• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.78-78
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• 2013

Recently, many platinoid metals like platinum and ruthenium have been used as an electrode of microelectronic devices because of their low resistivity and high work-function. However the material cost of Ru is very expensive and it usually takes long initial nucleation time on SiO2 during chemical deposition. Therefore many researchers have focused on how to enhance the initial growth rate on SiO2 surface. There are two methods to deposit Ru film with atomic layer deposition (ALD); the one is thermal ALD using dilute oxygen gas as a reactant, and the other is plasma enhanced ALD (PEALD) using NH3 plasma as a reactant. Generally, the film roughness of Ru film deposited by PEALD is smoother than that deposited by thermal ALD. However, the plasma is not favorable in the application of high aspect ratio structure. In this study, we used a bis(ethylcyclopentadienyl)ruthenium [Ru(EtCp)2] as a metal organic precursor for both thermal and plasma enhanced ALDs. In order to reduce initial nucleation time, we use several methods such as Ar plasma pre-treatment for PEALD and usage of sacrificial RuO2 under layer for thermal ALD. In case of PEALD, some of surface hydroxyls were removed from SiO2 substrate during the Ar plasma treatment. And relatively high surface nitrogen concentration after first NH3 plasma exposure step in ALD process was observed with in-situ Auger electron spectroscopy (AES). This means that surface amine filled the hydroxyl removed sites by the NH3 plasma. Surface amine played a role as a reduction site but not a nucleation site. Therefore, the precursor reduction was enhanced but the adhesion property was degraded. In case of thermal ALD, a Ru film was deposited from Ru precursors on the surface of RuO2 and the RuO2 film was reduced from RuO2/SiO2 interface to Ru during the deposition. The reduction process was controlled by oxygen partial pressure in ambient. Under high oxygen partial pressure, RuO2 was deposited on RuO2/SiO2, and under medium oxygen partial pressure, RuO2 was partially reduced and oxygen concentration in RuO2 film was decreased. Under low oxygen partial pressure, finally RuO2 was disappeared and about 3% of oxygen was remained. Usually rough surface was observed with longer initial nucleation time. However, the Ru deposited with reduction of RuO2 exhibits smooth surface and was deposited quickly because the sacrificial RuO2 has no initial nucleation time on SiO2 and played a role as a buffer layer between Ru and SiO2.

• 한국산학기술학회논문지
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• 제16권6호
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• pp.4121-4124
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• 2015

에너지 절감 유리창에서는 근적외선 차단 기능이 요구되고 있다. 본 연구에서는 근적외선 반사를 위한 광학 박막의 설계, 제작 및 광학적 특성이 연구 되었다. 광학 박막은 저굴절률막과 고굴절률막의 적층 박막 구조로 설계하였다. 설계구조에 따라 RF 스퍼터링 방법을 이용한 $SiO_2$와 $TiO_2$ 박막의 증착 실험이 수행되었고 파워에 따른 증착 조건 파라미터에 따라서 제작된 스퍼터링 박막의 특성이 분광타원기, 원자현미경, 분광기로 분석되었다. 적층박막 구조의 설계는 $SiO_2$와 $TiO_2$의 고굴절률 박막/저굴절률 박막/고굴절률 박막의 적층 구조로서 근적외선 차단 다층막이 설계되었고 시뮬레이션 되었다. 시뮬레이션 결과 파장대역 930nm에서 1682nm의 범위에서 반사율30%이상이 관찰되었다. 시뮬레이션 결과를 토대로 제작된 삼층 구조의 박막은 파장 대역이 930nm에서 1525nm범위 대역에서 반값 전폭의 반사율 33%이상을 구현할 수 있었다.

• 한국재료학회지
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• 제9권5호
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• pp.478-483
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• 1999

The effects of the composition on the consolidation temperature and refractive index of the glass thin film fabricated by aerosol flame deposition method in SiO$_2$-B$_2$O$_3$-CaO-P$_2$O\ulcorner system were investigated. When the amount of CaO was constant in SiO$_2$-B$_2$O$_3$-CaO system the consolidation temperature of glass thin film decreased with increasing the amount of B$_2$O$_3$. Also, when the amount of SiO$_2$ and B$_2$O$_3$ was constant the consolidation temperature of glass thin film increased with increasing the amount of CaO. P$_2$O\ulcorner was added to 72.5SiO$_2$-25B$_2$O$_3$-2.5CaO in order to decrease its consolidation temperature. As the amount of P$_2$O\ulcorner increased its consolidation temperature decreased and the refractive index linearly increased from 1.4649 to 1.4684. When the amount of CaO and P$_2$O\ulcorner was constant in SiO$_2$-B$_2$O$_3$-CaO-P$_2$O\ulcorner system the consolidation temperature of glass thin film decreased with increasing the ratio of SiO$_2$/B$_2$O$_3$.

• 전자공학회논문지A
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• 제33A권12호
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• pp.59-64
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• 1996

InSb MIS devices prepared by remote PECVD SiO$_{2}$ were fabricated. The SiO$_{2}$ films on InSb were deposited at atemperature range of 67~190$^{\circ}$C. The effects of deposition temperature on the structural characteristics of the SiO$_{2}$ films evaluated Auger electron spectroscopy showed that atomic raito of silicon to oxygen was 0.5 and composition toms were distributed uniformaly throuout the oxide film. The transition region is about 100$\AA$ for SiO$_{2}$/InSb interface. The leakage current density at 1MV/cm and the breakdownelectric field of the MiS device using SiO$_{2}$ film deposited at 105$^{\circ}$C were about 22 nA/cm$^{2}$ and 3.5MV/cm, respectively. The interface-state density at mid-bandgap extracted from 1 MHz high frequency C-V measurement was about 2X10$^{11}$ cm$^{-2}$eV$^{-1}$.

