• 제목/요약/키워드: $SiO_{x}$

검색결과 1,988건 처리시간 0.025초

Atomic layer chemical vapor deposition of Zr $O_2$-based dielectric films: Nanostructure and nanochemistry

  • Dey, S.K.
    • E2M - 전기 전자와 첨단 소재
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    • 제16권9호
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    • pp.64.2-65
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    • 2003
  • A 4 nm layer of ZrOx (targeted x-2) was deposited on an interfacial layer(IL) of native oxide (SiO, t∼1.2 nm) surface on 200 mm Si wafers by a manufacturable atomic layer chemical vapor deposition technique at 30$0^{\circ}C$. Some as-deposited layers were subjected to a post-deposition, rapid thermal annealing at $700^{\circ}C$ for 5 min in flowing oxygen at atmospheric pressure. The experimental x-ray diffraction, x-ray photoelectron spectroscopy, high-resolution transmission electron microscopy, and high-resolution parallel electron energy loss spectroscopy results showed that a multiphase and heterogeneous structure evolved, which we call the Zr-O/IL/Si stack. The as-deposited Zr-O layer was amorphous $ZrO_2$-rich Zr silicate containing about 15% by volume of embedded $ZrO_2$ nanocrystals, which transformed to a glass nanoceramic (with over 90% by volume of predominantly tetragonal-$ZrO_2$(t-$ZrO_2$) and monoclinic-$ZrO_2$(m-$ZrO_2$) nanocrystals) upon annealing. The formation of disordered amorphous regions within some of the nanocrystals, as well as crystalline regions with defects, probably gave rise to lattice strains and deformations. The interfacial layer (IL) was partitioned into an upper Si $o_2$-rich Zr silicate and the lower $SiO_{x}$. The latter was sub-toichiometric and the average oxidation state increased from Si0.86$^{+}$ in $SiO_{0.43}$ (as-deposited) to Si1.32$^{+}$ in $SiO_{0.66}$ (annealed). This high oxygen deficiency in $SiO_{x}$ indicative of the low mobility of oxidizing specie in the Zr-O layer. The stacks were characterized for their dielectric properties in the Pt/{Zr-O/IL}/Si metal oxide-semiconductor capacitor(MOSCAP) configuration. The measured equivalent oxide thickness (EOT) was not consistent with the calculated EOT using a bilayer model of $ZrO_2$ and $SiO_2$, and the capacitance in accumulation (and therefore, EOT and kZr-O) was frequency dispersive, trends well documented in literature. This behavior is qualitatively explained in terms of the multi-layer nanostructure and nanochemistry that evolves.ves.ves.

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저유전율을 갖는 $Mg_2$$SiO_4$-$ZnAl_2$$O_4$계 세라믹스의 $CaTiO_3$첨가에 따른 고주파 유전특성 (Effect of $CaTiO_3$Additions on the Microwave Dielectric Properties of $Mg_2$$SiO_4$-$ZnAl_2$$O_4$Ceramics with Low Dielectric Constant)

  • 박일환;김현학;김경용;김병호
    • 한국전기전자재료학회논문지
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    • 제13권12호
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    • pp.1017-1024
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    • 2000
  • Effect of the microwave dielectric properties and the microstructure on a mole fraction(x=0.1~0.9) of (1-x)Mg$_2$SiO$_4$-xZnAl$_2$O$_4$ ceramics was investigated. When (1-x)Mg$_2$SiO$_4$-xZnAl$_2$O$_4$(x=0.1~0.9) ceramics were sintered at 130$0^{\circ}C$, 135$0^{\circ}C$ and 140$0^{\circ}C$ for 2hr, the microwave dielectric properties were obtained $\varepsilon$r=6.8~8.3, Q.f$_{0}$=36000~77600. On the other hand, the temperature coefficients of resonant frequency($\tau$$_{f}$) were obtained in the properties of -62ppm/$^{\circ}C$ to -49ppm/$^{\circ}C$. In order to adjust the temperature coefficient of resonant frequency($\tau$$_{f}$), CaTiO$_3$was added in (1-x)Mg$_2$SiO$_4$-xZnAl$_2$O$_4$ceramics. 0.7Mg$_2$SiO$_4$-0.2ZnAl$_2$O$_4$-0.1CaTiO$_3$ceramics sintered at 135$0^{\circ}C$ for 2hr showed the excellent microwave dielectric properties of $\varepsilon$r=7.7, Q.f$_{0}$=32000, and $\tau$$_{f}$=-7.9 ppm/$^{\circ}C$.EX>.>.EX>.

