• Title/Summary/Keyword: $SiO_2/TiO_2$

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Analysis for Buffer Leakage Current of High-Voltage GaN Schottky Barrier Diode (고전압 GaN 쇼트키 장벽 다이오드의 완충층 누설전류 분석)

  • Hwang, Dae-Won;Ha, Min-Woo;Roh, Cheong-Hyun;Park, Jung-Ho;Hahn, Cheol-Koo
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.2
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    • pp.14-19
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    • 2011
  • We have fabricated GaN Schottky barrier diode (SBD) for high-voltage applications on Si substrate. The leakage current and the electrical characteristics of GaN SBD are investigated by annealing metal-semiconductor junctions. Ohmic junctions of Ti/Al/Mo/Au and Schottky junctions of Ni/Au are used in the fabrication. A test structure is proposed to measured buffer leakage current through a mesa structure. When annealing temperature is increased from $700^{\circ}C$ to $800^{\circ}C$, measured buffer leakage current is also increased from 87 nA to 780 nA at the width of 100 ${\mu}m$. The diffusion of Au, Ti, Mo, O into GaN buffer layer increases the leakage current and that is verified by Auger electron spectroscopy. Experimental results show that the low leakage current and the high breakdown voltage of GaN SBD are achieved by annealing metal-semiconductor junctions.

Characteristics Analysis of Total Internal Reflection-based Dielectric Multi-layer Sensor Using Plasmonics Phenomena (플라즈모닉스 현상을 이용한 전반사 기반 다층 유전체 박막 센서의 특성 분석)

  • Kim, Hong-Seung;Lee, Tae-Kyeong;Kim, Doo-Gun;Jung, You-Ra;Oh, Geum-Yoon;Lee, Byeong-Hyeon;Ki, Hyun-Chul;Choi, Young-Wan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.7
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    • pp.516-520
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    • 2012
  • In this paper, we have theoretically analyzed and designed a dielectric multi-layer sensor with a SPR (surface plasmon resonance) using analytical calculation and FDTD (finite difference time-domain) methods. The proposed structure is composed of periodic layer and thin metal film. It has many advantages. One of that is a high sensitivity of the SPR. Another is a high Q-factor of the characteristics in the PhC (photonic crystals) micro-cavity structure. The incident light has double resonance characteristics, because the filtered light by PhC structure, dielectric multi-layer, is met the thin metal film for SPR effect. We have also observed the change of resonance characteristics according to the variation of effective index on the metal film.

Advanced Water Treatment of High Turbidity Source by Hybrid Process of Ceramic Ultrafiltration and Photocatalyst: 1. Effects of Photocatalyst and Water-back-flushing Condition (세라믹 한외여과 및 광촉매 혼성공정에 의한 고탁도 원수의 고도정수처리: 1. 광촉매 및 물역세척 조건의 영향)

  • Cong, Gao-Si;Park, Jin-Yong
    • Membrane Journal
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    • v.21 no.2
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    • pp.127-140
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    • 2011
  • The effects of $TiO_2$ photocatalyst coating bead concentration, water-back-flushing period (FT), and back-flushing time (BT) were investigated in hybrid process of ceramic ultrafiltration and photocatalyst for advanced drinking water treatment in this study. Photocatalyst coating bead concentration was changed in the range of 10~40 g/L, FT in 2~10 min and BT in 6~30 sec. Then, we observed the effects on resistance of membrane fouling $(R_f)$, permeate flux (J) and total permeate volume $(V_{\Upsilon})$ during total filtration time of 180 min. As decreasing photocatalyst coating bead concentration, $R_f$ increased and J decreased. $V_{\Upsilon}$ was the highest value of 8.85 L at 40 g/L of photocatalyst coating bead concentration. At FT change experiment, $R_f$ decreased and J increased as decreasing FT. Then $R_f$ decreased and J increased according to increasing BT at BT change experiment. Because at NBF (no back-flushing) dramatic membrane fouling reduced membrane pore size, turbid and dissolved organic matters ($UV_{254}$ absorbance) could be removed efficiently. Therefore, treatment efficiencies of turbidity and dissolved organic matters were the highest at NBF. Then by cleaning effect of photocatalyst coating bead, the treatment efficiencies of turbidity and dissolved organic matters increased as decreasing FT and increasing BT.