• 한국진공학회지
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• 제12권4호
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• pp.214-217
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• 2003

본 연구에서는 박막 증착시 발생되는 $\gamma$-전자와 같은 고에너지 입자들의 막 충돌에 의한 손상이 적은 대향타겟식 스퍼터링 장치를 이용하여 $SiO_2$/Si 기판강에 ZnO 박막을 제작하였으며, 막의 결정성에 악 영향을 미치는 초기 성장층을 제어 할 수 있는 ZnO buffer-layer를 도입하여 박막의 결정학적 특성을 알아보았다. 제작된 박막의 결정성 및 c-축 우선배향성은 XRD를 사용하여 측정하였다. 측정 결과 ZnO buffer layer의 두께 10, 20 nm와 가스압력 1 mTorr일 때 ZnO 박막의 결정성이 가장 우수함을 알 수 있었다.

• 한국재료학회지
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• 제19권1호
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• pp.37-43
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• 2009

Silicon dioxide as gate dielectrics was grown at $400^{\circ}C$ on a polycrystalline Si substrate by inductively coupled plasma oxidation using a mixture of $O_2$ and $N_2O$ to improve the performance of polycrystalline Si thin film transistors. In conventional high-temperature $N_2O$ annealing, nitrogen can be supplied to the $Si/SiO_2$ interface because a NO molecule can diffuse through the oxide. However, it was found that nitrogen cannot be supplied to the Si/$SiO_2$ interface by plasma oxidation as the $N_2O$ molecule is broken in the plasma and because a dense Si-N bond is formed at the $SiO_2$ surface, preventing further diffusion of nitrogen into the oxide. Nitrogen was added to the $Si/SiO_2$ interface by the plasma oxidation of mixtures of $O_2/N_2O$ gas, leading to an enhancement of the field effect mobility of polycrystalline Si TFTs due to the reduction in the number of trap densities at the interface and at the Si grain boundaries due to nitrogen passivation.

• 한국전기전자재료학회논문지
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• 제22권12호
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• pp.1028-1032
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• 2009

In this study, the influences of silicon-based gas barrier films fabricated by using a facing target sputtering(FTS) system on the gas permeability for flexible displays have been investigated. Under these optimum conditions on the $SiO_x$ film with oxygen concentration($O_2/Ar+O_2$) of 3.3% and the $SiO_xN_y$ film with nitrogen concentration($N_2/Ar+O_2+N_2$) of 30% deposited by the FTS system, it was found that the films were grown about 4 times higher deposition rate than that of the conventional sputtering system and showed high transmittance about 85% in the visible light range. Particularly, the polyethylene naphthalate(PEN) substrates with the $SiO_x$ and/or $SiO_xN_y$ films showed the enhanced properties of decreased water vapor transmission rate (WVTR) over $10^{-1}\;g/m^2{\cdot}day$ compared with the PEN substrate without any gas barrier films, which was due to high packing density in the Si-based films with high plasma density by FTS process and/or the denser chemical structure of Si-N bond in the $SiO_xN_y$ film.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2002년도 추계총회 및 연구발표회 초록집
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• pp.183.2-183
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• 2002

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(I)
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• pp.549-552
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• 1987

TO INCREASE THE CELL CAPACITANCE Of SMALL GEOMETRY DRAMS. HIGH DIELECTRIC MATERIAL HAS BEEN USED RECENTLY. THE PURPOSE Of THIS WORK IS TO INVESTIGATE THE STRUCTURAL AND ELECTRICAL CHARACTERISTICS Of SiO2/Si3N4/SiO2 STACKED FILM UTILIZING HIGH DIELECTRIC MATERIAL Si3N4(${\epsilon}=7.5$). IN RESULT, THE DIELECTRIC CONSTANT Of STACKED FILM IS 4.0 - 5.0 AND CAPACITANCE AND BREAKDOWN FIELD WERE MORE INCREASED THAN THOSE Of SiO2 FILM.

• 전자공학회논문지A
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• 제33A권10호
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• pp.98-106
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• 1996

A thin film of aluminum for ultra large scale integrated circuits metalization has been deposited on TiN and SiO$_{2}$ substrates by plasma assisted chemical vapor deposition using DMEAA (dimenthylethylamine alane) as a precursor. The effects of plasma on surface topology and growth characteristics were investigated. Thermal CVD Al could not be got continuous films on insulating subsrate such as SiO$_{2}$. However, it was found that Al films could be deposited on SiO$_{2}$ substate without any pretreatments by the hydrogen plasma for pyrolysis of DMEAA. Compared to the thermal CVD, PACVD films showed much better reflectance and resistance on TiN and SiO$_{2}$ substrate. We obtained mirror-like PACVD Al film of 90% reflectance and resistance on TiN and SiO$_{2}$ substrates. We obtained mirror-like PACVD Al film of 90% reflectance on TiN substrate. Excellent conformal step coverage was obtained on submicron contact holes ;by the PACVD blanket deposition.