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LC Aligning Properties for Homeotropic Alignment of NLC on the SiOx Thin Film as Incident Angle of Electron Beam Evaporation Angle

  • Kim, Jong-Hwan;Kang, Hyung-Ku;Han, Jin-Woo;Kang, Soo-Hee;Kim, Young-Hwan;Hwang, Jeoung-Yeon;Seo, Dae-Shik
    • Transactions on Electrical and Electronic Materials
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    • 제7권1호
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    • pp.21-25
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    • 2006
  • In this study, liquid crystal (LC) aligning properties for homeotropic alignment on the $SiO_x$ thin film by electron beam evaporation method with electron beam system in accordance with the evaporation angles were investigated. Also, the control of pretilt angles homeotropic aligned LC on $SiO_x$ thin film as the function of the evaporation angles were studied. The uniform vertical LC alignment on the $SiO_x$ thin film surfaces with electron beam evaporation was achieved with all of the thin film angle conditions. It is considerated that the LC alignment on the $SiO_x$ thin film by electron beam evaporation is attributed to elastic interaction between LC molecules and micro-grooves at the $SiO_x$ thin film surface created by evaporation. The values of the pretilt angles according to the evaporation angle were from about $0.7^{\circ}$ to about $3.4^{\circ}$. The highest pretilt angles of about $3.4^{\circ}$ in aligned NLC on the $SiO_x$ thin film surfaces by electron beam evaporation were measured under the condition of $45^{\circ}$. Also, good LC alignment states on the treated $SiO_x$ thin film layer by electron beam evaporation were observed at annealing temperature of $250^{\circ}C$. Consequently, the high pretilt angle and the good thermal stability of LC alignment on the $SiO_x$ thin film by electron beam evaporation can be achieved.

$HfO_2$ 박막과 Si 기판사이에 다양한 산화제로 증착한 $Al_{2}O_{3}$ 방지막을 사용한 경우에 대한 고찰

  • 조문주;박홍배;박재후;이석우;황철성;정재학
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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    • pp.42-44
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    • 2003
  • 최근 logic 소자의 gate oxide로 기존의 $SiO_2$, SiON보다 고유전, 작은 누설전류를 가지는 물질의 개발이 중요한 이슈가 되고 있다. 본 실험실에서는 Si 기판위에 $HfO_2$ 를 바로 증착하는 경우, 기판의 Si 이박막내로 확산하여 유전율이 저하되는 문제점을 인식하고, 기판과 $HfO_2$ 사이에 $AlO_x$를 방지막으로 사용하였다. 이 때, $AlO_x$의 Al precursor 는 TMA 로 고정하고, 산화제로는 $H_2O, O_2$-plasma, O_3$ 를 각각 사용하였다. 모든 $AlO_x/HfO_y$ 박막에서 매우 우수한 누설전류특성을 얻을 수 있었는데, 특히 $O_3$ 를 산화제로 사용한 $AlO_x$ 방지막의 경우 가장 우수한 특성을 보였다. 또한 질소 분위기에서 $800^{\circ}C$ 10 분간 열처리한 후, 방지막을 사용한 모든 경우에서 보다 향상된 열적 안정성을 관찰할 수 있었다.

