• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1349-1352
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• 2005

This paper is to investigate a defect for thermal barrier coating layers by acoustic emission method in 4-point bending test. The two-layer thermal barrier coating is composed of $150\mu{m}\;CoNiCrAlY\;bond\;coating\;by\;vacuum\;plasma\;spray(VPS)\;process\;and\;250\mu{m}\;ZrO_2-8wt%Y_2O_3$ ceramic coating layer by air plasma spray(APS) process on Inconel-718. The specimen prepared by cyclic thermal test(500, 1000, 2000cycle) at $1050^{\circ}C$ The AE monitoring system is composed of PICO type sensor, a wide band pre-amplifier(40dB), PC and AE DSP(16/32 PAC) board. The AE event, amplitude, Cumulative energy and count of coating specimens is evaluated according to cyclic thermal test.

• Applied Science and Convergence Technology
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• v.26 no.5
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• pp.133-138
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• 2017

We investigated the interface defect engineering and reaction mechanism of reduced transition layer and nitride layer in the active plasma process on 4H-SiC by the plasma reaction with the rapid processing time at the room temperature. Through the combination of experiment and theoretical studies, we clearly observed that advanced active plasma process on 4H-SiC of oxidation and nitridation have improved electrical properties by the stable bond structure and decrease of the interfacial defects. In the plasma oxidation system, we showed that plasma oxide on SiC has enhanced electrical characteristics than the thermally oxidation and suppressed generation of the interface trap density. The decrease of the defect states in transition layer and stress induced leakage current (SILC) clearly showed that plasma process enhances quality of $SiO_2$ by the reduction of transition layer due to the controlled interstitial C atoms. And in another processes, the Plasma Nitridation (PN) system, we investigated the modification in bond structure in the nitride SiC surface by the rapid PN process. We observed that converted N reacted through spontaneous incorporation the SiC sub-surface, resulting in N atoms converted to C-site by the low bond energy. In particular, electrical properties exhibited that the generated trap states was suppressed with the nitrided layer. The results of active plasma oxidation and nitridation system suggest plasma processes on SiC of rapid and low temperature process, compare with the traditional gas annealing process with high temperature and long process time.

• Korean Journal of Materials Research
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• v.28 no.9
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• pp.511-515
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• 2018

W-10 wt% Ti alloys that have a homogeneous microstructure are prepared by thermal decomposition of $WO_3-TiH_2$ powder mixtures and spark plasma sintering. The reduction and dehydrogenation behavior of $WO_3$ and $TiH_2$ are analyzed by temperature programmed reduction and a thermogravimetric method, respectively. The X-ray diffraction analysis of the powder mixture, heat-treated in an argon atmosphere, shows W- oxides and $TiO_2$ peaks. Conversely, the powder mixtures heated in a hydrogen atmosphere are composed of W, $WO_2$ and $TiO_2$ phases at $600^{\circ}C$ and W and W-rich ${\beta}$ phases at $800^{\circ}C$. The densified specimen by spark plasma sintering at $1500^{\circ}C$ in a vacuum using hydrogen-reduced $WO_3-TiH_2$ powder mixtures shows a Vickers hardness value of 4.6 GPa and a homogeneous microstructure with pure W, ${\beta}$ and Ti phases. The phase evolution dependent on the atmosphere and temperature is explained by the thermal decomposition and reaction behavior of $WO_3$ and $TiH_2$.

• Journal of the Korean Vacuum Society
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• v.19 no.3
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• pp.230-235
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• 2010

In this paper, we controlled the deposition rate and reflective index with process conditions that are TCP power, gas flow ratio and bias for optical properties of $SiO_2$ thin film using TCP-CVD equipment. We obtained a excellent $SiO_2$ thin film which has a excellent uniformity (<1 [%]), deposition rate (0.28 [${\mu}m$/ min]) and reflective index (1.4610-1.4621) within 4" wafer with process conditions ($SiH_4:O_2$=50 : 100 [sccm], TCP power 1 [kW], bias 200 [W]) at [$300^{\circ}C$].

• Journal of the Korean Vacuum Society
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• v.17 no.1
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• pp.16-22
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• 2008

We studied plasma etching of polycarbonate in $O_2/SF_6$, $O_2/N_2$ and $O_2/CH_4$. A capacitively coupled plasma system was employed for the research. For patterning, we used a photolithography method with UV exposure after coating a photoresist on the polycarbonate. Main variables in the experiment were the mixing ratio of $O_2$ and other gases, and RF chuck power. Especially, we used only a mechanical pump for in order to operate the system. The chamber pressure was fixed at 100 mTorr. All of surface profilometry, atomic force microscopy and scanning electron microscopy were used for characterization of the etched polycarbonate samples. According to the results, $O_2/SF_6$ plasmas gave the higher etch rate of the polycarbonate than pure $O_2$ and $SF_6$ plasmas. For example, with maintaining 100W RF chuck power and 100 mTorr chamber pressure, 20 sccm $O_2$ plasma provided about $0.4{\mu}m$/min of polycarbonate etch rate and 20 sccm $SF_6$ produced only $0.2{\mu}m$/min. However, the mixed plasma of 60 % $O_2$ and 40 % $SF_6$ gas flow rate generated about $0.56{\mu}m$ with even low -DC bias induced compared to that of $O_2$. More addition of $SF_6$ to the mixture reduced etch of polycarbonate. The surface roughness of etched polycarbonate was roughed about 3 times worse measured by atomic force microscopy. However examination with scanning electron microscopy indicated that the surface was comparable to that of photoresist. Increase of RF chuck power raised -DC bias on the chuck and etch rate of polycarbonate almost linearly. The etch selectivity of polycarbonate to photoresist was about 1:1. The meaning of these results was that the simple capacitively coupled plasma system can be used to make a microstructure on polymer with $O_2/SF_6$ plasmas. This result can be applied to plasma processing of other polymers.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.06a
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• pp.40-41
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• 1996