Effect of Post-Annealing on the Microstructure and Electrical Properties of PMN-PZT Films Prepared by Aerosol Deposition Process (후열처리 공정이 에어로졸 증착법에 의해 제조된 PMN-PZT 막의 미세구조와 전기적 특성에 미치는 영향)

  • Hahn, Byung-Dong;Ko, Kwang-Ho;Park, Dong-Soo;Choi, Jong-Jin;Yoon, Woon-Ha;Park, Chan;Kim, Doh-Yeon
    • Journal of the Korean Ceramic Society
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    • v.43 no.2 s.285
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    • pp.106-113
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    • 2006
  • PMN-PZT films with thickness of $5\;{\mu}m$ were deposited on $Pt/Ti/SiO_2/Si$ substrate at room temperature using aerosol deposition process. The films showed fairly dense microstructure without any crack. XRD and TEM analysis revealed that the films consisted of randomly oriented nanocrystalline and amorphous phases. Post-annealing process was employed to induce crystallization and grain growth of the as-deposited films and to improve the electrical properties. The annealed film showed markedly improved electrical properties in comparison with as-deposited film. The film after annealing at $700^{\circ}C$ for 1h exhibited the best electrical properties. Dielectric constant $(\varepsilon_r)$, remanent polarization $(P_r)$ and piezoelectric constant $(d_{33})$ were 1050, $13\;{\mu}C/cm^2$ and 120 pC/N, respectively.

Microstructures and Electrical Properties of Thick PZT Films with Thickness Variation Fabricated by Multi-coating Method (Multi-coating법으로 제조된 두꺼운 PZT막의 두께 변화에 따른 미세구조 및 전기적 특성)

  • Park, Jun-Sik;Jang, Yeon-Tae;Park, Hyo-Deok;Choe, Seung-Cheol;Gang, Seong-Gun
    • Korean Journal of Materials Research
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    • v.12 no.3
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    • pp.211-214
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    • 2002
  • Properties of 52/48 PZT films with various thicknesses for piezoelectric micro-electro mechanical systems (MEMS) devices fabricated by multi-coating method on $Pt(3500{\AA})/Ti(400{\AA})/SiO_2(3000{\AA})/Si$(525$\mu\textrm{m}$) substrates were investigated. PZT films were deposited by spin-coating process at 3500 rpm for 30 sec, followed by pyrolysis at 45$0^{\circ}C$ for 10 min producing the thickness of about 120nm. These processes were repeated 4, 8, 12, 16 and 20 times in order to have various thicknesses, respectively. Finally, they were crystallized at $650^{\circ}C$ for 30 min. All thick PZT films showed dense and homogeneous surface microstructures. Thick PZT films showed crystalline structures of random orientations with increasing thickness. Dielectric constants of thick PZT films were increased with increasing film thickness and reached 800 at 100kHz for 2.3$\mu\textrm{m}$ thick PZT film. $P_r\; and\; E_c$ of 2.3$\mu\textrm{m}$ thick PZT films were about 20$\mu$C/$\textrm{cm}^2$ and 63kV/cm. Depth profile analysis by Auger Electron Spectroscopy (AES) of 4800 $\AA$ thick PZT film showed the formation of the perovskite phase on Pt layer by Pb diffusion behavior. It was considered that Pb-Pt intermediate layer promoted PZT (111) columnar structures.

Chemical Compositional Distribution of Ethylene-1-Butene Copolymer Prepared with Heterogeneous Ziegler-Natta Catalyst: TREF and Crystaf Analysis

  • Ko, Young-Soo;Jeon, Jong-Ki;Yim, Jin-Heong;Park, Young-Kwon
    • Macromolecular Research
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    • v.17 no.5
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    • pp.296-300
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    • 2009
  • Ethylene-1-butene copolymers were prepared with $SiO_2$-supported $TiCl_4$ catalyst by changing of 1-butene/ethylene molar ratio in feed, and the resulting copolymers were analyzed using temperature rising elution fractionation (TREF) and crystallization fractionation (Crystaf) methods to investigated the influence of $C_4/C_2$ molar ratio in feed on chemical compositional distribution and other parameters such as molecular weight and its distribution. TREF analysis showed that the copolymers had a broad and bimodal chemical compositional distribution (CCD) regardless of the content of 1-butene in the copolymer. The chemical composition was in the range of 5 to 55 branches per 1,000 carbons for all copolymers prepared in the study. Furthermore, the broader CCD was revealed for the copolymers having the higher content of 1-butene. Crystaf analysis did not showed a bimodal CCD for the copolymers having the 1-butene content of less than 5.1 wt%. The lower crytalline part having 1-butene content in Crystaf analysis was less than of TREF analysis.