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Phase Evolution, Microstructure and Microwave Dielectric Properties of Zn1.9-2xLixAlxSi1.05O4 Ceramics

  • Kim, Yun-Han;Kim, Shin;Jeong, Seong-Min;Kim, So-Jung;Yoon, Sang-Ok
    • 한국세라믹학회지
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    • 제52권3호
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    • pp.215-220
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    • 2015
  • Phase evolution, microstructure, and microwave dielectric properties of $Li_2O$ and $Al_2O_3$ doped $Zn_{1.9}Si_{1.05}O_4$, i.e., $Zn_{1.9-2x}Li_xAl_x-Si_{1.05}O_4$, ceramics (x = 0.02 ~ 0.10) were investigated. The ceramics were densified by $SiO_2$-rich liquid phase composed of the Li-Al-Si-O system, indicating that doped Li and Al contributed to the formation of the liquid. As the secondary phase, ${\beta}$-spodumene solid solution with the composition of $LiAlSi_3O_8$ was precipitated from the liquid during the cooling process. The dense ceramics were obtained for the specimens of $$x{\geq_-}0.06$$ showing the rapid densification above $1000^{\circ}C$, implying that a certain amount of liquid is necessary to densify. The specimen of x = 0.06 sintered at $1050^{\circ}C$ exhibited good microwave dielectric properties; the dielectric constant and the quality factor ($Q{\times}f_0$) were 6.4 and 11,213 GHz, respectively.

Optical and Electrical Properties of $Ti_xSi_{1-x}O_y$ Films

  • Lim, Jung-Wook;Yun, Sun-Jin;Kim, Je-Ha
    • ETRI Journal
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    • 제31권6호
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    • pp.675-679
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    • 2009
  • $Ti_xSi_{1-x}O_y$ (TSO) thin films are fabricated using plasma-enhanced atomic layer deposition. The Ti content in the TSO films is controlled by adjusting the sub-cycle ratio of $TiO_2$ and $SiO_2$. The refractive indices of $SiO_2$ and $TiO_2$ are 1.4 and 2.4, respectively. Hence, tailoring of the refractivity indices from 1.4 to 2.4 is feasible. The controllability of the refractive index and film thickness enables application of an antireflection coating layer to TSO films for use as a thin film solar cell. The TSO coating layer on an Si wafer dramatically reduces reflectivity compared to a bare Si wafer. In the measurement of the current-voltage characteristics, a nonlinear coefficient of 13.6 is obtained in the TSO films.

HfO2/Hf/Si MOS 구조에서 나타나는 HfO2 박막의 물성 및 전기적 특성 (Electrical and Material Characteristics of HfO2 Film in HfO2/Hf/Si MOS Structure)

  • 배군호;도승우;이재성;이용현
    • 한국전기전자재료학회논문지
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    • 제22권2호
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    • pp.101-106
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    • 2009
  • In this paper, Thin films of $HfO_2$/Hf were deposited on p-type wafer by Atomic Layer Deposition (ALD). We studied the electrical and material characteristics of $HfO_2$/Hf/Si MOS capacitor depending on thickness of Hf metal layer. $HfO_2$ films were deposited using TEMAH and $O_3$ at $350^{\circ}C$. Samples were then annealed using furnace heating to $500^{\circ}C$. Round-type MOS capacitors have been fabricated on Si substrates with $2000\;{\AA}$-thick Pt top electrodes. The composition rate of the dielectric material was analyzed using TEM (Transmission Electron Microscopy), XRD (X-ray Diffraction) and XPS (X-ray Photoelectron Spectroscopy). Also the capacitance-voltage (C-V), conductance-voltage (G-V), and current-voltage (I-V) characteristics were measured. We calculated the density of oxide trap charges and interface trap charges in our MOS device. At the interface between $HfO_2$ and Si, both Hf-Si and Hf-Si-O bonds were observed, instead of Si-O bond. The sandwiched Hf metal layer suppressed the growing of $SiO_x$ layer so that $HfSi_xO_y$ layer was achieved. And finally, the generation of both oxide trap charge and interface trap charge in $HfO_2$ film was reduced effectively by using Hf metal layer.

