연구하였다. p, n-layer는 PECVD (Plasma-enhanced chemical vapor deposition) i-layer는 HWCVD(Hot wire chemical vapor deposition), ITO는 RF 마그네트론 스퍼터링법으로 제작하였다. p-layer의 도핑 농도, 기판 증착 온도, 증착 높낮이에 따라 특성을 비교 분석 하였다. QSSPC로 minority carrier life time, 자외 가시선 분광분석 장치로 투과 반사도를, Ellipsometer로 흡수 계수, 두께, FTIR로 막의 구성요소 등의 변화를 조사하여 개선된 p a-Si:H의 특성이 이종접합 태양전지에서 효율향상에 영향을 주는지 Photo IV와 EQE를 통하여 조사하였다.

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Impact of Passivation and Reliability for Base-exposed InGaP/GaAs HBTs

  • Park, Jae-Woo
    • Transactions on Electrical and Electronic Materials
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    • 제8권3호
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    • pp.115-120
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    • 2007
  • Reliability between passivated and unpassivated process with the base-exposed InGaP/GaAs HBTs was studied. A passivation of HBT was attempted by $SiO_2$ thin film deposition at $300^{\circ}C$ by means of PECVD. Base-exposed InGaP/GaAs HBTs before and after passivation were investigated and compared in terms of DC and RF performance. Over a total period of 30 days, passivated HBTs show only 2% degradation of DC current gain for the high current density of $40KA/cm^2$. The measured thermal resistance of $2{\times}30{\mu}m^2$ single emitter InGaP/GaAs HBT passivated with PECVD $SiO_2$ devices can be extracted and was founded to be 1430 K/W. The estimated MTTF was $2{\times}10^7hr\;at\;T_j=125^{\circ}C$ with an activation energy $(E_a)$ of 1.37 eV.

장파장 응용을 위한 InP/InGaAs HBT의 광특성 (Characteristic of InP/InGaAs HBT for Long Wavelength Application)

  • 김강대;허영헌;박재홍;김용규;문태정;황성범;송정근
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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    • pp.1073-1076
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    • 2003
  • This paper shows the performance as a photodetector of InP/InGaAs HPT operated with a base bias and forntside optical injection through the emitter. InP/InGaAs HPT produced the high optical gain of about 16.2 where HPT is biased at Vc=1V, I$_{B}$=20$\mu$A with an input optical power of 2.4$\mu$W. And we examined that the optical gain of HPTs becomes larger when operating in 3-terminal configuration rather than 2-terminal with the floating base. The optical performance of InP/InGaAs HPT is an attractive to the PIN Photodetector for use in long wavelength optical receivers.s.

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X-band용 MMIC 오실레이터 설계연구 (Studies on MMIC oscillator using HBT for X-band)

  • 채연식;안단;이진구
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1998년도 하계종합학술대회논문집
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    • pp.387-390
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    • 1998
  • In this paper, HBT's with lower phase noise and passive elements, such as resistors, capacitors and inductors, for resonance and impedance matching networks are designed, fabricated, tested, and carefully analysed, respectively, and then, they are integrated for the design and fabrication of functional X-band oscillators with lower phase noise. Epi-wafers for HBT's with the structure of graded $Al_{x}$G $a_{1-x}$ As emitter and C-doped base layer of 700.angs. thick were used to specially emphasize the improvement of $f_{T}$ and $f_{max}$, and the lowering of phase noise, in design aspects. At the test frequencies of 12GHz, capacitances of MIM capacitors, spiral inductor, and resistances are 0.5~10pF, 0.4~11.06nH, and 20~1,380.ohm., respectively. The emitter size of HBY's for the X-band MMIC oscillators is 3*10u $m^{2}$, and find chip size is 0.9*0.9m $m^{2}$..EX>.

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Si 태양전지(太陽電池)의 표면재결합(表面再結合) 전류(電流)가 포화전류(飽和電流)에 미치는 영향(影響) (The Effect of Surface Recombination Current on the Saturation Current in Si Solar Cell)

  • 신기식;이기선;최병호
    • 태양에너지
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    • 제8권2호
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    • pp.12-18
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    • 1988
  • The effect of surface recombination current density on the saturation current density in Si solar cell has been studied. Theoretical model for surface recombination current was set up from emitter transparent model of M.A. Shibib, and saturation current of Si solar cell made by ion implantation method was also measured by digital electrometer. The theoretical surface recombination current density which is the same as saturation surface recombination current density in Shibib model was $10^{-11}[A/cm^2]$ and the measured value was ranged from $8{\times}10^{-10}$ to $2{\times}10^{-9}[A/cm^2]$. Comparing with the ideal p-n junction of Shockley, transparent emitter model shows improved result by $10^2$ order of saturation current density. But there still exists $10^2$ order of difference of saturation current density between theoretical and actual values, which are assumed to be caused by 1) leakage current through solar cell edge, 2) recombination of carriers in the depletion layer, 3) the series resistance effect and 4) the tunneling of carriers between states in the band gap.

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EWT 태양전지 제작을 위한 레이저 미세 관통홀 가공 기술 (Laser via drilling technology for the EWT solar cell)

  • 이홍구;서세영;현덕환;이용화;김강일;정우원;이아름;조재억
    • 한국태양에너지학회 논문집
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    • 제31권4호
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    • pp.103-111
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    • 2011
  • Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.

E-Beam evaporation을 이용한 전극 형성 공정이 결정질 실리콘 태양전지에 미치는 영향 분석 (Effect of Electrode Formation Process using E-beam Evaporation on Crystalline Silicon Solar Cell)

  • 최동진;박세진;신승현;이창현;배수현;강윤묵;이해석;김동환
    • Current Photovoltaic Research
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    • 제7권1호
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    • pp.15-20
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    • 2019
  • Most high-efficiency n-type silicon solar cells are based on the high quality surface passivation and ohmic contact between the emitter and the metal. Currently, various metalization methods such as screen printing using metal paste and physical vapor deposition are being used in forming electrodes of n-type silicon solar cell. In this paper, we analyzed the degradation factors induced by the front electrode formation process using e-beam evaporation of double passivation structure of p-type emitter and $Al_2O_3/SiN_x$ for high efficiency solar cell using n-type bulk silicon. In order to confirm the cause of the degradation, the passivation characteristics of each electrode region were determined through a quasi-steady-state photo-conductance (QSSPC).