Friction and Wear Characteristics of Bonded Film Lubricants of Organically Modified Hybrid Ceramic Binder Materials (유기변성 하이브리드 세라믹 물질을 결합제로 이용한 고체피막윤활제의 마찰마모 특성)

  • 한흥구;공호성;윤의성
    • Tribology and Lubricants
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    • v.19 no.4
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    • pp.203-210
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    • 2003
  • In order to enhance the thermal stability of binder materials of bonded type solid lubricants, several metal-alkoxide based sol-gel materials such as methyltrimethoxysilane(MTMOS), titaniumisopropoxide (Ti(Opr$\^$i/)$_4$), zirconiumisopropoxide (Zr(Opr$\^$i/)$_4$) and aluminumbutoxide (Al(Obu$\^$t/)$_4$) were modified chemically by both epoxy and acrylic silane compounds. Friction and wear characteristics of the bonded solid lubricants, whose binders were of several hybrid ceramic materials, were tested with a reciprocating tribo-tester. Wear life was evaluated with respect to the heat-curing temperature, friction temperature, type of supplement lubricants, and ratio of binder materials. Test results showed that the Si-Zr hybrid ceramic materials modified by epoxy-silane compounds had a higher wear life compared to others. Sb$_2$O$_3$ was the most effective supplement lubricants in the high temperature, and BUS analyses revealed that it was caused mainly by a strong anti-oxidation effect to MoS$_2$ particles. The higher heat-curing temperature resulted in the higher wear life, and the higher friction temperature resulted in the lower wear life.

Demonstration of Nonpolar Light Emitting Diodes on a-plane GaN Templates

  • Seo, Yong-Gon;Baek, Gwang-Hyeon;Yun, Hyeong-Do;O, Gyeong-Hwan;Hwang, Seong-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.148-148
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    • 2011
  • 일반적으로 LED 제작에 사용되는 c-plane GaN는 c축 방향으로 발생하는 분극의 영향을 받게 된다. 분극은 LED내 양자우물의 밴드를 기울게 하여 그 결과 전자와 홀의 재결합 확률을 감소시켜 낮은 내부양자효율을 가지게 된다. 이러한 문제를 해결하기 위한 여러 가지 방법들이 제시되었는데 그 중에서도 특히 a-plane 혹은 m-plane면과 같은 무분극 면을 사용하는 GaN LED가 주목받고 있다. 그 이유는 무분극 면은 분극이 발생하는 c축과 수직이기 때문에 분극의 영향을 받지 않아 높은 내부 양자효율을 가질수 있다. 본 연구에서는 MOCVD 장비를 사용하여 2인치 r-plane 사파이어 기판위에 3um두께의 a-plane GaN을 성장하였다. 그위에 2um정도로 Si을 도핑하여 n-type GaN 형성한후 단일 양자우물, 그리고 Mg을 도핑하여 p-type GaN을 성장하였다. 장파장대역의 a-plane LED의 특성을 알아보기 위해서 양자우물 형성시 In의 조성비를 높였다. 일반적인 포토리소그래피 공정과 Dry etching 공정을 사용하여 메사구조를 형성하였으며 Ti/Al/Pt/Au와 Ni/Au를 각각 n-type과 p-type의 전극 물질로 사용하였다. 제작된 LED의 특성을 파악하기 위해서 인가전류를 0부터 100mA까지 출력 스펙트럼을 측정하였으며 orange대역의 파장을 갖는 LED를 얻었다. 인가전류별 Peak 파장의 변화와 반측폭의 변화를 파악하여 장파장 대역의 a-plane LED의 특성을 확인하였다.

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A Study on the Precipitation Mechanism of Quartz Veins from Sangdong Deposit by Analyses of Vein Texture and Trace Element in Quartz (상동광산 석영맥의 조직 및 석영의 미량원소 분석을 통한 광맥 침전 기작 도출)