구형 단분산 실리카 분말을 이용한 SiOx 음극활물질 제조 및 형상조절 기술 (Fabrication of SiOx Anode Active Materials Using Spherical Silica Powder and Shape Control Technology)

  • 권주찬;오복현;이상진
    • 한국재료학회지
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    • 제33권12호
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    • pp.530-536
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    • 2023
  • The theoretical capacity of silicon-based anode materials is more than 10 times higher than the capacity of graphite, so silicon can be used as an alternative to graphite anode materials. However, silicon has a much higher contraction and expansion rate due to lithiation of the anode material during the charge and discharge processes, compared to graphite anode materials, resulting in the pulverization of silicon particles during repeated charge and discharge. To compensate for the above issues, there is a growing interest in SiOx materials with a silica or carbon coating to minimize the expansion of the silicon. In this study, spherical silica (SiO2) was synthesized using TEOS as a starting material for the fabrication of such SiOx through heating in a reduction atmosphere. SiOx powder was produced by adding PVA as a carbon source and inducing the reduction of silica by the carbothermal reduction method. The ratio of TEOS to distilled water, the stirring time, and the amount of PVA added were adjusted to induce size and morphology, resulting in uniform nanosized spherical silica particles. For the reduction of the spherical monodisperse silica particles, a nitrogen gas atmosphere mixed with 5 % hydrogen was applied, and oxygen atoms in the silica were selectively removed by the carbothermal reduction method. The produced SiOx powder was characterized by FE-SEM to examine the morphology and size changes of the particles, and XPS and FT-IR were used to examine the x value (O/Si ratio) of the synthesized SiOx.

Si 나노입자에서 shell이 전기화학적 특성에 미치는 영향 (Influence of Shell on the Electrochemical Properties of Si Nanoparticle)

  • 이정은;구정분;장보윤;김성수
    • 한국전기전자재료학회논문지
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    • 제29권4호
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    • pp.255-262
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    • 2016
  • Effects of $SiO_x$ or C shells on electrochemical properties of Si nanoparticles were investigated. $SiO_x$ shells with thickness of 10~15 nm were formed on homogeneously crystalline Si nanoparticles. Incase of Si-C nanoparticles, there were 30~40 layers of C with a number of defects. Li-ion batteries were fabricated with the above-mentioned nanoparticles, and their electrochemical properties were measured. Pristine Si shows a high IRC (initial reversible capacity) of 2,517 mAh/g and ICE (initial columbic efficiency) of 87%, but low capacity retention of 22%, respectively. $SiO_x$ shells decreased IRC (1,534 mAh/g) and ICE (54%), while the retention increased up to 65%, which can be explained by irreversible phases such as $LiO_2$ and $Li_2SiO_3$. C shells exhibited no differences in IRC and ICE compared to the pristine Si but an enhanced retention of 54%, which might be from proper defect structures.

Si Nanodot 배열의 형성을 위한 NbOx 나노기둥 마스크의 식각 특성 (Etch Characteristics of NbOx Nanopillar Mask for the Formation of Si Nanodot Arrays)

  • 박익현;이장우;정지원
    • 공업화학
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    • 제17권3호
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    • pp.327-330
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    • 2006
  • Si nanodot 배열을 형성하기 위하여 $NbO_{x}$ nanopillar를 건식식각 공정의 식각마스크로써 이용하기 위한 가능성이 조사되었다. $NbO_{x}$ nanopillar는 Al과 Nb의 양극산화 공정을 이용하여 준비되었다. $NbO_{x}$ nanopillar의 식각속도와 식각프로파일은 고밀도 플라즈마를 이용한 반응성 이온 식각법에 의해서 식각가스의 농도와 coil rf power, 그리고 dc bias voltage를 각각 변화시키면서 조사 되었다. $Cl_{2}$ 가스의 농도가 증가할수록 $NbO_{x}$ nanopillar의 식각속도는 감소하였고 coil rf power와 dc bias voltage의 증가는 식각속도의 상승을 초래했다. 선택된 식각조건에서 식각시간을 변화하여 $NbO_{x}$ nanopillar의 식각특성 및 식각메커니즘이 조사되었다.