Nitridation technique has been receiving much attention for the formation of a thin nitrided buffer layer on which high quality nitride films can be formedl. Particularly, gallium nitride (GaN) has been considered as a promising material for blue-and ultraviolet-emitting devices. It can also be used for in situ formed and stable passivation layers for selective growth of $GaAs_2$. In this work, formation of a thin nitrided layer is investigated. Nitrogen electron cyclotron resonance(ECR)-plasma is employed for the formation of thin nitrided layer. The plasma source used in this work is a compact ECR plasma gun3 which is specifically designed to enhance control, and to provide in-situ monitoring of plasma parameters during plasma-assisted processing. Microwave power of 100-200 W was used to excite the plasma which was emitted from an orifice of 25 rnm in diameter. The substrate were positioned 15 em away from the orifice of plasma source. Prior to nitridation is performed, the surface of n-type (001)GaAs was exposed to hydrogen plasma for 20 min at $300{\;}^{\circ}C$ in order to eliminate a native oxide formed on GaAs surface. Change from ring to streak in RHEED pattern can be obtained through the irradiation of hydrogen plasma, indicating a clean surface. Nitridation was carried out for 5-40 min at $RT-600{\;}^{\circ}C$ in a ECR plasma-assisted molecular beam epitaxy system. Typical chamber pressure was $7.5{\times}lO^{-4}$ Torr during the nitridations at $N_2$ flow rate of 10 seem.(omitted)mitted)

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.129-135
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• 2005

In this study, we have analyzed the removal efficiencies of $SO_2$ and $SO_2/NO$ by the pulsed corona discharge process and investigated the effects of several process variables on those removal efficiencies systematically. The effects of process variables such as applied voltage, pulse frequency, residence time, and initial concentrations of reactants (NO, $SO_2$, $NH_3$, $H_2O$, and $O_2$) on the removal efficiency were analyzed. As the applied voltage, the pulse frequency or the residence time increases or as the $O_2$ or the $H_2O$ or the $NH_3$ concentration in the inlet feed gas stream increases, the $SO_2$ removal efficiencies and the simultaneous removal efficiencies of $SO_2/NO$ also increase. These experimental results can be used as a basis to design the pulsed corona discharge process to remove $NO_x$ and $SO_x$.

• Journal of Welding and Joining
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• v.21 no.4
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• pp.46-55
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• 2003

TiO$_2$-WO$_3$(8.2wt%) coatings were prepared by the APS (Atmospheric Plasma Spraying) process to clarify the relationship between the process parameters(H$_2$ gas flow rate of plasma 2nd gas and spraying distance) of the APS coating and photo-decomposition efficiency kinetics of the MB(methylene blue) aqueous solution decomposition and to understand the effect of addition of WO$_3$ on photocatalytic properties of TiO$_2$ sprayed coating. Further, the temperature and velocity of flying particles were measured by DPV-2000 to investigate the relationship between microstructure of coatings and process parameters. Properties of coatins were investigated by XRD, SEM, XPS, RAMAN, UV/VIS spectrometer. In case of the TiO$_2$-WO$_3$(8.2wt%) coating, it had a lower anatase fraction than that of pure-TiO$_2$ coatings because of flying in the higher temperature plasma plume by the heavy weight of TiO$_2$, WO$_3$. And, when WO$_3$ added powders were spayed, the doping effects of W ions substituted into the Ti ion sites was not occured during melting and solidification cycles of spraying. It was found that the addition of WO$_3$ was ineffective effective on increasing photo-decomposition efficiency of TiO$_2$ sprayed coating.

• Journal of Powder Materials
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• v.16 no.3
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• pp.185-190
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• 2009

Fe-Cr steels are the most promising candidate for interconnect in solid oxide fuel cells. In this study, an effective, dense and well adherent (LaSr)(CrCo)$O_3$ [LSCC] coating layer was produced onto 430 stainless steel (STS-430) by atmospheric plasma spraying and the oxidation behavior as well as electrical properties of the LSCC coated STS-430 were investigated. A significant oxidation of pristine STS-430 occurred at $800^{\circ}C$ in air environment, leading to the formation of $Cr_2O_3$ and $FeCr_2O_4$ scale layer up to ${\sim}7{\mu}m$ after 1200h, and consequently increased an area specific resistance of $330\;m{\Omega}{\cdot}cm^2$. Although the plasma sprayed LSCC coating contained the characteristic pore network, the coated samples presented apparent advantages in reducing oxidation growth of STS-430, resulting a decrease in oxide scale thickness of ${\sim}1{\mu}m$ at $800^{\circ}C$ after 1200h. The area specific resistance of the LSCC coated STS-430 was much reduced to ${\sim}7\;m{\Omega}{\cdot}cm^2$ after exposure at $800^{\circ}C$ for 1200h, compared to that of the pristine STS-403.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.198.2-198.2
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• 2016

Reactive oxygen and nitrogen species (RONS) can be generated by using non-thermal atmospheric pressure plasma jet which have profound biomedical applications [1, 2]. In this work, reactive oxygen species like hydroxyl radical (OH) are generated by using non-thermal direct plasma jet above water surface using Ar gas and their properties have been studied using ultraviolet absorption spectroscopy. OH radicals are found to be generated simultaneously with the discharge current with concentration of $2.7{\times}1015/cm3$ at 7mm above water surface while their persistence time have been measured to be $2.8{\mu}S$. In addition, it has been shown that plasma initiated ultraviolets play a major role to generate RONS inside water. Further works are going on to measure the temporal behavior of OH and $O2^*-$.