  • Youseong Lee;Changyun Park;Yeongkyoo Kim
    • Economic and Environmental Geology
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    • v.56 no.3
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    • pp.239-257
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    • 2023
  • Sangdong deposit, a W-Mo skarn deposit, is located in Taebaeksan mineralized district, hosting vertically developed scheelite-quartz veins that formed at the late ore-forming stage. In this study, we tried to examine the geochemical signatures of ore-forming fluids and vein-forming mechanisms by analyzing the micro-texture of quartz veins and trace element concentrations of quartz. As a result of texture analyses, quartz veins in the hanging wall orebody and the foot wall orebody commonly exhibit the blocky and the elongate blocky texture, respectively, whereas quartz veins in the main orebody show both textures. These textural differences indicate that quartz veins from the hanging wall orebody were precipitated by the primary hydrofracturing due to H2O saturation in the igneous body with relatively high temperature and pressure at a vein-skarn stage, and after that, repeated hydrofracturing caused the formation of quartz veins from the main orebody and foot wall orebody. The results of trace element concentrations show that Li++Al3+↔Si4+ is a main substitution mechanism. However, those of the foot wall orebody were clearly divided into a Li+-dominated substitution and a Na+-, K+-dominated substitution. Considering that quartz veins from the foot wall orebody commonly show the elongate blocky texture, such a distinction means that it is a result of repeated injections of fluid with the different composition. Ti concentrations of quartz from the hanging wall, main, and the foot wall orebody are 28.6, 8.2, and 15.7 ppm in average, respectively. Given a proportional relationship between the precipitation temperature and Ti concentrations, it seems that quartz veins from the hanging wall orebody were precipitated at the highest temperature. Al concentrations of the hanging wall, main, and the foot wall orebody having an inverse relationship with fluid pH are 162.3, 114.2, and 182.5 ppm in average, respectively. These results show that Al concentrations in vein-forming fluids were not changed dramatically. Moreover, these concentrations are extremely low in comparison with the other hydrothermal deposits. This indicates that quartz in overall ore veins at Sangdong deposit was precipitated from the constant condition with slightly acidic to near neutral pH.

HIPIMS Arc-Free Reactive Deposition of Non-conductive Films Using the Applied Material ENDURA 200 mm Cluster Tool

  • Chistyakov, Roman
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.96-97
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    • 2012
  • In nitride and oxide film deposition, sputtered metals react with nitrogen or oxygen gas in a vacuum chamber to form metal nitride or oxide films on a substrate. The physical properties of sputtered films (metals, oxides, and nitrides) are strongly influenced by magnetron plasma density during the deposition process. Typical target power densities on the magnetron during the deposition process are ~ (5-30) W/cm2, which gives a relatively low plasma density. The main challenge in reactive sputtering is the ability to generate a stable, arc free discharge at high plasma densities. Arcs occur due to formation of an insulating layer on the target surface caused by the re-deposition effect. One current method of generating an arc free discharge is to use the commercially available Pinnacle Plus+ Pulsed DC plasma generator manufactured by Advanced Energy Inc. This plasma generator uses a positive voltage pulse between negative pulses to attract electrons and discharge the target surface, thus preventing arc formation. However, this method can only generate low density plasma and therefore cannot allow full control of film properties. Also, after long runs ~ (1-3) hours, depends on duty cycle the stability of the reactive process is reduced due to increased probability of arc formation. Between 1995 and 1999, a new way of magnetron sputtering called HIPIMS (highly ionized pulse impulse magnetron sputtering) was developed. The main idea of this approach is to apply short ${\sim}(50-100){\mu}s$ high power pulses with a target power densities during the pulse between ~ (1-3) kW/cm2. These high power pulses generate high-density magnetron plasma that can significantly improve and control film properties. From the beginning, HIPIMS method has been applied to reactive sputtering processes for deposition of conductive and nonconductive films. However, commercially available HIPIMS plasma generators have not been able to create a stable, arc-free discharge in most reactive magnetron sputtering processes. HIPIMS plasma generators have been successfully used in reactive sputtering of nitrides for hard coating applications and for Al2O3 films. But until now there has been no HIPIMS data presented on reactive sputtering in cluster tools for semiconductors and MEMs applications. In this presentation, a new method of generating an arc free discharge for reactive HIPIMS using the new Cyprium plasma generator from Zpulser LLC will be introduced. Data (or evidence) will be presented showing that arc formation in reactive HIPIMS can be controlled without applying a positive voltage pulse between high power pulses. Arc-free reactive HIPIMS processes for sputtering AlN, TiO2, TiN and Si3N4 on the Applied Materials ENDURA 200 mm cluster tool will be presented. A direct comparison of the properties of films sputtered with the Advanced Energy Pinnacle Plus + plasma generator and the Zpulser Cyprium plasma generator will be presented.

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